FR2541018A1 - Procede de dissipation thermique, appareil de lecture-ecriture, et carte electronique a dissipation thermique elevee - Google Patents

Procede de dissipation thermique, appareil de lecture-ecriture, et carte electronique a dissipation thermique elevee Download PDF

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Publication number
FR2541018A1
FR2541018A1 FR8302493A FR8302493A FR2541018A1 FR 2541018 A1 FR2541018 A1 FR 2541018A1 FR 8302493 A FR8302493 A FR 8302493A FR 8302493 A FR8302493 A FR 8302493A FR 2541018 A1 FR2541018 A1 FR 2541018A1
Authority
FR
France
Prior art keywords
card
heat
semiconductor
evacuating
thermal dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8302493A
Other languages
English (en)
French (fr)
Other versions
FR2541018B1 (enrdf_load_stackoverflow
Inventor
Philippe Jourdain
Gerard Vieilledent
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Radiotechnique Compelec RTC SA
Original Assignee
Radiotechnique Compelec RTC SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Radiotechnique Compelec RTC SA filed Critical Radiotechnique Compelec RTC SA
Priority to FR8302493A priority Critical patent/FR2541018A1/fr
Publication of FR2541018A1 publication Critical patent/FR2541018A1/fr
Application granted granted Critical
Publication of FR2541018B1 publication Critical patent/FR2541018B1/fr
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • G06K7/0013—Methods or arrangements for sensing record carriers, e.g. for reading patterns by galvanic contacts, e.g. card connectors for ISO-7816 compliant smart cards or memory cards, e.g. SD card readers
    • G06K7/0021—Methods or arrangements for sensing record carriers, e.g. for reading patterns by galvanic contacts, e.g. card connectors for ISO-7816 compliant smart cards or memory cards, e.g. SD card readers for reading/sensing record carriers having surface contacts
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/82—Coupling devices connected with low or zero insertion force
    • H01R12/83—Coupling devices connected with low or zero insertion force connected with pivoting of printed circuits or like after insertion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Artificial Intelligence (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Credit Cards Or The Like (AREA)
FR8302493A 1983-02-16 1983-02-16 Procede de dissipation thermique, appareil de lecture-ecriture, et carte electronique a dissipation thermique elevee Granted FR2541018A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8302493A FR2541018A1 (fr) 1983-02-16 1983-02-16 Procede de dissipation thermique, appareil de lecture-ecriture, et carte electronique a dissipation thermique elevee

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8302493A FR2541018A1 (fr) 1983-02-16 1983-02-16 Procede de dissipation thermique, appareil de lecture-ecriture, et carte electronique a dissipation thermique elevee

Publications (2)

Publication Number Publication Date
FR2541018A1 true FR2541018A1 (fr) 1984-08-17
FR2541018B1 FR2541018B1 (enrdf_load_stackoverflow) 1985-04-05

Family

ID=9285971

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8302493A Granted FR2541018A1 (fr) 1983-02-16 1983-02-16 Procede de dissipation thermique, appareil de lecture-ecriture, et carte electronique a dissipation thermique elevee

Country Status (1)

Country Link
FR (1) FR2541018A1 (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2575567A1 (fr) * 1984-12-29 1986-07-04 Kyodo Printing Co Ltd Carte a circuit integre
FR2676566A1 (fr) * 1991-05-13 1992-11-20 Cit Alcatel Connecteur pour carte a circuits.
GB2436170A (en) * 2006-03-17 2007-09-19 Amstrad Plc Cooling or heating device in a chip card reader
WO2008136803A1 (en) 2007-05-04 2008-11-13 Thomson Licensing Smart card heat sink
EP1990756A3 (en) * 2007-05-09 2011-05-25 Hamburg Industries Co., Ltd. Connector device
US11288462B2 (en) 2015-06-26 2022-03-29 DISH Technologies L.L.C. Dual purpose press-bar and heat sink for high data transfer integrated circuit card reader
EP3262718B1 (en) * 2015-02-25 2023-07-12 DISH Technologies L.L.C. High data transfer smart card reader with heat sink

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3993123A (en) * 1975-10-28 1976-11-23 International Business Machines Corporation Gas encapsulated cooling module
FR2423953A1 (fr) * 1978-04-18 1979-11-16 Radiotechnique Compelec Circuit imprime a composants electroniques incorpores et son procede de fabrication
GB1563091A (en) * 1976-08-12 1980-03-19 Redpoint Ass Ltd Heat dissipation arrangemnts
FR2486685A1 (fr) * 1980-07-09 1982-01-15 Labo Electronique Physique Carte de paiement electronique et procede de realisation

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3993123A (en) * 1975-10-28 1976-11-23 International Business Machines Corporation Gas encapsulated cooling module
GB1563091A (en) * 1976-08-12 1980-03-19 Redpoint Ass Ltd Heat dissipation arrangemnts
FR2423953A1 (fr) * 1978-04-18 1979-11-16 Radiotechnique Compelec Circuit imprime a composants electroniques incorpores et son procede de fabrication
FR2486685A1 (fr) * 1980-07-09 1982-01-15 Labo Electronique Physique Carte de paiement electronique et procede de realisation

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2575567A1 (fr) * 1984-12-29 1986-07-04 Kyodo Printing Co Ltd Carte a circuit integre
FR2676566A1 (fr) * 1991-05-13 1992-11-20 Cit Alcatel Connecteur pour carte a circuits.
EP0515897A1 (fr) * 1991-05-13 1992-12-02 Framatome Connectors Pontarlier Connecteur pour carte à circuits
GB2436170A (en) * 2006-03-17 2007-09-19 Amstrad Plc Cooling or heating device in a chip card reader
WO2008136803A1 (en) 2007-05-04 2008-11-13 Thomson Licensing Smart card heat sink
EP1990756A3 (en) * 2007-05-09 2011-05-25 Hamburg Industries Co., Ltd. Connector device
EP3262718B1 (en) * 2015-02-25 2023-07-12 DISH Technologies L.L.C. High data transfer smart card reader with heat sink
US11288462B2 (en) 2015-06-26 2022-03-29 DISH Technologies L.L.C. Dual purpose press-bar and heat sink for high data transfer integrated circuit card reader

Also Published As

Publication number Publication date
FR2541018B1 (enrdf_load_stackoverflow) 1985-04-05

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