FR2490059A1 - Circuit imprime et son procede de fabrication - Google Patents
Circuit imprime et son procede de fabrication Download PDFInfo
- Publication number
- FR2490059A1 FR2490059A1 FR8019462A FR8019462A FR2490059A1 FR 2490059 A1 FR2490059 A1 FR 2490059A1 FR 8019462 A FR8019462 A FR 8019462A FR 8019462 A FR8019462 A FR 8019462A FR 2490059 A1 FR2490059 A1 FR 2490059A1
- Authority
- FR
- France
- Prior art keywords
- conductive
- ink
- support
- networks
- network
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000000976 ink Substances 0.000 claims abstract description 131
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 11
- 238000007650 screen-printing Methods 0.000 claims description 38
- 238000010438 heat treatment Methods 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 24
- 239000003989 dielectric material Substances 0.000 claims description 22
- 238000000151 deposition Methods 0.000 claims description 21
- 230000008021 deposition Effects 0.000 claims description 11
- 229920000728 polyester Polymers 0.000 claims description 4
- 230000000379 polymerizing effect Effects 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 238000004026 adhesive bonding Methods 0.000 claims description 2
- 238000007731 hot pressing Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 239000002966 varnish Substances 0.000 claims description 2
- 239000010408 film Substances 0.000 claims 15
- 229920005862 polyol Polymers 0.000 claims 1
- 150000003077 polyols Chemical class 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
- 229920006267 polyester film Polymers 0.000 abstract description 6
- 239000004020 conductor Substances 0.000 abstract description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 229910052802 copper Inorganic materials 0.000 description 14
- 239000010949 copper Substances 0.000 description 14
- 238000005452 bending Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 206010010071 Coma Diseases 0.000 description 1
- VAYOSLLFUXYJDT-RDTXWAMCSA-N Lysergic acid diethylamide Chemical compound C1=CC(C=2[C@H](N(C)C[C@@H](C=2)C(=O)N(CC)CC)C2)=C3C2=CNC3=C1 VAYOSLLFUXYJDT-RDTXWAMCSA-N 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- 241001311547 Patina Species 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09981—Metallised walls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4685—Manufacturing of cross-over conductors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (12)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8019462A FR2490059A1 (fr) | 1980-09-09 | 1980-09-09 | Circuit imprime et son procede de fabrication |
| DE8181902466T DE3171581D1 (en) | 1980-09-09 | 1981-08-28 | Printed circuit and manufacturing process thereof |
| EP81902466A EP0059206B1 (fr) | 1980-09-09 | 1981-08-28 | Circuit imprime et son procede de fabrication |
| PCT/FR1981/000109 WO1982000938A1 (fr) | 1980-09-09 | 1981-08-28 | Circuit imprime et son procede de fabrication |
| AU75379/81A AU7537981A (en) | 1980-09-09 | 1981-08-28 | Printed circuit and manufacturing process thereof |
| JP56502909A JPS57501353A (enExample) | 1980-09-09 | 1981-08-28 | |
| ES505299A ES505299A0 (es) | 1980-09-09 | 1981-09-08 | Circuito impreso y su procedimiento de fabricacion |
| BE0/205905A BE890272A (fr) | 1980-09-09 | 1981-09-08 | Circuit imprime et son procede de fabrication |
| CA000385491A CA1171549A (en) | 1980-09-09 | 1981-09-09 | Printed circuits and methods of manufacturing same |
| IT8123851A IT1138586B (it) | 1980-09-09 | 1981-09-09 | Circuito stampato e relativo procedimento di fabbricazione |
| NO821481A NO821481L (no) | 1980-09-09 | 1982-05-05 | Trykt krets og fremgangsmaate for fremstilling derav |
| DK204982A DK204982A (da) | 1980-09-09 | 1982-05-06 | Trykt kredsloeb og fremgangsmaade til dets fremstilling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8019462A FR2490059A1 (fr) | 1980-09-09 | 1980-09-09 | Circuit imprime et son procede de fabrication |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2490059A1 true FR2490059A1 (fr) | 1982-03-12 |
| FR2490059B1 FR2490059B1 (enExample) | 1984-07-27 |
Family
ID=9245779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8019462A Granted FR2490059A1 (fr) | 1980-09-09 | 1980-09-09 | Circuit imprime et son procede de fabrication |
Country Status (11)
| Country | Link |
|---|---|
| EP (1) | EP0059206B1 (enExample) |
| JP (1) | JPS57501353A (enExample) |
| AU (1) | AU7537981A (enExample) |
| BE (1) | BE890272A (enExample) |
| CA (1) | CA1171549A (enExample) |
| DK (1) | DK204982A (enExample) |
| ES (1) | ES505299A0 (enExample) |
| FR (1) | FR2490059A1 (enExample) |
| IT (1) | IT1138586B (enExample) |
| NO (1) | NO821481L (enExample) |
| WO (1) | WO1982000938A1 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2527036A1 (fr) * | 1982-05-14 | 1983-11-18 | Radiotechnique Compelec | Procede pour connecter un semiconducteur a des elements d'un support, notamment d'une carte portative |
| US4747211A (en) * | 1987-02-09 | 1988-05-31 | Sheldahl, Inc. | Method and apparatus for preparing conductive screened through holes employing metallic plated polymer thick films |
| IT1224236B (it) * | 1988-05-03 | 1990-09-26 | Cisel Spa | Circuito elettrico, per macchine elettroniche, stampato serigraficamente su pellicola in poliestere, avente struttura multistrato |
| TW349320B (en) * | 1993-12-09 | 1999-01-01 | Methode Electronics Inc | Printed plastic circuits and contracts and method for making same |
| IT1396077B1 (it) * | 2009-10-16 | 2012-11-09 | Automotive Lighting Italia Spa | Dispositivo di illuminazione per veicoli, in particolare autoveicoli, utilizzante diodi led |
| DE102010040867A1 (de) * | 2010-09-16 | 2012-03-22 | Robert Bosch Gmbh | Elektronikbauteil mit verbesserter Leitungsstruktur |
| EP3871476A4 (en) * | 2018-10-25 | 2022-08-24 | Jabil Inc. | Printing of multilayer circuits on graphics |
| CN118039460B (zh) * | 2024-04-15 | 2024-06-28 | 绵阳新能智造科技有限公司 | 一种硅晶片增厚的方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2402379A1 (fr) * | 1977-08-31 | 1979-03-30 | Cayrol Pierre Henri | Perfectionnements apportes aux circuits imprimes |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4876059A (enExample) * | 1972-01-14 | 1973-10-13 | ||
| GB1565207A (en) * | 1975-09-05 | 1980-04-16 | Sinclair Radionics | Printed circuits |
| DE2724399A1 (de) * | 1977-05-28 | 1978-11-30 | Martin Marietta Corp | Verfahren zur herstellung einer mehrschichtigen gedruckten schaltungsplatte mit integralen, flexiblen anschlusstuecken, sowie nach diesem verfahren gefertigte schaltungsplatte |
| DE2831984A1 (de) * | 1977-07-21 | 1979-02-01 | Sharp Kk | Elektrische verbindung zwischen zwei auf getrennte traeger aufgebrachten elektrischen schaltkreisen |
-
1980
- 1980-09-09 FR FR8019462A patent/FR2490059A1/fr active Granted
-
1981
- 1981-08-28 EP EP81902466A patent/EP0059206B1/fr not_active Expired
- 1981-08-28 AU AU75379/81A patent/AU7537981A/en not_active Abandoned
- 1981-08-28 WO PCT/FR1981/000109 patent/WO1982000938A1/fr not_active Ceased
- 1981-08-28 JP JP56502909A patent/JPS57501353A/ja active Pending
- 1981-09-08 BE BE0/205905A patent/BE890272A/fr not_active IP Right Cessation
- 1981-09-08 ES ES505299A patent/ES505299A0/es active Granted
- 1981-09-09 CA CA000385491A patent/CA1171549A/en not_active Expired
- 1981-09-09 IT IT8123851A patent/IT1138586B/it active
-
1982
- 1982-05-05 NO NO821481A patent/NO821481L/no unknown
- 1982-05-06 DK DK204982A patent/DK204982A/da not_active Application Discontinuation
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2402379A1 (fr) * | 1977-08-31 | 1979-03-30 | Cayrol Pierre Henri | Perfectionnements apportes aux circuits imprimes |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0059206B1 (fr) | 1985-07-31 |
| IT8123851A0 (it) | 1981-09-09 |
| DK204982A (da) | 1982-05-06 |
| ES8302403A1 (es) | 1983-01-01 |
| CA1171549A (en) | 1984-07-24 |
| EP0059206A1 (fr) | 1982-09-08 |
| ES505299A0 (es) | 1983-01-01 |
| BE890272A (fr) | 1982-03-08 |
| NO821481L (no) | 1982-05-05 |
| WO1982000938A1 (fr) | 1982-03-18 |
| AU7537981A (en) | 1982-04-08 |
| IT1138586B (it) | 1986-09-17 |
| JPS57501353A (enExample) | 1982-07-29 |
| FR2490059B1 (enExample) | 1984-07-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| TP | Transmission of property | ||
| ST | Notification of lapse |