FR2526783B1 - - Google Patents
Info
- Publication number
- FR2526783B1 FR2526783B1 FR8208612A FR8208612A FR2526783B1 FR 2526783 B1 FR2526783 B1 FR 2526783B1 FR 8208612 A FR8208612 A FR 8208612A FR 8208612 A FR8208612 A FR 8208612A FR 2526783 B1 FR2526783 B1 FR 2526783B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B9/00—Blowing glass; Production of hollow glass articles
- C03B9/30—Details of blowing glass; Use of materials for the moulds
- C03B9/38—Means for cooling, heating, or insulating glass-blowing machines or for cooling the glass moulded by the machine
- C03B9/3816—Means for general supply, distribution or control of the medium to the mould, e.g. sensors, circuits, distribution networks
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B9/00—Blowing glass; Production of hollow glass articles
- C03B9/30—Details of blowing glass; Use of materials for the moulds
- C03B9/38—Means for cooling, heating, or insulating glass-blowing machines or for cooling the glass moulded by the machine
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B9/00—Blowing glass; Production of hollow glass articles
- C03B9/30—Details of blowing glass; Use of materials for the moulds
- C03B9/40—Gearing or controlling mechanisms specially adapted for glass-blowing machines
- C03B9/41—Electric or electronic systems
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20627—Liquid coolant without phase change
- H05K7/20645—Liquid coolant without phase change within cabinets for removing heat from sub-racks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10022—Non-printed resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10553—Component over metal, i.e. metal plate in between bottom of component and surface of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S65/00—Glass manufacturing
- Y10S65/13—Computer control
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Aviation & Aerospace Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/224,350 US4339260A (en) | 1981-01-12 | 1981-01-12 | Environmentally protected electronic control for a glassware forming machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2526783A1 FR2526783A1 (fr) | 1983-11-18 |
| FR2526783B1 true FR2526783B1 (US06236872-20010522-M00003.png) | 1985-01-25 |
Family
ID=22840288
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8208612A Granted FR2526783A1 (fr) | 1981-01-12 | 1982-05-17 | Dispositif de commande electronique protege contre l'environnement pour une machine a former des articles en verre |
Country Status (6)
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8304890D0 (en) * | 1983-02-22 | 1983-03-23 | Smiths Industries Plc | Chip-carrier substrates |
| GB2135525B (en) * | 1983-02-22 | 1986-06-18 | Smiths Industries Plc | Heat-dissipating chip carrier substrates |
| DE3541458A1 (de) * | 1985-11-23 | 1987-05-27 | Koenig & Bauer Ag | Kurzfarbwerk fuer offsetrotationsdruckmaschinen |
| GB2190795B (en) * | 1986-05-09 | 1990-01-10 | Hella Kg Hueck & Co | Circuit arrangement |
| DE4023319C1 (US06236872-20010522-M00003.png) * | 1990-07-21 | 1991-12-12 | Robert Bosch Gmbh, 7000 Stuttgart, De | |
| GB2247782A (en) * | 1990-09-05 | 1992-03-11 | Marconi Gec Ltd | A circuit board assembly |
| JPH06503210A (ja) * | 1991-09-21 | 1994-04-07 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 電気装置、特に車両用の切換−及び制御装置 |
| FR2686213B1 (fr) * | 1992-01-14 | 1994-05-06 | Applications Gles Elect Meca | Boitier recepteur de composants electroniques dissipateurs. |
| US5624473A (en) * | 1994-04-29 | 1997-04-29 | Owens-Brockway Glass Container Inc. | Automated controller for glassware manufacture with electronically labeled manual mode panel switches |
| US5580366A (en) * | 1994-04-29 | 1996-12-03 | Owens-Brockway Glass Container Inc. | Automated glassware manufacture controller |
| DE4432057A1 (de) * | 1994-09-09 | 1996-03-14 | Bosch Gmbh Robert | Vorrichtung zur Ableitung der thermischen Verlustleistung eines elektronischen oder elektromechanischen Bauelementes |
| US6357414B1 (en) * | 1999-04-22 | 2002-03-19 | Visteon Global Technologies, Inc. | Air manifold mounting for engine control circuitry |
| US6377462B1 (en) | 2001-01-09 | 2002-04-23 | Deere & Company | Circuit board assembly with heat sinking |
| DE202005009039U1 (de) * | 2005-06-08 | 2006-10-19 | Siemens Ag | Elektronisches Steuergerät für ein Kraftfahrzeug, insbesondere für eine Getriebesteuerung |
| US11026347B2 (en) * | 2012-12-21 | 2021-06-01 | Smart Embedded Computing, Inc. | Configurable cooling for rugged environments |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3395318A (en) * | 1967-02-13 | 1968-07-30 | Gen Precision Inc | Circuit board card arrangement for the interconnection of electronic components |
| GB1205813A (en) * | 1967-07-25 | 1970-09-16 | Marconi Co Ltd | Improvements in or relating to electronic apparatus |
| US3550681A (en) * | 1968-12-30 | 1970-12-29 | Gen Motors Corp | Self-adjusting thermal connector |
| US3903404A (en) * | 1973-10-17 | 1975-09-02 | Amdahl Corp | Computer construction and method |
| JPS5162901A (en) * | 1974-11-25 | 1976-05-31 | Sandosutorando Hiito Toransufu | Denshisochonetsudentatsukozobutsu |
| US4029999A (en) * | 1975-04-10 | 1977-06-14 | Ibm Corporation | Thermally conducting elastomeric device |
| GB1521464A (en) * | 1975-10-15 | 1978-08-16 | Thorn Automation Ltd | Mounting of electrical equipment for cooling |
| GB1491569A (en) * | 1975-10-18 | 1977-11-09 | Amp Inc | Fluid cooling systems for electrical components |
| US3993123A (en) * | 1975-10-28 | 1976-11-23 | International Business Machines Corporation | Gas encapsulated cooling module |
| GB1563091A (en) * | 1976-08-12 | 1980-03-19 | Redpoint Ass Ltd | Heat dissipation arrangemnts |
| US4071344A (en) * | 1976-10-14 | 1978-01-31 | Libbey-Owens-Ford Company | Glass sheet temperature control apparatus and method |
| US4167771A (en) * | 1977-06-16 | 1979-09-11 | International Business Machines Corporation | Thermal interface adapter for a conduction cooling module |
| DE2753914C2 (de) * | 1977-12-03 | 1983-03-24 | TE KA DE Felten & Guilleaume Fernmeldeanlagen GmbH, 8500 Nürnberg | Aufnahmerahmen für ein Gerät der elektrischen Nachrichtentechnik |
| GB1592072A (en) * | 1978-01-23 | 1981-07-01 | Plessey Co Ltd | Heat dissipation arrangements for printed circuit boards |
| DE7933844U1 (de) * | 1979-11-30 | 1980-03-06 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Wärmeleitvorrichtung für elektrische Geräte |
| DE3010363C2 (de) * | 1980-03-14 | 1987-02-12 | Siemens AG, 1000 Berlin und 8000 München | Gerätekombination für den Bergbau mit Bauelementen der Leistungselektronik |
| US4322776A (en) * | 1980-08-04 | 1982-03-30 | Hughes Aircraft Company | Thermal interconnection |
-
1981
- 1981-01-12 US US06/224,350 patent/US4339260A/en not_active Expired - Lifetime
-
1982
- 1982-05-07 CA CA000402472A patent/CA1194973A/en not_active Expired
- 1982-05-12 GB GB08213712A patent/GB2120860B/en not_active Expired
- 1982-05-17 FR FR8208612A patent/FR2526783A1/fr active Granted
- 1982-05-18 JP JP57082571A patent/JPS58199730A/ja active Granted
- 1982-06-02 DE DE19823220638 patent/DE3220638A1/de active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58199730A (ja) | 1983-11-21 |
| JPH0244776B2 (US06236872-20010522-M00003.png) | 1990-10-05 |
| CA1194973A (en) | 1985-10-08 |
| GB2120860B (en) | 1986-01-08 |
| US4339260A (en) | 1982-07-13 |
| DE3220638A1 (de) | 1983-12-08 |
| GB2120860A (en) | 1983-12-07 |
| FR2526783A1 (fr) | 1983-11-18 |
| DE3220638C2 (US06236872-20010522-M00003.png) | 1987-06-04 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| TP | Transmission of property |