FR2567708B1 - Systeme d'assemblage automatise pour dispositif a semi-conducteur - Google Patents

Systeme d'assemblage automatise pour dispositif a semi-conducteur

Info

Publication number
FR2567708B1
FR2567708B1 FR8510892A FR8510892A FR2567708B1 FR 2567708 B1 FR2567708 B1 FR 2567708B1 FR 8510892 A FR8510892 A FR 8510892A FR 8510892 A FR8510892 A FR 8510892A FR 2567708 B1 FR2567708 B1 FR 2567708B1
Authority
FR
France
Prior art keywords
semiconductor device
assembly system
automated assembly
automated
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8510892A
Other languages
English (en)
Other versions
FR2567708A1 (fr
Inventor
Kohsuke Tange
Osamu Takahashi
Yuhki Furuya
Akira Harada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Publication of FR2567708A1 publication Critical patent/FR2567708A1/fr
Application granted granted Critical
Publication of FR2567708B1 publication Critical patent/FR2567708B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53004—Means to assemble or disassemble with means to regulate operation by use of templet, tape, card or other replaceable information supply
    • Y10T29/53009—Means to assemble or disassemble with means to regulate operation by use of templet, tape, card or other replaceable information supply with comparator
    • Y10T29/53013—Computer input
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53187—Multiple station assembly apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
FR8510892A 1984-07-16 1985-07-16 Systeme d'assemblage automatise pour dispositif a semi-conducteur Expired FR2567708B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14608684A JPS6126229A (ja) 1984-07-16 1984-07-16 半導体装置の製造装置

Publications (2)

Publication Number Publication Date
FR2567708A1 FR2567708A1 (fr) 1986-01-17
FR2567708B1 true FR2567708B1 (fr) 1988-12-09

Family

ID=15399807

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8510892A Expired FR2567708B1 (fr) 1984-07-16 1985-07-16 Systeme d'assemblage automatise pour dispositif a semi-conducteur

Country Status (3)

Country Link
US (1) US4683644A (fr)
JP (1) JPS6126229A (fr)
FR (1) FR2567708B1 (fr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4987673A (en) * 1987-06-18 1991-01-29 Mitsubishi Denki Kabushiki Kaisha Apparatus for packaging semiconductor devices
JPH0235743A (ja) * 1988-07-26 1990-02-06 Mitsubishi Electric Corp 半導体装置の製造装置
US5113565A (en) * 1990-07-06 1992-05-19 International Business Machines Corp. Apparatus and method for inspection and alignment of semiconductor chips and conductive lead frames
US5310055A (en) * 1990-08-21 1994-05-10 National Semiconductor Corporation Magazine and shipping tray for lead frames
JP2802678B2 (ja) * 1990-09-26 1998-09-24 リンテック株式会社 レチクルケースのバーコード貼着装置
JPH066084A (ja) * 1992-06-19 1994-01-14 Olympus Optical Co Ltd 電子部品自動実装機
JP3542365B2 (ja) * 1993-11-30 2004-07-14 アピックヤマダ株式会社 汎用リード加工機
US5836454A (en) * 1996-01-17 1998-11-17 Micron Technology, Inc. Lead frame casing
US6378200B1 (en) * 1997-09-18 2002-04-30 Motorola, Inc. Dynamically reconfigurable assembly line for electronic products
JPH11154799A (ja) * 1997-11-21 1999-06-08 Matsushita Electric Ind Co Ltd 電子部品の実装装置および実装方法
WO2003059570A1 (fr) * 2002-01-04 2003-07-24 G.T. Equipment Technologies Inc. Machine d'assemblage en chaine de cellules solaires
AT411886B (de) * 2002-05-10 2004-07-26 Electrovac Fertigungssystem
JP5859236B2 (ja) * 2011-07-15 2016-02-10 ファスフォードテクノロジ株式会社 フレーム供給装置およびフレーム供給方法
JP5968705B2 (ja) 2012-07-13 2016-08-10 ルネサスエレクトロニクス株式会社 半導体装置の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2212965A5 (fr) * 1972-12-29 1974-07-26 Ibm
US3889355A (en) * 1973-02-05 1975-06-17 Ibm Continuous processing system
US3845286A (en) * 1973-02-05 1974-10-29 Ibm Manufacturing control system for processing workpieces
US4027246A (en) * 1976-03-26 1977-05-31 International Business Machines Corporation Automated integrated circuit manufacturing system

Also Published As

Publication number Publication date
FR2567708A1 (fr) 1986-01-17
US4683644A (en) 1987-08-04
JPS6126229A (ja) 1986-02-05

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Legal Events

Date Code Title Description
ST Notification of lapse
AR Application made for restoration
BR Restoration of rights
ST Notification of lapse