FR2505367A1 - Procede d'etamage d'une couche conductrice disposee sur un dielectrique et son application a un circuit multicouches pour circuit hybride - Google Patents
Procede d'etamage d'une couche conductrice disposee sur un dielectrique et son application a un circuit multicouches pour circuit hybride Download PDFInfo
- Publication number
- FR2505367A1 FR2505367A1 FR8109226A FR8109226A FR2505367A1 FR 2505367 A1 FR2505367 A1 FR 2505367A1 FR 8109226 A FR8109226 A FR 8109226A FR 8109226 A FR8109226 A FR 8109226A FR 2505367 A1 FR2505367 A1 FR 2505367A1
- Authority
- FR
- France
- Prior art keywords
- dielectric
- takes place
- tinning
- conductive layer
- solder paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title abstract description 6
- 229910000679 solder Inorganic materials 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims abstract description 21
- 238000007650 screen-printing Methods 0.000 claims abstract description 15
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 12
- 239000000956 alloy Substances 0.000 claims abstract description 12
- 229910052718 tin Inorganic materials 0.000 claims abstract description 10
- 229910052745 lead Inorganic materials 0.000 claims abstract description 6
- 229910052709 silver Inorganic materials 0.000 claims abstract description 6
- 239000011521 glass Substances 0.000 claims description 8
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 4
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 238000002791 soaking Methods 0.000 claims description 4
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 4
- 229910018885 Pt—Au Inorganic materials 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 238000007654 immersion Methods 0.000 abstract 3
- 230000004927 fusion Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 22
- 239000004020 conductor Substances 0.000 description 4
- 238000010411 cooking Methods 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000007790 scraping Methods 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 230000005499 meniscus Effects 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4867—Applying pastes or inks, e.g. screen printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10992—Using different connection materials, e.g. different solders, for the same connection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8109226A FR2505367A1 (fr) | 1981-05-08 | 1981-05-08 | Procede d'etamage d'une couche conductrice disposee sur un dielectrique et son application a un circuit multicouches pour circuit hybride |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8109226A FR2505367A1 (fr) | 1981-05-08 | 1981-05-08 | Procede d'etamage d'une couche conductrice disposee sur un dielectrique et son application a un circuit multicouches pour circuit hybride |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2505367A1 true FR2505367A1 (fr) | 1982-11-12 |
| FR2505367B1 FR2505367B1 (OSRAM) | 1983-07-18 |
Family
ID=9258233
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8109226A Granted FR2505367A1 (fr) | 1981-05-08 | 1981-05-08 | Procede d'etamage d'une couche conductrice disposee sur un dielectrique et son application a un circuit multicouches pour circuit hybride |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2505367A1 (OSRAM) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0259102A3 (en) * | 1986-09-03 | 1988-06-22 | Nortel Networks Corporation | Multi-point solder paste application |
| EP0828410A3 (en) * | 1996-09-09 | 1998-03-18 | Delco Electronics Corporation | Dual-solder process for enhancing reliability of thick-film hybrid circuits |
| EP0745315A4 (en) * | 1994-12-19 | 1999-01-20 | Motorola Inc | SOLDERING PROCESS |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1402767A (fr) * | 1963-08-08 | 1965-06-11 | Ibm | Procédé et appareil pour la fabrication d'éléments fonctionnels microminiaturisés |
| US3292240A (en) * | 1963-08-08 | 1966-12-20 | Ibm | Method of fabricating microminiature functional components |
| DE2410849A1 (de) * | 1974-03-07 | 1975-09-11 | Blaupunkt Werke Gmbh | Verfahren zum aufloeten von miniaturbauelementen |
| DE2415120A1 (de) * | 1974-03-28 | 1975-10-02 | Siemens Ag | Verfahren zur herstellung von halbleiterchips tragenden chiptraegern |
| FR2317850A1 (fr) * | 1975-07-11 | 1977-02-04 | Siderurgie Fse Inst Rech | Dispositif pour l'etamage des circuits imprimes |
| GB2050702A (en) * | 1976-07-21 | 1981-01-07 | Shipley Co | Printed circuits |
-
1981
- 1981-05-08 FR FR8109226A patent/FR2505367A1/fr active Granted
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1402767A (fr) * | 1963-08-08 | 1965-06-11 | Ibm | Procédé et appareil pour la fabrication d'éléments fonctionnels microminiaturisés |
| US3292240A (en) * | 1963-08-08 | 1966-12-20 | Ibm | Method of fabricating microminiature functional components |
| DE2410849A1 (de) * | 1974-03-07 | 1975-09-11 | Blaupunkt Werke Gmbh | Verfahren zum aufloeten von miniaturbauelementen |
| DE2415120A1 (de) * | 1974-03-28 | 1975-10-02 | Siemens Ag | Verfahren zur herstellung von halbleiterchips tragenden chiptraegern |
| FR2317850A1 (fr) * | 1975-07-11 | 1977-02-04 | Siderurgie Fse Inst Rech | Dispositif pour l'etamage des circuits imprimes |
| GB2050702A (en) * | 1976-07-21 | 1981-01-07 | Shipley Co | Printed circuits |
Non-Patent Citations (1)
| Title |
|---|
| EXBK/74 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0259102A3 (en) * | 1986-09-03 | 1988-06-22 | Nortel Networks Corporation | Multi-point solder paste application |
| EP0745315A4 (en) * | 1994-12-19 | 1999-01-20 | Motorola Inc | SOLDERING PROCESS |
| EP0828410A3 (en) * | 1996-09-09 | 1998-03-18 | Delco Electronics Corporation | Dual-solder process for enhancing reliability of thick-film hybrid circuits |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2505367B1 (OSRAM) | 1983-07-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |