FR2605829A1 - Module thermoconducteur pour extraire localement la chaleur d'un composant electrique, notamment dans une installation de cartes de circuits imprimes et installation de cartes de circuits imprimes munie de tels modules - Google Patents

Module thermoconducteur pour extraire localement la chaleur d'un composant electrique, notamment dans une installation de cartes de circuits imprimes et installation de cartes de circuits imprimes munie de tels modules Download PDF

Info

Publication number
FR2605829A1
FR2605829A1 FR8714714A FR8714714A FR2605829A1 FR 2605829 A1 FR2605829 A1 FR 2605829A1 FR 8714714 A FR8714714 A FR 8714714A FR 8714714 A FR8714714 A FR 8714714A FR 2605829 A1 FR2605829 A1 FR 2605829A1
Authority
FR
France
Prior art keywords
piston
face
tubular casing
module according
electrical component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
FR8714714A
Other languages
English (en)
French (fr)
Inventor
David Horne
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Balfour Beatty PLC
Original Assignee
BICC PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BICC PLC filed Critical BICC PLC
Publication of FR2605829A1 publication Critical patent/FR2605829A1/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/235—Arrangements for cooling characterised by their places of attachment or cooling paths attached to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/242—Arrangements for cooling characterised by their places of attachment or cooling paths comprising thermal conductors between chips and the and the arrangements for cooling, e.g. compliant heat-spreaders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR8714714A 1986-10-24 1987-10-23 Module thermoconducteur pour extraire localement la chaleur d'un composant electrique, notamment dans une installation de cartes de circuits imprimes et installation de cartes de circuits imprimes munie de tels modules Pending FR2605829A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB868625472A GB8625472D0 (en) 1986-10-24 1986-10-24 Circuit board installation

Publications (1)

Publication Number Publication Date
FR2605829A1 true FR2605829A1 (fr) 1988-04-29

Family

ID=10606235

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8714714A Pending FR2605829A1 (fr) 1986-10-24 1987-10-23 Module thermoconducteur pour extraire localement la chaleur d'un composant electrique, notamment dans une installation de cartes de circuits imprimes et installation de cartes de circuits imprimes munie de tels modules

Country Status (4)

Country Link
JP (1) JPS6486541A (enExample)
DE (2) DE8714174U1 (enExample)
FR (1) FR2605829A1 (enExample)
GB (2) GB8625472D0 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4040288A1 (de) * 1990-12-17 1992-07-02 Ant Nachrichtentech Elektronik-baugruppe mit metallgehaeuse
DE9100467U1 (de) * 1991-01-16 1992-05-21 Robert Bosch Gmbh, 7000 Stuttgart Gehäuse eines elektrischen Steuergerätes
DE4104888C2 (de) * 1991-02-18 1994-09-08 Ant Nachrichtentech Elektronik-Baugruppe mit Metallgehäuse
DE4118398C2 (de) * 1991-06-05 1994-07-21 Ant Nachrichtentech Elektronik-Baugruppe mit Metallgehäuse
GB2259408A (en) * 1991-09-07 1993-03-10 Motorola Israel Ltd A heat dissipation device
DE4404035A1 (de) * 1994-02-09 1995-08-10 Sel Alcatel Ag Wärmeleitvorrichtung für elektrische Bauelemente
DE19901445C2 (de) * 1999-01-15 2002-07-11 Siemens Ag Halbleiter-Kühl-Anordnung
US6501658B2 (en) * 2001-02-16 2002-12-31 Intel Corporation Heatsink mounting with shock absorbers
DE10142975B4 (de) * 2001-09-01 2009-05-07 Conti Temic Microelectronic Gmbh Wärmeableitelement für elktronische Bauteile und Verfahren zum Anbringen desselben
US8024936B2 (en) 2004-11-16 2011-09-27 Halliburton Energy Services, Inc. Cooling apparatus, systems, and methods
US7699102B2 (en) 2004-12-03 2010-04-20 Halliburton Energy Services, Inc. Rechargeable energy storage device in a downhole operation
US7242593B2 (en) * 2005-07-08 2007-07-10 Ims Inc. Thermally efficient motor housing assembly
US8957316B2 (en) * 2010-09-10 2015-02-17 Honeywell International Inc. Electrical component assembly for thermal transfer
EP2634798A1 (de) * 2012-02-29 2013-09-04 Siemens Aktiengesellschaft Elektrische Vorrichtung mit Kühlgehäuse
EP2669943A1 (en) * 2012-05-28 2013-12-04 Alcatel Lucent Methods and apparatus for providing transfer of a heat load between a heat source and a heat receiver
EP2811515A1 (en) * 2013-06-07 2014-12-10 Alcatel Lucent Thermal connector and heat distribution device for a thermal connector
EP3098557B1 (en) * 2015-05-26 2019-03-27 Advantech Co., Ltd. Dynamic heat conduction system
US20240090131A1 (en) * 2022-09-14 2024-03-14 Hamilton Sundstrand Corporation Thermal management for flat no lead packages

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0006445A1 (en) * 1978-06-29 1980-01-09 International Business Machines Corporation Methods of fabricating electrical apparatus comprising one or more heat generating electrical components
EP0130279A2 (en) * 1983-03-25 1985-01-09 Mitsubishi Denki Kabushiki Kaisha Heat radiator assembly for cooling electronic parts

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4092697A (en) * 1976-12-06 1978-05-30 International Business Machines Corporation Heat transfer mechanism for integrated circuit package
US4249034A (en) * 1978-11-27 1981-02-03 General Electric Company Semiconductor package having strengthening and sealing upper chamber
US4246597A (en) * 1979-06-29 1981-01-20 International Business Machines Corporation Air cooled multi-chip module having a heat conductive piston spring loaded against the chips

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0006445A1 (en) * 1978-06-29 1980-01-09 International Business Machines Corporation Methods of fabricating electrical apparatus comprising one or more heat generating electrical components
EP0130279A2 (en) * 1983-03-25 1985-01-09 Mitsubishi Denki Kabushiki Kaisha Heat radiator assembly for cooling electronic parts

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
IBM TECHNICAL DISCLOSURE BULLETIN. vol. 20, no. 7, décembre 1977, NEW YORK US pages 2761 - 2762; R.C. CHU: "DESIGN FOR PROVIDING THERMAL INTERFACE BETWEEN NARROW THERMAL INTERFACE GAPS" *
TECHNICAL DIGEST - WESTERN ELECTRIC. no. 25, janvier 1972, NEW YORK US pages 39 - 40; N.E. HARWICK-BTL: "COMBINED HEAT CONDUCTOR AND PROTECTIVE TRANSISTOR PACKAGE" *

Also Published As

Publication number Publication date
GB2197538A (en) 1988-05-18
GB2197538B (en) 1990-04-04
GB8724682D0 (en) 1987-11-25
DE8714174U1 (de) 1988-03-03
GB8625472D0 (en) 1986-11-26
DE3735985C2 (enExample) 1992-10-15
JPS6486541A (en) 1989-03-31
DE3735985A1 (de) 1988-05-11

Similar Documents

Publication Publication Date Title
FR2605829A1 (fr) Module thermoconducteur pour extraire localement la chaleur d'un composant electrique, notamment dans une installation de cartes de circuits imprimes et installation de cartes de circuits imprimes munie de tels modules
CA1278878C (fr) Procede et dispositif de refroidissement d'un boitier de circuit integre
EP0195701A1 (fr) Agrafe multiple de fixation et dispositif de montage collectif de composants électroniques de puissance
EP0258312A1 (en) SUPPORT ARRANGEMENT FOR SEMICONDUCTOR COMPONENTS.
FR2952762A1 (fr) Ensemble de montage de contacteur avec caracteristiques thermiques ameliorees
EP2653021B1 (fr) Refroidissement d'un equipement electronique
FR2819372A1 (fr) Carte de circuit imprime a evaluation de chaleur
FR3064878A1 (fr) Dispositif de dissipation de chaleur d'un dispositif electronique
EP0054069A1 (en) Heat pin integrated circuit packaging
WO2000041448A1 (fr) Module electronique comportant des elements de refroidissement de composants electroniques
US4753287A (en) Circuit board installation
EP0470899B1 (fr) Diode à électrodes et à boítier assemblés sans soudure ni sertissage et pont redresseur réalisé avec de telles diodes
EP0064424B1 (fr) Dissipateur thermique pour circuit électronique de fer à repasser et fer à repasser s'y rapportant
FR2581250A1 (fr) Appareil et procede pour etablir une liaison thermique entre un boitier de semi-conducteur et la plaque de refroidissement et une liaison electrique entre les conducteurs du boitier, et un panneau de circuit imprime
FR2794299A1 (fr) Porte-balais a composant de commande pour alternateur de vehicule automobile
EP0015547A1 (fr) Montage de semiconducteurs de puissance refroidis par un fluide réfrigérant
FR2752109A1 (fr) Dissipateur pour pont redresseur d'alternateur de vehicule automobile, ensemble redresseur et alternateur comportant de tels dissipateurs
FR2909804A1 (fr) Connecteur electrique pour le raccordement d'un conducteur electrique a un composant electrique
FR2574991A3 (fr) Conditionnement pour circuits integres, ayant des possibilites de dissipation de chaleur ameliorees, et procede pour augmenter la dissipation de la chaleur
EP0425841B1 (fr) Assemblage de composants en électronique de puissance
FR2605481A1 (fr) Dispositif de refroidissement de composants electriques de puissance disposes dans un tiroir embrochable dans une baie
FR2617334A1 (fr) Dissipateur thermique pour circuit integre
FR2714565A1 (fr) Perfectionnements aux télécommandes.
FR3156236A1 (fr) Appareillage de protection à coupure électronique avec dissipateur thermique
FR3083958A1 (fr) Dispositif de dissipation thermique muni d'une plaque froide secondaire