FR2500712A1 - Procede d'epargne-soudure de carte imprimee et carte imprimee obtenue selon ce procede - Google Patents

Procede d'epargne-soudure de carte imprimee et carte imprimee obtenue selon ce procede Download PDF

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Publication number
FR2500712A1
FR2500712A1 FR8103400A FR8103400A FR2500712A1 FR 2500712 A1 FR2500712 A1 FR 2500712A1 FR 8103400 A FR8103400 A FR 8103400A FR 8103400 A FR8103400 A FR 8103400A FR 2500712 A1 FR2500712 A1 FR 2500712A1
Authority
FR
France
Prior art keywords
pellets
sheets
card
resin
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8103400A
Other languages
English (en)
French (fr)
Other versions
FR2500712B1 (cs
Inventor
Lucien Bourdain
Jean-Michel Derocq
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR8103400A priority Critical patent/FR2500712A1/fr
Publication of FR2500712A1 publication Critical patent/FR2500712A1/fr
Application granted granted Critical
Publication of FR2500712B1 publication Critical patent/FR2500712B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/224—Anti-weld compositions; Braze stop-off compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0577—Double layer of resist having the same pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Credit Cards Or The Like (AREA)
FR8103400A 1981-02-20 1981-02-20 Procede d'epargne-soudure de carte imprimee et carte imprimee obtenue selon ce procede Granted FR2500712A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8103400A FR2500712A1 (fr) 1981-02-20 1981-02-20 Procede d'epargne-soudure de carte imprimee et carte imprimee obtenue selon ce procede

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8103400A FR2500712A1 (fr) 1981-02-20 1981-02-20 Procede d'epargne-soudure de carte imprimee et carte imprimee obtenue selon ce procede

Publications (2)

Publication Number Publication Date
FR2500712A1 true FR2500712A1 (fr) 1982-08-27
FR2500712B1 FR2500712B1 (cs) 1983-06-17

Family

ID=9255453

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8103400A Granted FR2500712A1 (fr) 1981-02-20 1981-02-20 Procede d'epargne-soudure de carte imprimee et carte imprimee obtenue selon ce procede

Country Status (1)

Country Link
FR (1) FR2500712A1 (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2551618A1 (fr) * 1983-09-02 1985-03-08 Inf Milit Spatiale Aeronaut Procede de fabrication d'un circuit imprime a couches enterrees et circuit imprime obtenu par un tel procede

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3628999A (en) * 1970-03-05 1971-12-21 Frederick W Schneble Jr Plated through hole printed circuit boards

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3628999A (en) * 1970-03-05 1971-12-21 Frederick W Schneble Jr Plated through hole printed circuit boards

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
EXBK/66 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2551618A1 (fr) * 1983-09-02 1985-03-08 Inf Milit Spatiale Aeronaut Procede de fabrication d'un circuit imprime a couches enterrees et circuit imprime obtenu par un tel procede

Also Published As

Publication number Publication date
FR2500712B1 (cs) 1983-06-17

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ST Notification of lapse