FR2509516A1 - Procede destine a accroitre la tension de claquage d'un condensateur integre et condensateur ainsi realise - Google Patents
Procede destine a accroitre la tension de claquage d'un condensateur integre et condensateur ainsi realise Download PDFInfo
- Publication number
- FR2509516A1 FR2509516A1 FR8113424A FR8113424A FR2509516A1 FR 2509516 A1 FR2509516 A1 FR 2509516A1 FR 8113424 A FR8113424 A FR 8113424A FR 8113424 A FR8113424 A FR 8113424A FR 2509516 A1 FR2509516 A1 FR 2509516A1
- Authority
- FR
- France
- Prior art keywords
- metal layer
- semiconductor substrate
- capacitor
- deposited
- dielectric layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/80—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors
- H10D86/85—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors characterised by only passive components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/10—Metal-oxide dielectrics
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Integrated Circuits (AREA)
- Local Oxidation Of Silicon (AREA)
- Weting (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8113424A FR2509516A1 (fr) | 1981-07-08 | 1981-07-08 | Procede destine a accroitre la tension de claquage d'un condensateur integre et condensateur ainsi realise |
US06/391,266 US4475120A (en) | 1981-07-08 | 1982-06-24 | Method of raising the breakdown voltage of an integrated capacitor and capacitor manufactured by this method |
EP82200814A EP0070064B1 (fr) | 1981-07-08 | 1982-06-30 | Procédé destiné à accroitre la tension de claquage d'un condensateur intégré et condensateur ainsi réalisé |
DE8282200814T DE3266800D1 (en) | 1981-07-08 | 1982-06-30 | Method of increasing the breakdown voltage of an integrated capacitor and the capacitor so obtained |
JP57116675A JPS5816560A (ja) | 1981-07-08 | 1982-07-05 | 集積化コンデンサの形成方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8113424A FR2509516A1 (fr) | 1981-07-08 | 1981-07-08 | Procede destine a accroitre la tension de claquage d'un condensateur integre et condensateur ainsi realise |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2509516A1 true FR2509516A1 (fr) | 1983-01-14 |
FR2509516B1 FR2509516B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1984-04-20 |
Family
ID=9260349
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8113424A Granted FR2509516A1 (fr) | 1981-07-08 | 1981-07-08 | Procede destine a accroitre la tension de claquage d'un condensateur integre et condensateur ainsi realise |
Country Status (5)
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5508234A (en) * | 1994-10-31 | 1996-04-16 | International Business Machines Corporation | Microcavity structures, fabrication processes, and applications thereof |
US8692318B2 (en) * | 2011-05-10 | 2014-04-08 | Nanya Technology Corp. | Trench MOS structure and method for making the same |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3432918A (en) * | 1963-11-12 | 1969-03-18 | Texas Instruments Inc | Method of making a capacitor by vacuum depositing manganese oxide as the electrolytic layer |
FR2138339A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1971-05-24 | 1973-01-05 | Radiotechnique Compelec | |
US3714529A (en) * | 1971-05-04 | 1973-01-30 | Microsystems Int Ltd | Thin film capacitor |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3466719A (en) * | 1967-01-11 | 1969-09-16 | Texas Instruments Inc | Method of fabricating thin film capacitors |
US3619387A (en) * | 1970-01-27 | 1971-11-09 | Bell Telephone Labor Inc | Technique for the fabrication of thin film capacitor including lead dioxide conductive films |
US3679942A (en) * | 1971-02-09 | 1972-07-25 | Rca Corp | Metal-oxide-metal, thin-film capacitors and method of making same |
-
1981
- 1981-07-08 FR FR8113424A patent/FR2509516A1/fr active Granted
-
1982
- 1982-06-24 US US06/391,266 patent/US4475120A/en not_active Expired - Fee Related
- 1982-06-30 EP EP82200814A patent/EP0070064B1/fr not_active Expired
- 1982-06-30 DE DE8282200814T patent/DE3266800D1/de not_active Expired
- 1982-07-05 JP JP57116675A patent/JPS5816560A/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3432918A (en) * | 1963-11-12 | 1969-03-18 | Texas Instruments Inc | Method of making a capacitor by vacuum depositing manganese oxide as the electrolytic layer |
US3714529A (en) * | 1971-05-04 | 1973-01-30 | Microsystems Int Ltd | Thin film capacitor |
FR2138339A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1971-05-24 | 1973-01-05 | Radiotechnique Compelec |
Non-Patent Citations (1)
Title |
---|
EXBK/79 * |
Also Published As
Publication number | Publication date |
---|---|
US4475120A (en) | 1984-10-02 |
EP0070064B1 (fr) | 1985-10-09 |
EP0070064A1 (fr) | 1983-01-19 |
FR2509516B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1984-04-20 |
DE3266800D1 (en) | 1985-11-14 |
JPS5816560A (ja) | 1983-01-31 |
JPH0418472B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-03-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20030062551A1 (en) | Electrode structure including encapsulated adhesion layer | |
EP0098671B1 (fr) | Procédé d'isolement par oxydation anodique de portions métalliques entre elles et dispositif obtenu par ce procédé | |
FR2785088A1 (fr) | Un procede de fabrication d'un substrat pour un dispositif electronique utilisant un agent d'attaque ainsi qu'un dispositif electronique presentant un tel substrat | |
US6433379B1 (en) | Tantalum anodization for in-laid copper metallization capacitor | |
US8110861B1 (en) | MIM capacitor high-k dielectric for increased capacitance density | |
EP2878002A2 (fr) | Procédé pour la réalisation d'une capacité | |
US3201667A (en) | Titanium dioxide capacitor and method for making same | |
US5500385A (en) | Method for manufacturing a silicon capacitor by thinning | |
US6391802B1 (en) | Method of manufacturing an integrated capacitor onto a silicon substrate | |
FR2509516A1 (fr) | Procede destine a accroitre la tension de claquage d'un condensateur integre et condensateur ainsi realise | |
US3968019A (en) | Method of manufacturing low power loss semiconductor device | |
FR2643192A1 (fr) | Procede de fabrication d'un dispositif semi-conducteur comprenant une electrode en metal refractaire sur un substrat semi-isolant | |
US4456506A (en) | Superconducting circuit fabrication | |
CN104332330A (zh) | 一种介质层为阳极氧化膜的薄膜电容器的制造方法 | |
EP0312466A1 (fr) | Procédé de fabrication d'une structure de silicium sur isolant | |
US4524378A (en) | Anodizable metallic contacts to mercury cadmium telleride | |
EP4000090B1 (fr) | Procédé de collage hydrophile de substrats | |
EP0188946B1 (fr) | Elément capacitif intégré sur une pastille de circuit intégré, et procédé de réalisation de cet élément actif | |
EP0045644A2 (en) | Metallic contacts to compound semiconductor devices | |
EP3586360B1 (fr) | Composant electronique muni d'un transistor et de doigts interdigites pour former au moins une partie d'un composant capacitif au sein du composant electronique | |
FR2801425A1 (fr) | Capacite integree a dielectrique hybride | |
FR2773262A1 (fr) | Procede de formation d'elements conducteurs dans un circuit integre | |
US6033534A (en) | Method for producing an Al-containing layer with a planar surface on a substrate having hole structures with a high aspect ratio in the surface | |
EP1316974A1 (fr) | Procédé de fabrication d'un composant électronique incorporant un micro-composant inductif | |
FR3120982A1 (fr) | Dispositif capacitif a haute densite et procede de fabrication d’un tel dispositif |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
CL | Concession to grant licences | ||
ST | Notification of lapse |