FR2646491B1 - Dispositif de liaison entre le corps et l'embout d'une pipette a vide - Google Patents

Dispositif de liaison entre le corps et l'embout d'une pipette a vide

Info

Publication number
FR2646491B1
FR2646491B1 FR8905942A FR8905942A FR2646491B1 FR 2646491 B1 FR2646491 B1 FR 2646491B1 FR 8905942 A FR8905942 A FR 8905942A FR 8905942 A FR8905942 A FR 8905942A FR 2646491 B1 FR2646491 B1 FR 2646491B1
Authority
FR
France
Prior art keywords
nozzle
connection device
vacuum pipette
pipette
vacuum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR8905942A
Other languages
English (en)
Other versions
FR2646491A1 (fr
Inventor
Bernard Poli
Gerard Chincholle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Recif SA
Original Assignee
Recif SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Recif SA filed Critical Recif SA
Priority to FR8905942A priority Critical patent/FR2646491B1/fr
Priority to EP19900907119 priority patent/EP0425634A1/fr
Priority to PCT/FR1990/000293 priority patent/WO1990012977A1/fr
Publication of FR2646491A1 publication Critical patent/FR2646491A1/fr
Application granted granted Critical
Publication of FR2646491B1 publication Critical patent/FR2646491B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16LPIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
    • F16L25/00Constructive types of pipe joints not provided for in groups F16L13/00 - F16L23/00 ; Details of pipe joints not otherwise provided for, e.g. electrically conducting or insulating means
    • F16L25/01Constructive types of pipe joints not provided for in groups F16L13/00 - F16L23/00 ; Details of pipe joints not otherwise provided for, e.g. electrically conducting or insulating means specially adapted for realising electrical conduction between the two pipe ends of the joint or between parts thereof
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25BTOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005Vacuum work holders
    • B25B11/007Vacuum work holders portable, e.g. handheld
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Devices For Use In Laboratory Experiments (AREA)
FR8905942A 1989-04-26 1989-04-26 Dispositif de liaison entre le corps et l'embout d'une pipette a vide Expired - Fee Related FR2646491B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR8905942A FR2646491B1 (fr) 1989-04-26 1989-04-26 Dispositif de liaison entre le corps et l'embout d'une pipette a vide
EP19900907119 EP0425634A1 (fr) 1989-04-26 1990-04-25 Dispositif de liaison entre le corps et l'embout d'une pipette a vide
PCT/FR1990/000293 WO1990012977A1 (fr) 1989-04-26 1990-04-25 Dispositif de liaison entre le corps et l'embout d'une pipette a vide

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8905942A FR2646491B1 (fr) 1989-04-26 1989-04-26 Dispositif de liaison entre le corps et l'embout d'une pipette a vide

Publications (2)

Publication Number Publication Date
FR2646491A1 FR2646491A1 (fr) 1990-11-02
FR2646491B1 true FR2646491B1 (fr) 1991-08-23

Family

ID=9381420

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8905942A Expired - Fee Related FR2646491B1 (fr) 1989-04-26 1989-04-26 Dispositif de liaison entre le corps et l'embout d'une pipette a vide

Country Status (3)

Country Link
EP (1) EP0425634A1 (fr)
FR (1) FR2646491B1 (fr)
WO (1) WO1990012977A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5280979A (en) * 1991-06-20 1994-01-25 Recif, S.A. Tip for a vacuum pipette with improved electrostatic discharge properties
JPH11505359A (ja) * 1995-05-19 1999-05-18 シーゲート テクノロジー,インコーポレイテッド ディスクドライブの組立に使用する器具のための電気接地システム
WO2012177900A1 (fr) 2011-06-22 2012-12-27 Research Triangle Institute, International Dispositif microélectronique bipolaire

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3244797A (en) * 1961-04-22 1966-04-05 Cedric H Watson Pipe joint structure incorporating electrical conductivity means
DE2631502A1 (de) * 1976-07-13 1978-01-19 Siemens Ag Greifwerkzeug fuer eine saugpinzette
FR2593424B1 (fr) * 1985-12-10 1989-07-21 Recif Sa Pipette a vide notamment pour le transfert de plaquettes de silicium

Also Published As

Publication number Publication date
EP0425634A1 (fr) 1991-05-08
WO1990012977A1 (fr) 1990-11-01
FR2646491A1 (fr) 1990-11-02

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Legal Events

Date Code Title Description
ST Notification of lapse