FR2487580A1 - Dispositif semiconducteur a enrobage isolant comportant un dissipateur de chaleur apparent, et son procede de fabrication - Google Patents

Dispositif semiconducteur a enrobage isolant comportant un dissipateur de chaleur apparent, et son procede de fabrication Download PDF

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Publication number
FR2487580A1
FR2487580A1 FR8016124A FR8016124A FR2487580A1 FR 2487580 A1 FR2487580 A1 FR 2487580A1 FR 8016124 A FR8016124 A FR 8016124A FR 8016124 A FR8016124 A FR 8016124A FR 2487580 A1 FR2487580 A1 FR 2487580A1
Authority
FR
France
Prior art keywords
conductors
dissipator
heat sink
connection
edges
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8016124A
Other languages
English (en)
French (fr)
Other versions
FR2487580B1 (enExample
Inventor
Roger Chabbal
Jean-Paul Le Goc
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Le Materiel Telephonique Thomson CSF
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Le Materiel Telephonique Thomson CSF filed Critical Le Materiel Telephonique Thomson CSF
Priority to FR8016124A priority Critical patent/FR2487580A1/fr
Publication of FR2487580A1 publication Critical patent/FR2487580A1/fr
Application granted granted Critical
Publication of FR2487580B1 publication Critical patent/FR2487580B1/fr
Granted legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
FR8016124A 1980-07-22 1980-07-22 Dispositif semiconducteur a enrobage isolant comportant un dissipateur de chaleur apparent, et son procede de fabrication Granted FR2487580A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8016124A FR2487580A1 (fr) 1980-07-22 1980-07-22 Dispositif semiconducteur a enrobage isolant comportant un dissipateur de chaleur apparent, et son procede de fabrication

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8016124A FR2487580A1 (fr) 1980-07-22 1980-07-22 Dispositif semiconducteur a enrobage isolant comportant un dissipateur de chaleur apparent, et son procede de fabrication

Publications (2)

Publication Number Publication Date
FR2487580A1 true FR2487580A1 (fr) 1982-01-29
FR2487580B1 FR2487580B1 (enExample) 1984-02-17

Family

ID=9244392

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8016124A Granted FR2487580A1 (fr) 1980-07-22 1980-07-22 Dispositif semiconducteur a enrobage isolant comportant un dissipateur de chaleur apparent, et son procede de fabrication

Country Status (1)

Country Link
FR (1) FR2487580A1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0090503A3 (en) * 1982-03-25 1985-05-22 Texas Instruments Incorporated Apparatus and method of packaging a semiconductor device
EP0746188A1 (fr) * 1995-05-29 1996-12-04 STMicroelectronics S.A. Utilisation d'un micromodule comme boîtier de montage en surface et procédé correspondant
FR2734984A1 (fr) * 1995-05-29 1996-12-06 Sgs Thomson Microelectronics Utilisation d'un micromodule comme boitier de montage en surface et procede correspondant
EP0817265A1 (de) * 1996-06-28 1998-01-07 Siemens Aktiengesellschaft Zuleitungsrahmen für einen integrierten Schaltkreis und ein einen Zuteilungsrahmen enthaltendes Bauteil mit Kühlkörper

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2305026A1 (fr) * 1975-03-17 1976-10-15 Nat Semiconductor Corp Module de circuit integre avec dissipateur de chaleur a surface libre d'enrobage, exposee a travers le fond du module

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2305026A1 (fr) * 1975-03-17 1976-10-15 Nat Semiconductor Corp Module de circuit integre avec dissipateur de chaleur a surface libre d'enrobage, exposee a travers le fond du module

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0090503A3 (en) * 1982-03-25 1985-05-22 Texas Instruments Incorporated Apparatus and method of packaging a semiconductor device
EP0746188A1 (fr) * 1995-05-29 1996-12-04 STMicroelectronics S.A. Utilisation d'un micromodule comme boîtier de montage en surface et procédé correspondant
FR2734984A1 (fr) * 1995-05-29 1996-12-06 Sgs Thomson Microelectronics Utilisation d'un micromodule comme boitier de montage en surface et procede correspondant
US5917706A (en) * 1995-05-29 1999-06-29 Sgs-Thomson Microelectronics S.A. Chip card micromodule as a surface-mount device
US6259022B1 (en) 1995-05-29 2001-07-10 Sgs-Thomson Microelectronics S.A. Chip card micromodule as a surface-mount device
EP0817265A1 (de) * 1996-06-28 1998-01-07 Siemens Aktiengesellschaft Zuleitungsrahmen für einen integrierten Schaltkreis und ein einen Zuteilungsrahmen enthaltendes Bauteil mit Kühlkörper

Also Published As

Publication number Publication date
FR2487580B1 (enExample) 1984-02-17

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