FR2538166A1 - Microboitier d'encapsulation d'un composant electronique, muni d'une pluralite de connexions repliees - Google Patents

Microboitier d'encapsulation d'un composant electronique, muni d'une pluralite de connexions repliees Download PDF

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Publication number
FR2538166A1
FR2538166A1 FR8221229A FR8221229A FR2538166A1 FR 2538166 A1 FR2538166 A1 FR 2538166A1 FR 8221229 A FR8221229 A FR 8221229A FR 8221229 A FR8221229 A FR 8221229A FR 2538166 A1 FR2538166 A1 FR 2538166A1
Authority
FR
France
Prior art keywords
connections
metal
solder
circuit
folded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8221229A
Other languages
English (en)
French (fr)
Other versions
FR2538166B1 (https=
Inventor
Bernard Lacruche
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR8221229A priority Critical patent/FR2538166A1/fr
Priority to DE8383402383T priority patent/DE3363440D1/de
Priority to EP83402383A priority patent/EP0112760B1/fr
Priority to JP58237738A priority patent/JPS59117245A/ja
Publication of FR2538166A1 publication Critical patent/FR2538166A1/fr
Application granted granted Critical
Publication of FR2538166B1 publication Critical patent/FR2538166B1/fr
Priority to US06/799,570 priority patent/US4724473A/en
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/60—Arrangements for protection of devices protecting against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H10W70/429—Bent parts being the outer leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
FR8221229A 1982-12-17 1982-12-17 Microboitier d'encapsulation d'un composant electronique, muni d'une pluralite de connexions repliees Granted FR2538166A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR8221229A FR2538166A1 (fr) 1982-12-17 1982-12-17 Microboitier d'encapsulation d'un composant electronique, muni d'une pluralite de connexions repliees
DE8383402383T DE3363440D1 (en) 1982-12-17 1983-12-09 Electronic component encapsulating micro-housing having a plurality of bent connections
EP83402383A EP0112760B1 (fr) 1982-12-17 1983-12-09 Microboîtier d'encapsulation d'un composant électronique, muni d'une pluralité de connexions repliées
JP58237738A JPS59117245A (ja) 1982-12-17 1983-12-16 電子要素用マイクロパツケ−ジ
US06/799,570 US4724473A (en) 1982-12-17 1985-11-21 Micropackage for encapsulating an electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8221229A FR2538166A1 (fr) 1982-12-17 1982-12-17 Microboitier d'encapsulation d'un composant electronique, muni d'une pluralite de connexions repliees

Publications (2)

Publication Number Publication Date
FR2538166A1 true FR2538166A1 (fr) 1984-06-22
FR2538166B1 FR2538166B1 (https=) 1985-03-08

Family

ID=9280236

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8221229A Granted FR2538166A1 (fr) 1982-12-17 1982-12-17 Microboitier d'encapsulation d'un composant electronique, muni d'une pluralite de connexions repliees

Country Status (5)

Country Link
US (1) US4724473A (https=)
EP (1) EP0112760B1 (https=)
JP (1) JPS59117245A (https=)
DE (1) DE3363440D1 (https=)
FR (1) FR2538166A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3635154A1 (de) * 1985-10-17 1987-04-23 Mitsubishi Electric Corp Vorrichtung mit einer auf einem substrat befestigten halbleiteranordnung
EP0595433A1 (en) * 1992-10-30 1994-05-04 Koninklijke Schelde Groep B.V. Metal-ceramic connection and method for the production thereof
WO2021074713A1 (en) * 2019-10-15 2021-04-22 International Business Machines Corporation Structure with controlled capillary coverage

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8412674D0 (en) * 1984-05-18 1984-06-27 British Telecomm Integrated circuit chip carrier
EP0333237A3 (en) * 1984-05-18 1990-03-21 BRITISH TELECOMMUNICATIONS public limited company Integrated circuit chip carrier
US5072283A (en) * 1988-04-12 1991-12-10 Bolger Justin C Pre-formed chip carrier cavity package
JP2501266B2 (ja) * 1991-11-15 1996-05-29 株式会社東芝 半導体モジュ―ル
US6008991A (en) * 1993-12-20 1999-12-28 Lsi Logic Corporation Electronic system including packaged integrated circuits with heat spreading standoff support members
US5923538A (en) * 1994-10-17 1999-07-13 Lsi Logic Corporation Support member for mounting a microelectronic circuit package
DE10145348C1 (de) * 2001-09-14 2003-03-27 Siemens Dematic Ag Zwischenträger für elektronische Bauelemente und Verfahren zur Lötkontaktierung eines derartigen Zwischenträgers
US8742562B2 (en) * 2008-08-01 2014-06-03 Stmicroelectronics (Malta) Ltd Electronic device protected against electro static discharge
US9554488B2 (en) * 2014-04-18 2017-01-24 Raytheon Company Method to align surface mount packages for thermal enhancement
JP7720181B2 (ja) * 2021-07-12 2025-08-07 新電元工業株式会社 端子部材及び半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5656655A (en) * 1979-10-15 1981-05-18 Hitachi Ltd Semiconductor device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4345814A (en) * 1981-02-04 1982-08-24 Western Electric Company, Inc. Solder-bearing lead having solder flow-control stop means

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5656655A (en) * 1979-10-15 1981-05-18 Hitachi Ltd Semiconductor device

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
IBM TECHNICAL DISCLOSURE BULLETIN, vol. 25, no. 4, septembre 1982, pages 1934-1935, New York, US *
JAPANESE PATENT ABSTRACTS, vol. 5, no. 117(E-67)(789), 28 juillet 1981 & JP - A - 56 56655 (HITACHI SEISAKUSHO K.K.) 18.05.1981 *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3635154A1 (de) * 1985-10-17 1987-04-23 Mitsubishi Electric Corp Vorrichtung mit einer auf einem substrat befestigten halbleiteranordnung
EP0595433A1 (en) * 1992-10-30 1994-05-04 Koninklijke Schelde Groep B.V. Metal-ceramic connection and method for the production thereof
WO2021074713A1 (en) * 2019-10-15 2021-04-22 International Business Machines Corporation Structure with controlled capillary coverage
US11152226B2 (en) 2019-10-15 2021-10-19 International Business Machines Corporation Structure with controlled capillary coverage
GB2604793A (en) * 2019-10-15 2022-09-14 Ibm Structure with controlled capillary coverage
GB2604793B (en) * 2019-10-15 2023-12-20 Ibm Structure with controlled capillary coverage

Also Published As

Publication number Publication date
EP0112760A1 (fr) 1984-07-04
DE3363440D1 (en) 1986-06-12
FR2538166B1 (https=) 1985-03-08
EP0112760B1 (fr) 1986-05-07
US4724473A (en) 1988-02-09
JPS59117245A (ja) 1984-07-06

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ST Notification of lapse