FR2663811B1 - Boitier a connecteur, plaque frontale et refroidisseur pour un circuit electronique. - Google Patents

Boitier a connecteur, plaque frontale et refroidisseur pour un circuit electronique.

Info

Publication number
FR2663811B1
FR2663811B1 FR9107601A FR9107601A FR2663811B1 FR 2663811 B1 FR2663811 B1 FR 2663811B1 FR 9107601 A FR9107601 A FR 9107601A FR 9107601 A FR9107601 A FR 9107601A FR 2663811 B1 FR2663811 B1 FR 2663811B1
Authority
FR
France
Prior art keywords
electronic circuit
faceplate
cooling
cooler
front plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9107601A
Other languages
English (en)
French (fr)
Other versions
FR2663811A1 (fr
Inventor
Gerhard Klein
Dieter Hussmann
Dieter Karr
Karl Schupp
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of FR2663811A1 publication Critical patent/FR2663811A1/fr
Application granted granted Critical
Publication of FR2663811B1 publication Critical patent/FR2663811B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Motor Or Generator Frames (AREA)
  • Motor Or Generator Cooling System (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
FR9107601A 1990-06-20 1991-06-20 Boitier a connecteur, plaque frontale et refroidisseur pour un circuit electronique. Expired - Fee Related FR2663811B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE9006916U DE9006916U1 (de) 1990-06-20 1990-06-20 Gehäuse für eine elektronische Schaltung

Publications (2)

Publication Number Publication Date
FR2663811A1 FR2663811A1 (fr) 1991-12-27
FR2663811B1 true FR2663811B1 (fr) 1993-10-01

Family

ID=6854803

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9107601A Expired - Fee Related FR2663811B1 (fr) 1990-06-20 1991-06-20 Boitier a connecteur, plaque frontale et refroidisseur pour un circuit electronique.

Country Status (4)

Country Link
US (1) US5140500A (enExample)
JP (1) JPH0496893U (enExample)
DE (1) DE9006916U1 (enExample)
FR (1) FR2663811B1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4327584A1 (de) * 1993-08-17 1995-02-23 Bayerische Motoren Werke Ag Elektrische Antriebseinheit
JP3248480B2 (ja) * 1998-01-22 2002-01-21 住友電装株式会社 配電ボックス
US6239972B1 (en) * 1999-12-13 2001-05-29 Honeywell International Inc. Integrated convection and conduction heat sink for multiple mounting positions
JP3958589B2 (ja) * 2002-01-23 2007-08-15 株式会社オートネットワーク技術研究所 電気接続箱
JP3744531B1 (ja) * 2004-05-07 2006-02-15 住友電装株式会社 太陽電池モジュール用端子ボックス及び整流素子ユニット
JP3767618B2 (ja) * 2004-08-19 2006-04-19 住友電装株式会社 太陽電池モジュール用端子ボックス

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3502584A1 (de) * 1985-01-26 1986-07-31 Hans-Dieter 7121 Gemmrigheim Layh Elektronisches geraet
DE8622759U1 (de) * 1986-08-25 1986-12-18 Siemens AG, 1000 Berlin und 8000 München Baugruppenmagazin mit einer Stromversorgung für einschiebbare elektrische Baugruppen
DE3712235A1 (de) * 1987-04-10 1988-10-27 Hella Kg Hueck & Co Steuergeraet
SE460008B (sv) * 1987-11-04 1989-08-28 Saab Scania Ab Kylkropp foer ett elektriskt kretskort samt anvaendning daerav

Also Published As

Publication number Publication date
JPH0496893U (enExample) 1992-08-21
FR2663811A1 (fr) 1991-12-27
US5140500A (en) 1992-08-18
DE9006916U1 (de) 1991-10-24

Similar Documents

Publication Publication Date Title
AU675176B2 (en) Arrangement for the conduction away of heat and a process for the production thereof
US4887147A (en) Thermal package for electronic components
US6180436B1 (en) Method for removing heat from a flip chip semiconductor device
US6892796B1 (en) Apparatus and method for mounting a power module
EP0968885A3 (en) Cooling an engine control unit
CA2074436A1 (fr) Dissipateur thermique
EP0777275A3 (en) Semiconductor module with heat sink
EP0863696A3 (en) Electronic unit
EP0684645A3 (en) EMF shielding of an integrated circuit package
US5031028A (en) Heat sink assembly
ES1021752U (es) Regulador de potencia para motores de ventilador.
EP0295387A3 (en) Package for heat dissipation of electronic components
GB2319598A (en) A cooling system for integrated circuit chips in electronic systems
CA2218215A1 (en) Temperature regulating laser diode assembly
CA2429774C (en) Housings for circuit cards
FR2663811B1 (fr) Boitier a connecteur, plaque frontale et refroidisseur pour un circuit electronique.
DE59702416D1 (de) Bauelementträger mit luft-umwälzkühlung der elektrischen bauelemente
DE59400021D1 (de) Einstückiges Kunststoffteil, insbesondere Spritzgiessteil.
US4753287A (en) Circuit board installation
US4720771A (en) Heat sink assembly for a circuit board mounted integrated circuit
US5532430A (en) Receiving housing for dissipator electronic components
JPH09326579A (ja) 冷却ユニットおよび該ユニットに用いるヒートシンク
GB1455001A (en) Heat sink assembly
EP0997938A3 (en) Multi-chip module
SE9502498D0 (sv) Cooling of heat-sensitive components

Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20100226