FR2656193A1 - Procede de montage d'un pave semi-conducteur sur un support de dissipation thermique et de connexion electrique. - Google Patents

Procede de montage d'un pave semi-conducteur sur un support de dissipation thermique et de connexion electrique. Download PDF

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Publication number
FR2656193A1
FR2656193A1 FR8617808A FR8617808A FR2656193A1 FR 2656193 A1 FR2656193 A1 FR 2656193A1 FR 8617808 A FR8617808 A FR 8617808A FR 8617808 A FR8617808 A FR 8617808A FR 2656193 A1 FR2656193 A1 FR 2656193A1
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France
Prior art keywords
block
assembly
support
metallized
assembled
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8617808A
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English (en)
French (fr)
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FR2656193B1 (US07498051-20090303-C00003.png
Inventor
Picault Robert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Societe Anonyme de Telecommunications SAT
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Societe Anonyme de Telecommunications SAT
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Priority to FR8617808A priority Critical patent/FR2656193A1/fr
Publication of FR2656193A1 publication Critical patent/FR2656193A1/fr
Application granted granted Critical
Publication of FR2656193B1 publication Critical patent/FR2656193B1/fr
Granted legal-status Critical Current

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Lasers (AREA)
FR8617808A 1986-12-19 1986-12-19 Procede de montage d'un pave semi-conducteur sur un support de dissipation thermique et de connexion electrique. Granted FR2656193A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8617808A FR2656193A1 (fr) 1986-12-19 1986-12-19 Procede de montage d'un pave semi-conducteur sur un support de dissipation thermique et de connexion electrique.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8617808A FR2656193A1 (fr) 1986-12-19 1986-12-19 Procede de montage d'un pave semi-conducteur sur un support de dissipation thermique et de connexion electrique.

Publications (2)

Publication Number Publication Date
FR2656193A1 true FR2656193A1 (fr) 1991-06-21
FR2656193B1 FR2656193B1 (US07498051-20090303-C00003.png) 1995-05-24

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FR8617808A Granted FR2656193A1 (fr) 1986-12-19 1986-12-19 Procede de montage d'un pave semi-conducteur sur un support de dissipation thermique et de connexion electrique.

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999023697A1 (de) * 1997-10-30 1999-05-14 Daimlerchrysler Ag Bauelement und verfahren zum herstellen des bauelements

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3986251A (en) * 1974-10-03 1976-10-19 Motorola, Inc. Germanium doped light emitting diode bonding process
FR2379165A1 (fr) * 1977-01-28 1978-08-25 Motorola Inc Procede de fabrication de semi-conducteurs
DE2714483A1 (de) * 1975-09-15 1978-10-12 Siemens Ag Verfahren zur teilautomatisierten kontaktierung von halbleitersystemen
EP0007873A1 (fr) * 1978-07-25 1980-02-06 Thomson-Csf Système de soudure d'un composant semiconducteur émetteur de lumière sur un socle métallique
JPS58121633A (ja) * 1982-01-12 1983-07-20 Mitsubishi Electric Corp 半導体装置
DE3231732A1 (de) * 1982-08-26 1984-03-01 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Elektrischer kontakt
EP0106598A2 (en) * 1982-10-08 1984-04-25 Western Electric Company, Incorporated Fluxless bonding of microelectronic chips

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3986251A (en) * 1974-10-03 1976-10-19 Motorola, Inc. Germanium doped light emitting diode bonding process
DE2714483A1 (de) * 1975-09-15 1978-10-12 Siemens Ag Verfahren zur teilautomatisierten kontaktierung von halbleitersystemen
FR2379165A1 (fr) * 1977-01-28 1978-08-25 Motorola Inc Procede de fabrication de semi-conducteurs
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US6334567B1 (en) 1997-10-30 2002-01-01 Daimlerchrysler Ag Component and method for production thereof

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