FR2690040B1 - Radiateur du type à tube à évacuation de chaleur pour un dispositif électronique. - Google Patents

Radiateur du type à tube à évacuation de chaleur pour un dispositif électronique.

Info

Publication number
FR2690040B1
FR2690040B1 FR9303680A FR9303680A FR2690040B1 FR 2690040 B1 FR2690040 B1 FR 2690040B1 FR 9303680 A FR9303680 A FR 9303680A FR 9303680 A FR9303680 A FR 9303680A FR 2690040 B1 FR2690040 B1 FR 2690040B1
Authority
FR
France
Prior art keywords
heat
electronic device
tube type
evacuated tube
type radiator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9303680A
Other languages
English (en)
Other versions
FR2690040A1 (fr
Inventor
Suemi Tanaka
Junji Sotani
Kenichi Nanba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of FR2690040A1 publication Critical patent/FR2690040A1/fr
Application granted granted Critical
Publication of FR2690040B1 publication Critical patent/FR2690040B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FR9303680A 1992-03-31 1993-03-30 Radiateur du type à tube à évacuation de chaleur pour un dispositif électronique. Expired - Fee Related FR2690040B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10538292 1992-03-31
JP5054804A JPH0629683A (ja) 1992-03-31 1993-02-19 電子機器用ヒートパイプ式放熱ユニット

Publications (2)

Publication Number Publication Date
FR2690040A1 FR2690040A1 (fr) 1993-10-15
FR2690040B1 true FR2690040B1 (fr) 1995-04-07

Family

ID=26395615

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9303680A Expired - Fee Related FR2690040B1 (fr) 1992-03-31 1993-03-30 Radiateur du type à tube à évacuation de chaleur pour un dispositif électronique.

Country Status (4)

Country Link
US (1) US5409055A (fr)
JP (1) JPH0629683A (fr)
DE (1) DE4310556A1 (fr)
FR (1) FR2690040B1 (fr)

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TW572246U (en) * 2001-07-26 2004-01-11 Jiun-Fu Liou Heat dissipating module with a self rapid heat conduction
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Also Published As

Publication number Publication date
FR2690040A1 (fr) 1993-10-15
DE4310556A1 (de) 1993-10-07
US5409055A (en) 1995-04-25
JPH0629683A (ja) 1994-02-04

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