FR2516702A1 - Boitier pour circuits electroniques - Google Patents

Boitier pour circuits electroniques Download PDF

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Publication number
FR2516702A1
FR2516702A1 FR8121619A FR8121619A FR2516702A1 FR 2516702 A1 FR2516702 A1 FR 2516702A1 FR 8121619 A FR8121619 A FR 8121619A FR 8121619 A FR8121619 A FR 8121619A FR 2516702 A1 FR2516702 A1 FR 2516702A1
Authority
FR
France
Prior art keywords
cover
housing
hybrid circuit
bars
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8121619A
Other languages
English (en)
French (fr)
Other versions
FR2516702B1 (enExample
Inventor
Yves Le Goff
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Dassault Electronique SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dassault Electronique SA filed Critical Dassault Electronique SA
Priority to FR8121619A priority Critical patent/FR2516702A1/fr
Publication of FR2516702A1 publication Critical patent/FR2516702A1/fr
Application granted granted Critical
Publication of FR2516702B1 publication Critical patent/FR2516702B1/fr
Granted legal-status Critical Current

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Classifications

    • H10W76/40—
    • H10W90/00—

Landscapes

  • Casings For Electric Apparatus (AREA)
FR8121619A 1981-11-18 1981-11-18 Boitier pour circuits electroniques Granted FR2516702A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8121619A FR2516702A1 (fr) 1981-11-18 1981-11-18 Boitier pour circuits electroniques

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8121619A FR2516702A1 (fr) 1981-11-18 1981-11-18 Boitier pour circuits electroniques

Publications (2)

Publication Number Publication Date
FR2516702A1 true FR2516702A1 (fr) 1983-05-20
FR2516702B1 FR2516702B1 (enExample) 1983-12-16

Family

ID=9264131

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8121619A Granted FR2516702A1 (fr) 1981-11-18 1981-11-18 Boitier pour circuits electroniques

Country Status (1)

Country Link
FR (1) FR2516702A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0205746A3 (en) * 1985-06-15 1987-07-22 Brown, Boveri & Cie Aktiengesellschaft Semiconductor power module comprising a ceramic substrate
US5831369A (en) * 1994-05-02 1998-11-03 Siemens Matsushita Components Gmbh & Co. Kg Encapsulation for electronic components and method for producing the encapsulation

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3030358A (en) * 1961-05-11 1962-04-17 Sterling Drug Inc Process for reduction of delta4 androstene [3.2-c] pyrazole compounds
GB1213726A (en) * 1968-01-26 1970-11-25 Ferranti Ltd Improvements relating to electrical circuit assemblies

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3030358A (en) * 1961-05-11 1962-04-17 Sterling Drug Inc Process for reduction of delta4 androstene [3.2-c] pyrazole compounds
GB1213726A (en) * 1968-01-26 1970-11-25 Ferranti Ltd Improvements relating to electrical circuit assemblies

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0205746A3 (en) * 1985-06-15 1987-07-22 Brown, Boveri & Cie Aktiengesellschaft Semiconductor power module comprising a ceramic substrate
US5831369A (en) * 1994-05-02 1998-11-03 Siemens Matsushita Components Gmbh & Co. Kg Encapsulation for electronic components and method for producing the encapsulation
US6446316B1 (en) 1994-05-02 2002-09-10 Siemens Matsushita Components Gmbh & Co. Kg Method for producing an encapsulation for a SAW component operating with surface acoustic waves

Also Published As

Publication number Publication date
FR2516702B1 (enExample) 1983-12-16

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