FR2487580B1 - - Google Patents
Info
- Publication number
- FR2487580B1 FR2487580B1 FR8016124A FR8016124A FR2487580B1 FR 2487580 B1 FR2487580 B1 FR 2487580B1 FR 8016124 A FR8016124 A FR 8016124A FR 8016124 A FR8016124 A FR 8016124A FR 2487580 B1 FR2487580 B1 FR 2487580B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H10W70/04—
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- H10W70/421—
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- H10W70/461—
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- H10W74/111—
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- H10W74/00—
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- H10W90/756—
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8016124A FR2487580A1 (fr) | 1980-07-22 | 1980-07-22 | Dispositif semiconducteur a enrobage isolant comportant un dissipateur de chaleur apparent, et son procede de fabrication |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8016124A FR2487580A1 (fr) | 1980-07-22 | 1980-07-22 | Dispositif semiconducteur a enrobage isolant comportant un dissipateur de chaleur apparent, et son procede de fabrication |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2487580A1 FR2487580A1 (fr) | 1982-01-29 |
| FR2487580B1 true FR2487580B1 (enExample) | 1984-02-17 |
Family
ID=9244392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8016124A Granted FR2487580A1 (fr) | 1980-07-22 | 1980-07-22 | Dispositif semiconducteur a enrobage isolant comportant un dissipateur de chaleur apparent, et son procede de fabrication |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2487580A1 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0090503A3 (en) * | 1982-03-25 | 1985-05-22 | Texas Instruments Incorporated | Apparatus and method of packaging a semiconductor device |
| FR2734983B1 (fr) * | 1995-05-29 | 1997-07-04 | Sgs Thomson Microelectronics | Utilisation d'un micromodule comme boitier de montage en surface et procede correspondant |
| FR2734984B1 (fr) * | 1995-05-29 | 1997-08-22 | Sgs Thomson Microelectronics | Utilisation d'un micromodule comme boitier de montage en surface et procede correspondant |
| JPH1065085A (ja) * | 1996-06-28 | 1998-03-06 | Siemens Ag | パワーパッケージ内で使用するためのリードフレーム |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3930114A (en) * | 1975-03-17 | 1975-12-30 | Nat Semiconductor Corp | Integrated circuit package utilizing novel heat sink structure |
-
1980
- 1980-07-22 FR FR8016124A patent/FR2487580A1/fr active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| FR2487580A1 (fr) | 1982-01-29 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |