FR2529718A1 - METHOD FOR CONNECTING TWO PLATES OF PRINTED CIRCUITS OF DIFFERENT TYPES - Google Patents

METHOD FOR CONNECTING TWO PLATES OF PRINTED CIRCUITS OF DIFFERENT TYPES Download PDF

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Publication number
FR2529718A1
FR2529718A1 FR8310758A FR8310758A FR2529718A1 FR 2529718 A1 FR2529718 A1 FR 2529718A1 FR 8310758 A FR8310758 A FR 8310758A FR 8310758 A FR8310758 A FR 8310758A FR 2529718 A1 FR2529718 A1 FR 2529718A1
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FR
France
Prior art keywords
contact elements
connection
printed circuit
rigid
different types
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8310758A
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French (fr)
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FR2529718B1 (en
Inventor
Masaichi Inaba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mektron KK
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Nippon Mektron KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron KK filed Critical Nippon Mektron KK
Publication of FR2529718A1 publication Critical patent/FR2529718A1/en
Application granted granted Critical
Publication of FR2529718B1 publication Critical patent/FR2529718B1/en
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
    • H01H13/702—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2215/00—Tactile feedback
    • H01H2215/004—Collapsible dome or bubble
    • H01H2215/008—Part of substrate or membrane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2217/00—Facilitation of operation; Human engineering
    • H01H2217/006—Different feeling for different switch sites

Abstract

LA PRESENTE INVENTION VISE A FOURNIR UN PROCEDE POUR LE RACCORDEMENT DE DEUX PLAQUETTES DE CIRCUITS IMPRIMES DE TYPES DIFFERENTS 1, 6, CARACTERISE EN CE QU'ON EFFECTUE LE RACCORDEMENT DES ELEMENTS DE CONTACT 3 DES CIRCUITS D'UNE PLAQUETTE FLEXIBLE 1 ET DES ELEMENTS DE CONTACT 8 DES CIRCUITS D'UNE PLAQUETTE RIGIDE 6 AU MOYEN D'UN ADHESIF CONDUCTEUR ELECTRIQUE 4. APPLICATION DU PROCEDE DE L'INVENTION AUX RACCORDEMENTS DE PLAQUETTES DE CIRCUITS IMPRIMES DE CIRCUITS ELECTRONIQUES DIVERS EN VUE DE FACILITER LES OPERATIONS DE REMPLACEMENT.THE PRESENT INVENTION AIMS AT PROVIDING A PROCESS FOR THE CONNECTION OF TWO PRINTED CIRCUIT BOARDS OF DIFFERENT TYPES 1, 6, CHARACTERIZED IN THAT THE CONNECTION OF THE CONTACT ELEMENTS 3 OF THE CIRCUITS OF A FLEXIBLE BOARD OF 1 AND OF THE ELEMENTS 1 AND CONTACT 8 OF THE CIRCUITS OF A RIGID BOARD 6 BY MEANS OF AN ELECTRIC CONDUCTIVE ADHESIVE 4. APPLICATION OF THE PROCESS OF THE INVENTION TO CONNECTIONS OF PRINTED CIRCUIT BOARDS OF VARIOUS ELECTRONIC CIRCUITS WITH A VIEW TO FACILITATING REPLACEMENT OPERATIONS.

Description

2 5 2 9 7 1 82 5 2 9 7 1 8

Procédé pour le raccordement de deux plaquettes de circuits imprimés de typesdifférents La présente invention concerne un procédé pour le raccordement de deux plaquettes de circuits imprimés de typesdifférent: tels que des plaquettes flexibles  The present invention relates to a method for connecting two printed circuit boards of different types: such as flexible wafers

et des plaquettes rigides; elle concerne plus parti-  and rigid pads; it concerns more particularly

culièrement un procédé pour raccorder deux éléments de contacts disposés sur les plaquettes de base desdits  a method for connecting two contact elements arranged on the base boards of said

circuits imprimés.printed circuits.

Jusqu'à présent, on a proposé divers procédés pour réaliser un raccordement de ce type, mais tous ceux-ci exigent de l'habilité, comme par exemple les techniques de soudage etc et des constructions particulières, en vue d'augmenter la fiabilité des joints entre deux éléments de contacts Il en résulte des problèmes tels que des coûts de fabrication élevés  So far, various methods have been proposed for making such a connection, but all of these require skill, such as welding techniques, etc., and particular constructions, in order to increase the reliability of the connections. joints between two contact elements This results in problems such as high manufacturing costs

et des difficultés lors de la séparation et du rempla-  and difficulties in the separation and replacement

cement de l'une des plaquettes de circuit, en cas de défaillance. La présente invention vise à fournir un procédé pour le raccordement de deux plaquettes de circuits imprimés de typesdifférentstout en éliminant les difficultés résultant des procédés susmentionnés et permettant de raccorder des éléments de contact disposés  one of the circuit boards, in case of failure. The present invention aims to provide a method for connecting two printed circuit boards of different types while eliminating the difficulties resulting from the aforementioned methods and for connecting contact elements arranged

sur les plaquettes de base rigides.on rigid base pads.

Le but de la présente invention est atteint par un procédé pour le raccordement de deux plaquettes de circuits imprimés, de typesdifférents, caractérisé en ce qu'on effectue le raccordement des éléments de contact des circuits d'une plaquette flexible et des éléments de contact des circuits d'une plaquette rigide  The object of the present invention is achieved by a method for the connection of two printed circuit boards, of different types, characterized in that the connection elements of the circuits of a flexible wafer and the contact elements of the circuits of a rigid plate

au moyen d'un adhésif conducteur électrique.  by means of an electrically conductive adhesive.

Un avantage du procédé de l'invention réside dans le fait que les coûts de fabrication sont faibles et que les plaquettes peuvent être connectées et séparées facilement. D'autres détails et avantages apparaîtront plus  An advantage of the method of the invention is that the manufacturing costs are low and that the wafers can be easily connected and separated. Other details and benefits will appear more

clairement dans la description suivante, à l'appui des  clearly in the following description, in support of

figures annexées dans lesquelles: la figure 1 est une vue en plan d'un raccordement suivant un premier exemple d'application du procédé de l'invention, la figure 2 est une vue en coupe, à plus grande échelle, d'une partie de la figure 1, la figure 3 est une vue en plan d'une plaquette de circuit imprimé flexible, suivant un autre exemple du procédé de l'invention, la figure 4 est une vue en coupe, à plus grande échelle, représentant le raccordement entre des plaquettes flexibles et rigides suivant un autre exemple d'application, et la figure 5 est une vue en coupe d'un raccordement renforcé entre des plaquettes flexibles  attached figures in which: Figure 1 is a plan view of a connection according to a first example of application of the method of the invention, Figure 2 is a sectional view, on a larger scale, of a part of FIG. 3 is a plan view of a flexible printed circuit board, according to another example of the method of the invention; FIG. 4 is a sectional view, on a larger scale, showing the connection between flexible and rigid plates according to another example of application, and Figure 5 is a sectional view of a reinforced connection between flexible plates

et rigides.and rigid.

Les figures 1 et 2 montrent un premier exemple d'application de la présente invention dans lequel un adhésif électro-conducteur est appliqué au fond d'un nombre exigé d'éléments de contact disposés sur l'élément de base 2 d'une plaquette de circuit imprimé flexible 1 D'autre part, l'élément de base 7 d'une plaquette de circuit imprimé rigide 6 présente, à sa surface, le nombre exigé d'éléments de contact 8 correspondants aux éléments de contact 3 En vue d'effectuer le raccordement des éléments de contact de la plaquette flexible 1 avec les éléments de contact 8 de la plaquette rigide 6, on peut d'abord agencer les éléments de contact 3 et 8 de manière correspondante à l'oeil nu ou par d'autres moyens, et ensuite appliquer les éléments de contact 3 de la plaquette flexible 1 contre les éléments de contact correspondants 8 de la plaquette rigide 6 De ce fait, l'adhésif 4 adhère aux éléments de contact 8 de la plaquette de circuit imprimé rigide 6 en formant une liaison physique entre les éléments de contact 3 et les éléments de contact 8  FIGS. 1 and 2 show a first example of application of the present invention in which an electroconductive adhesive is applied to the bottom of a required number of contact elements arranged on the base element 2 of a wafer. On the other hand, the base element 7 of a rigid printed circuit board 6 has, on its surface, the required number of contact elements 8 corresponding to the contact elements 3. connecting the contact elements of the flexible wafer 1 with the contact elements 8 of the rigid wafer 6, the contact elements 3 and 8 can first be arranged correspondingly to the naked eye or by other means , and then apply the contact elements 3 of the flexible wafer 1 against the corresponding contact elements 8 of the rigid wafer 6. As a result, the adhesive 4 adheres to the contact elements 8 of the rigid printed circuit board 6. forming a physical connection between the contact elements 3 and the contact elements 8

ainsi qu'une liaison électrique entre ceux-ci.  as well as an electrical connection between them.

Les figures 3 et 4 montrent un deuxième exemple pratique suivant la présente invention dans lequel les extrémités de l'élément de base 11 d'une plaquette de circuit imprimé flexible 10 peuvent se présenter sous forme de dents de peigne, et les éléments de contact 12 peuvent s'étendre à chaque extrémité de chaque dent ll A, l'adhésif électro-conducteur 13 étant appliqué à la surface des éléments de contact X 2 et au fond des dents de peigne ll A L'élément de base Il peut se présenter sous forme de dents de peigne et les éléments de contact 12 peuvent s'étendre à l'extrémité comme décrit de telle sorte que l'adhésif 13 des éléments de contact voisins 12 et 12 ne puissent former un court-circuit entre les éléments de contact En pliant les dents ll A, comme montré à la figure 4, les parties des éléments de contact 12 comportant l'adhésif 13 qui y est collé et l'adhésif appliqué au fond de la dent ll A se recouvrent pour former un seul corps comme représenté à la figure D'autre part, l'élément de base 15 de la plaquette de circuit imprimé rigide 14 qui doit être raccordé à la plaquette de circuit imprimé flexible 10 comporte des éléments de contact 16 correspondant aux éléments de contact 12, disposés sur la surface En vue de raccorder les éléments de contact 12 de la plaquette flexible 10 aux éléments de contact 16 de la plaquette de circuit rigide 14, il faut d'abord agencer les éléments de contact de manière correspondante à l'oeil nu ou par d'autres moyens, et ensuite presser les éléments de contact 12 sur les éléments de contact 16 en vue  FIGS. 3 and 4 show a second practical example according to the present invention in which the ends of the base element 11 of a flexible printed circuit board 10 may be in the form of comb teeth, and the contact elements 12 may extend at each end of each tooth 11A, the electroconductive adhesive 13 being applied to the surface of the contact elements X 2 and the bottom of the comb teeth 11A The base element It may be under comb-tooth form and the contact elements 12 may extend at the end as described so that the adhesive 13 of the adjacent contact elements 12 and 12 can not form a short circuit between the contact elements By folding the teeth 11A, as shown in FIG. 4, the portions of the contact members 12 having the adhesive 13 adhered thereto and the adhesive applied to the bottom of the tooth 11A overlap to form a single body as On the other hand, the base member 15 of the rigid printed circuit board 14 which is to be connected to the flexible printed circuit board 10 has contact elements 16 corresponding to the contact elements 12 disposed on the surface In order to connect the contact elements 12 of the flexible wafer 10 to the contact elements 16 of the rigid circuit board 14, it is first necessary to arrange the contact elements correspondingly to the naked eye or by means of other means, and then pressing the contact elements 12 on the contact elements 16 in order to

d'effectuer le raccordement.to make the connection.

Dans les exemples d'application décrits ci-dessus, les éléments de contact 3 ou 12 des plaquettes flexibles 1 ou 10 et les éléments de contact 8 ou 16 des plaquettes rigides 6 ou 14 sont facilement raccordés au moyen de l'adhésif électro-conducteur 4 ou 13 et on peut également séparer facilement les éléments de contact 3 ou 12 des  In the application examples described above, the contact elements 3 or 12 of the flexible plates 1 or 10 and the contact elements 8 or 16 of the rigid plates 6 or 14 are easily connected by means of the electrically conductive adhesive 4 or 13 and can also easily separate the contact elements 3 or 12 from

éléments de contact 8 ou 16, si nécessaire, en cas de défail-  contact elements 8 or 16, if necessary, in the event of

lance de l'une des plaquettes de circuit imprimé, ce qui constitue un grand avantage En outre, dans ces exemples, le raccordement entre les éléments de contact peut être renforcé en appliquant une bande adhésive qui n'est pas un conducteur électrique au-dessus desdits éléments de contact raccordés par l'adhésif conducteur en vue d'améliorer la résistance du raccordement contre les vibrations etc. De plus, suivant l'invention, dans le cas o chaque circuit de la plaquette de circuit imprimé ne présente pas de problème, les éléments de contact 20 disposés sur un élément de base 19 d'une plaquette flexible 18 étant raccordés aux éléments de contact 23 d'un élément de base 22 d'une plaquette rigide 21 au moyen d'un adhésif électro-conducteur 24 de manière semblable au deuxième exemple d'application décrit ci-dessus, on peut encore parfaire le raccordement entre les éléments de contact 20 et 23 en déposant ultérieurement de la soudure 25 entre les éléments de contact 20 et 23 afin de former une seule pièce  In addition, in these examples, the connection between the contact elements can be reinforced by applying an adhesive tape which is not an electrical conductor above. said contact elements connected by the conductive adhesive to improve the resistance of the connection against vibrations etc. In addition, according to the invention, in the case where each circuit of the printed circuit board does not present a problem, the contact elements 20 disposed on a base element 19 of a flexible plate 18 being connected to the contact elements. 23 of a base element 22 of a rigid plate 21 by means of an electrically conductive adhesive 24 in a manner similar to the second example of application described above, it is still possible to complete the connection between the contact elements 20 and 23 subsequently depositing solder 25 between the contact members 20 and 23 to form a single piece

comme représenté à la figure 5.as shown in Figure 5.

On constate donc suivant l'invention que les éléments de contact de plaquettes de circuit imprimé flexibles et rigides peuvent être avantageusement raccordés, de manière facile et à coût de fabrication peu élevé, en utilisant un adhésif électro-conducteur et, en outre, que les éléments de contact sont facilement séparables après le raccordement tout en  It is thus found according to the invention that the flexible and rigid printed circuit board contact elements can advantageously be connected, in an easy manner and at low manufacturing cost, by using an electrically conductive adhesive and, moreover, that the contact elements are easily separable after connection while

contribuant ainsi de manière importante à l'améliora-  thus contributing significantly to the improvement

tion de l'efficacité des opérations d'inspection, de remplacement partiel etc.  efficiency of inspection operations, partial replacement, etc.

Claims (3)

Revendicationsclaims 1 Procédé pour le raccordement de deux plaquettes de circuits imprimés, de typdifféreni, caractérisé en ce qu'on effectue le raccordement des éléments de contact des circuits d'une plaquette flexible et des éléments de contact des circuits d'une plaquette  1 Method for connecting two printed circuit boards, typdiffereni, characterized in that the connection of the contact elements of the circuits of a flexible wafer and circuit contact elements of a wafer rigide au moyen d'un adhésif conducteur électrique.  rigid by means of an electrically conductive adhesive. 2 Procédé suivant la revendication 1, caractérisé en ce qu'on renforce le raccordement entre les éléments de contact en appliquant un adhésif qui n'est pas un conducteur électrique au-dessus desdits éléments de contact raccordés entre eux par l'adhésif conducteur.  Process according to Claim 1, characterized in that the connection between the contact elements is reinforced by applying an adhesive which is not an electrical conductor above said contact elements connected to each other by the conductive adhesive. 3 Procédé suivant la revendication 1, caractérisé en ce qu'on parfait le raccordement entre les éléments de contact raccordés entre eux au moyen de l'adhésif conducteur électrique en déposant de la soudure entre les éléments de contact en vue de formerProcess according to Claim 1, characterized in that the connection between the contact elements connected to one another by means of the electrically conductive adhesive is perfected by depositing solder between the contact elements in order to form une seule pièce.one piece.
FR8310758A 1982-06-30 1983-06-29 METHOD FOR THE CONNECTION OF TWO PRINTED CIRCUIT BOARDS OF DIFFERENT TYPES Expired FR2529718B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57113010A JPS593824A (en) 1982-06-30 1982-06-30 Panel keyboard

Publications (2)

Publication Number Publication Date
FR2529718A1 true FR2529718A1 (en) 1984-01-06
FR2529718B1 FR2529718B1 (en) 1988-10-21

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Family Applications (2)

Application Number Title Priority Date Filing Date
FR8310758A Expired FR2529718B1 (en) 1982-06-30 1983-06-29 METHOD FOR THE CONNECTION OF TWO PRINTED CIRCUIT BOARDS OF DIFFERENT TYPES
FR8310757A Withdrawn FR2548444A1 (en) 1982-06-30 1983-06-29 KEY PANEL

Family Applications After (1)

Application Number Title Priority Date Filing Date
FR8310757A Withdrawn FR2548444A1 (en) 1982-06-30 1983-06-29 KEY PANEL

Country Status (4)

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JP (1) JPS593824A (en)
DE (1) DE3323470A1 (en)
FR (2) FR2529718B1 (en)
GB (1) GB2123213B (en)

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Also Published As

Publication number Publication date
FR2548444A1 (en) 1985-01-04
GB8317808D0 (en) 1983-08-03
JPS593824A (en) 1984-01-10
FR2529718B1 (en) 1988-10-21
DE3323470A1 (en) 1984-01-05
GB2123213B (en) 1985-10-30
GB2123213A (en) 1984-01-25

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