FR2479520A1 - Transducteur composite a adressage electrique - Google Patents

Transducteur composite a adressage electrique Download PDF

Info

Publication number
FR2479520A1
FR2479520A1 FR8006687A FR8006687A FR2479520A1 FR 2479520 A1 FR2479520 A1 FR 2479520A1 FR 8006687 A FR8006687 A FR 8006687A FR 8006687 A FR8006687 A FR 8006687A FR 2479520 A1 FR2479520 A1 FR 2479520A1
Authority
FR
France
Prior art keywords
transducer
panel
elements
switching elements
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8006687A
Other languages
English (en)
French (fr)
Other versions
FR2479520B1 (oth
Inventor
Christian Val
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR8006687A priority Critical patent/FR2479520A1/fr
Publication of FR2479520A1 publication Critical patent/FR2479520A1/fr
Application granted granted Critical
Publication of FR2479520B1 publication Critical patent/FR2479520B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
FR8006687A 1980-03-26 1980-03-26 Transducteur composite a adressage electrique Granted FR2479520A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8006687A FR2479520A1 (fr) 1980-03-26 1980-03-26 Transducteur composite a adressage electrique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8006687A FR2479520A1 (fr) 1980-03-26 1980-03-26 Transducteur composite a adressage electrique

Publications (2)

Publication Number Publication Date
FR2479520A1 true FR2479520A1 (fr) 1981-10-02
FR2479520B1 FR2479520B1 (oth) 1984-08-03

Family

ID=9240114

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8006687A Granted FR2479520A1 (fr) 1980-03-26 1980-03-26 Transducteur composite a adressage electrique

Country Status (1)

Country Link
FR (1) FR2479520A1 (oth)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8359740B2 (en) 2008-12-19 2013-01-29 3D Plus Process for the wafer-scale fabrication of electronic modules for surface mounting

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1807681A1 (de) * 1968-11-08 1970-06-11 Licentia Gmbh Schaltmatrix mit zwei Leiterplatten,deren Leiter zusammen eine Kreuzschienenanordnung bilden
FR2357072A1 (fr) * 1976-06-30 1978-01-27 Ibm Element d'interconnexion a couches multiples et son procede de fabrication

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1807681A1 (de) * 1968-11-08 1970-06-11 Licentia Gmbh Schaltmatrix mit zwei Leiterplatten,deren Leiter zusammen eine Kreuzschienenanordnung bilden
FR2357072A1 (fr) * 1976-06-30 1978-01-27 Ibm Element d'interconnexion a couches multiples et son procede de fabrication

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
EXBK/74 *
EXBK/78 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8359740B2 (en) 2008-12-19 2013-01-29 3D Plus Process for the wafer-scale fabrication of electronic modules for surface mounting

Also Published As

Publication number Publication date
FR2479520B1 (oth) 1984-08-03

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