FR2675005B1 - Sous-ensemble a glisser en place dans des boitiers, impermeables aux hautes frequences, d'appareils electroniques. - Google Patents

Sous-ensemble a glisser en place dans des boitiers, impermeables aux hautes frequences, d'appareils electroniques.

Info

Publication number
FR2675005B1
FR2675005B1 FR9204116A FR9204116A FR2675005B1 FR 2675005 B1 FR2675005 B1 FR 2675005B1 FR 9204116 A FR9204116 A FR 9204116A FR 9204116 A FR9204116 A FR 9204116A FR 2675005 B1 FR2675005 B1 FR 2675005B1
Authority
FR
France
Prior art keywords
sub
sliding
assembly
place
electronic devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9204116A
Other languages
English (en)
Other versions
FR2675005A1 (fr
Inventor
Gunther Hans-Ulrich
Joist Michael
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schroff GmbH
Original Assignee
Schroff GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schroff GmbH filed Critical Schroff GmbH
Publication of FR2675005A1 publication Critical patent/FR2675005A1/fr
Application granted granted Critical
Publication of FR2675005B1 publication Critical patent/FR2675005B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/0015Gaskets or seals
    • H05K9/0016Gaskets or seals having a spring contact

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Casings For Electric Apparatus (AREA)
FR9204116A 1991-04-04 1992-04-03 Sous-ensemble a glisser en place dans des boitiers, impermeables aux hautes frequences, d'appareils electroniques. Expired - Fee Related FR2675005B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4110800A DE4110800C1 (fr) 1991-04-04 1991-04-04

Publications (2)

Publication Number Publication Date
FR2675005A1 FR2675005A1 (fr) 1992-10-09
FR2675005B1 true FR2675005B1 (fr) 1994-06-03

Family

ID=6428755

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9204116A Expired - Fee Related FR2675005B1 (fr) 1991-04-04 1992-04-03 Sous-ensemble a glisser en place dans des boitiers, impermeables aux hautes frequences, d'appareils electroniques.

Country Status (5)

Country Link
US (1) US5233507A (fr)
JP (1) JPH0697716B2 (fr)
DE (1) DE4110800C1 (fr)
FR (1) FR2675005B1 (fr)
GB (1) GB2254490B (fr)

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DE29619565U1 (de) * 1996-11-11 1997-12-18 Siemens AG, 80333 München Baugruppenträger für Leiterplatten mit abgeschirmter Front- und Rückseite
US5796594A (en) * 1997-04-01 1998-08-18 Ag Communication Systems Corporation Interlocking circuit card faceplate for reduced EMI emissions
DE29713620U1 (de) * 1997-07-31 1997-10-16 Siemens AG, 80333 München Kontaktelement zur Schirmübertragung
US5952608A (en) * 1997-08-11 1999-09-14 Kim; Sun-Ki Finger strip for shielding electromagnetic wave and front panel assembly mounting the same
FI973541A (fi) * 1997-08-28 1999-03-01 Nokia Telecommunications Oy Häiriönsuojajousi elektronisen välineen sähkömagneettiseksi suojaamiseksi
GB2331404B (en) * 1997-11-12 2002-05-22 Vero Electronics Ltd Electrical contacts for housings
US6390320B2 (en) * 1998-04-29 2002-05-21 Cisco Technology, Inc. Easily installable and removable electro-magnetic interference shielding faceplate
US6395976B1 (en) * 1998-08-31 2002-05-28 3Com Corporation Apparatus and method for aligning a circuit board assembly in an electronic chassis
DE29817537U1 (de) * 1998-10-01 1999-11-18 Siemens AG, 80333 München Kontaktfederleiste zum Aufstecken auf eine Halteleiste, und Kontaktteil mit Kontaktfederleiste und Halteleiste, insbesondere Frontplatte einer Flachbaugruppe
CN1247061C (zh) 1998-10-01 2006-03-22 里塔尔电子系统两合公司 弹性接触压板及具有弹性接触压板和固定板的接触件
US6283770B1 (en) * 1998-12-11 2001-09-04 Cisco Technology, Incc. Minimal intrusion EMI shielding clip to maintain electrical contact between two parallel surfaces
DE29906262U1 (de) * 1999-04-08 1999-07-15 Hermann Stahl GmbH, 71723 Großbottwar Federelement
US6115263A (en) * 1999-04-09 2000-09-05 3Com Corporation Panel having fingers adapted to retain printed circuit board modular device carrier assembly
US6282101B1 (en) * 1999-05-11 2001-08-28 Lucent Technologies Inc. EMI/ESD shielding assembly for an electronic system
US6229715B1 (en) * 1999-11-15 2001-05-08 Lucent Technologies, Inc. Circuit card guide assembly
TW486043U (en) 2000-11-16 2002-05-01 Delta Electronics Inc Fast removable fan shield and mounting plate
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US6659655B2 (en) 2001-02-12 2003-12-09 E20 Communications, Inc. Fiber-optic modules with housing/shielding
US6478170B1 (en) * 2001-06-08 2002-11-12 Terraworx, Inc. EMC sealed joint and a faceplate for use therewith
DE10137746C1 (de) * 2001-08-01 2002-10-10 Schroff Gmbh Frontteil für elektronische Steckbaugruppen
US6676137B2 (en) * 2002-02-27 2004-01-13 Hewlett-Packard Development Company, L.P. Snap-on EMI gasket clip and method of sealing a computer chassis from EMI
US7619169B1 (en) 2003-08-08 2009-11-17 Cisco Technologies, Inc. Method and apparatus for reducing electromagnetic radiated emissions from a chassis
US7238893B2 (en) * 2003-09-22 2007-07-03 Hewlett-Packard Development Company, L.P. Expandable electromagnetic interference (EMI) gasket mechanism
US7054166B1 (en) * 2003-12-03 2006-05-30 Unisys Corporation Apparatus and method for EMI shielding
US20050148230A1 (en) * 2004-01-07 2005-07-07 Flynn James D. Coupling device that includes opposing pawls engagable into opposing pawl catches
US7506768B2 (en) * 2004-10-15 2009-03-24 American Power Conversion Corporation Blanking panel for equipment rack or enclosure
US20070052100A1 (en) * 2005-09-07 2007-03-08 Nokia Corporation Spring clip for a portable electronic device
DE102006026477A1 (de) * 2006-06-07 2007-12-13 Siemens Ag Massekontaktelement
US7507120B1 (en) 2007-11-29 2009-03-24 Tyco Electronics Corporation Shielding element for an electrical connector module assembly
US7946854B2 (en) 2009-07-21 2011-05-24 Tyco Electronics Corporation Electrical connector assembly having shield member
JP5557764B2 (ja) * 2011-02-02 2014-07-23 三菱電機株式会社 電磁シールド構造
US10455744B2 (en) 2016-07-31 2019-10-22 Ilone Grinberg Extendible barrier

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Also Published As

Publication number Publication date
GB2254490B (en) 1994-10-26
GB2254490A (en) 1992-10-07
JPH05183287A (ja) 1993-07-23
US5233507A (en) 1993-08-03
JPH0697716B2 (ja) 1994-11-30
FR2675005A1 (fr) 1992-10-09
GB9206642D0 (en) 1992-05-06
DE4110800C1 (fr) 1992-07-23

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Effective date: 20081231