FR2573325B1 - Appareil et procede pour faire des depots de vapeur sur des plaquettes - Google Patents

Appareil et procede pour faire des depots de vapeur sur des plaquettes

Info

Publication number
FR2573325B1
FR2573325B1 FR8516907A FR8516907A FR2573325B1 FR 2573325 B1 FR2573325 B1 FR 2573325B1 FR 8516907 A FR8516907 A FR 8516907A FR 8516907 A FR8516907 A FR 8516907A FR 2573325 B1 FR2573325 B1 FR 2573325B1
Authority
FR
France
Prior art keywords
wafers
vapor deposits
making vapor
making
deposits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR8516907A
Other languages
English (en)
Other versions
FR2573325A1 (fr
Inventor
Hisao Hayashi
Yasushi Morita
Mitsunari Noda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP24191884A external-priority patent/JPS61122196A/ja
Priority claimed from JP59241917A external-priority patent/JPS61122194A/ja
Application filed by Sony Corp filed Critical Sony Corp
Publication of FR2573325A1 publication Critical patent/FR2573325A1/fr
Application granted granted Critical
Publication of FR2573325B1 publication Critical patent/FR2573325B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
FR8516907A 1984-11-16 1985-11-15 Appareil et procede pour faire des depots de vapeur sur des plaquettes Expired - Fee Related FR2573325B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP24191884A JPS61122196A (ja) 1984-11-16 1984-11-16 気相反応装置
JP59241917A JPS61122194A (ja) 1984-11-16 1984-11-16 気相反応装置

Publications (2)

Publication Number Publication Date
FR2573325A1 FR2573325A1 (fr) 1986-05-23
FR2573325B1 true FR2573325B1 (fr) 1993-08-20

Family

ID=26535513

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8516907A Expired - Fee Related FR2573325B1 (fr) 1984-11-16 1985-11-15 Appareil et procede pour faire des depots de vapeur sur des plaquettes

Country Status (5)

Country Link
US (1) US4651674A (fr)
DE (1) DE3540628C2 (fr)
FR (1) FR2573325B1 (fr)
GB (1) GB2169003B (fr)
NL (1) NL8503163A (fr)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8620273D0 (en) * 1986-08-20 1986-10-01 Gen Electric Co Plc Deposition of thin films
CH687258A5 (de) * 1993-04-22 1996-10-31 Balzers Hochvakuum Gaseinlassanordnung.
JP3162313B2 (ja) * 1997-01-20 2001-04-25 工業技術院長 薄膜製造方法および薄膜製造装置
JP2002203885A (ja) 2000-12-27 2002-07-19 Anelva Corp インターバック型基板処理装置
JP4856308B2 (ja) * 2000-12-27 2012-01-18 キヤノンアネルバ株式会社 基板処理装置及び経由チャンバー
DE10140761B4 (de) * 2001-08-20 2004-08-26 Infineon Technologies Ag Wafer-Handhabungsvorrichtung
US20050098107A1 (en) * 2003-09-24 2005-05-12 Du Bois Dale R. Thermal processing system with cross-flow liner
US20050121145A1 (en) * 2003-09-25 2005-06-09 Du Bois Dale R. Thermal processing system with cross flow injection system with rotatable injectors
JP5109376B2 (ja) 2007-01-22 2012-12-26 東京エレクトロン株式会社 加熱装置、加熱方法及び記憶媒体
KR101431197B1 (ko) * 2008-01-24 2014-09-17 삼성전자주식회사 원자층 증착설비 및 그의 원자층 증착방법
JP5075793B2 (ja) * 2008-11-06 2012-11-21 東京エレクトロン株式会社 可動ガス導入構造物及び基板処理装置
WO2010055876A1 (fr) * 2008-11-14 2010-05-20 株式会社アルバック Dispositif de dépôt de pellicule mince organique, dispositif de fabrication d’élément el organique, et procédé de dépôt de pellicule mince organique
KR101499228B1 (ko) * 2008-12-08 2015-03-05 삼성디스플레이 주식회사 증착 장치 및 증착 방법
TWI460067B (zh) * 2010-02-24 2014-11-11 Hon Hai Prec Ind Co Ltd 表面活化處理裝置
US8409407B2 (en) 2010-04-22 2013-04-02 Primestar Solar, Inc. Methods for high-rate sputtering of a compound semiconductor on large area substrates
US9941100B2 (en) * 2011-12-16 2018-04-10 Taiwan Semiconductor Manufacturing Company, Ltd. Adjustable nozzle for plasma deposition and a method of controlling the adjustable nozzle

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1544253C3 (de) * 1964-09-14 1974-08-15 Siemens Ag, 1000 Berlin Und 8000 Muenchen Vorrichtung zum epitaktischen Abscheiden yon Halbleitermaterial
DE1297086B (de) * 1965-01-29 1969-06-12 Siemens Ag Verfahren zum Herstellen einer Schicht von einkristallinem Halbleitermaterial
US3659552A (en) * 1966-12-15 1972-05-02 Western Electric Co Vapor deposition apparatus
US3637434A (en) * 1968-11-07 1972-01-25 Nippon Electric Co Vapor deposition apparatus
US3645230A (en) * 1970-03-05 1972-02-29 Hugle Ind Inc Chemical deposition apparatus
US3796182A (en) * 1971-12-16 1974-03-12 Applied Materials Tech Susceptor structure for chemical vapor deposition reactor
US3980854A (en) * 1974-11-15 1976-09-14 Rca Corporation Graphite susceptor structure for inductively heating semiconductor wafers
FR2419585A1 (fr) * 1978-03-07 1979-10-05 Thomson Csf Procede d'obtention en phase gazeuse d'une couche epitaxiale de phosphure d'indium, et appareil d'application de ce procede
JPS5747711A (en) * 1980-08-08 1982-03-18 Fujitsu Ltd Chemical plasma growing method in vapor phase
GB2089840B (en) * 1980-12-20 1983-12-14 Cambridge Instr Ltd Chemical vapour deposition apparatus incorporating radiant heat source for substrate
US4468283A (en) * 1982-12-17 1984-08-28 Irfan Ahmed Method for etching and controlled chemical vapor deposition
JPS60116783A (ja) * 1983-11-29 1985-06-24 Canon Inc 堆積膜製造装置

Also Published As

Publication number Publication date
DE3540628A1 (de) 1986-07-03
DE3540628C2 (de) 1994-09-29
GB2169003B (en) 1987-12-31
NL8503163A (nl) 1986-06-16
GB8528217D0 (en) 1985-12-18
US4651674A (en) 1987-03-24
GB2169003A (en) 1986-07-02
FR2573325A1 (fr) 1986-05-23

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Legal Events

Date Code Title Description
ST Notification of lapse