FR2474806A1 - Systeme d'assemblage dans des plans distincts de cartes imprimees sur une meme platine, et montage electronique comportant de tels systemes - Google Patents
Systeme d'assemblage dans des plans distincts de cartes imprimees sur une meme platine, et montage electronique comportant de tels systemes Download PDFInfo
- Publication number
- FR2474806A1 FR2474806A1 FR8001891A FR8001891A FR2474806A1 FR 2474806 A1 FR2474806 A1 FR 2474806A1 FR 8001891 A FR8001891 A FR 8001891A FR 8001891 A FR8001891 A FR 8001891A FR 2474806 A1 FR2474806 A1 FR 2474806A1
- Authority
- FR
- France
- Prior art keywords
- assembly
- assembly system
- printed
- cards
- folding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 title claims description 10
- 229910052697 platinum Inorganic materials 0.000 title claims description 5
- 229910052751 metal Inorganic materials 0.000 claims abstract description 3
- 239000002184 metal Substances 0.000 claims abstract description 3
- 238000002513 implantation Methods 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 2
- 150000001768 cations Chemical class 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract 1
- 238000005553 drilling Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 235000010603 pastilles Nutrition 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/0909—Preformed cutting or breaking line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8001891A FR2474806A1 (fr) | 1980-01-29 | 1980-01-29 | Systeme d'assemblage dans des plans distincts de cartes imprimees sur une meme platine, et montage electronique comportant de tels systemes |
| EP19810400053 EP0033677B1 (fr) | 1980-01-29 | 1981-01-16 | Assemblage de cartes de circuits imprimés et son procédé de fabrication |
| DE8181400053T DE3160282D1 (en) | 1980-01-29 | 1981-01-16 | Assembly of printed-circuit cards and process for producing it |
| ES498893A ES498893A0 (es) | 1980-01-29 | 1981-01-28 | Disposicion de, al menos, dos tarjetas de circuitos impresos. |
| JP1091381A JPS56120186A (en) | 1980-01-29 | 1981-01-29 | Printed board assembly |
| PL22943981A PL229439A1 (enExample) | 1980-01-29 | 1981-01-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8001891A FR2474806A1 (fr) | 1980-01-29 | 1980-01-29 | Systeme d'assemblage dans des plans distincts de cartes imprimees sur une meme platine, et montage electronique comportant de tels systemes |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2474806A1 true FR2474806A1 (fr) | 1981-07-31 |
| FR2474806B1 FR2474806B1 (enExample) | 1982-08-20 |
Family
ID=9237989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8001891A Granted FR2474806A1 (fr) | 1980-01-29 | 1980-01-29 | Systeme d'assemblage dans des plans distincts de cartes imprimees sur une meme platine, et montage electronique comportant de tels systemes |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP0033677B1 (enExample) |
| JP (1) | JPS56120186A (enExample) |
| DE (1) | DE3160282D1 (enExample) |
| ES (1) | ES498893A0 (enExample) |
| FR (1) | FR2474806A1 (enExample) |
| PL (1) | PL229439A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4520561A (en) * | 1983-12-16 | 1985-06-04 | Rca Corporation | Method of fabricating an electronic circuit including an aperture through the substrate thereof |
| JPS60124071U (ja) * | 1984-01-30 | 1985-08-21 | クラリオン株式会社 | 印刷配線基板の固定構造 |
| US4769741A (en) * | 1985-12-20 | 1988-09-06 | General Electric Company | Electrical module and method for the manufacture thereof |
| FR2608328A1 (fr) * | 1986-12-10 | 1988-06-17 | Ducellier & Cie | Procede de connexion d'un premier circuit imprime a un deuxieme circuit imprime et circuits imprimes permettant la mise en oeuvre d'un tel procede et ainsi interconnectes |
| JPS6423593A (en) * | 1987-07-18 | 1989-01-26 | Nippon Chemicon | Device for connection of printed board |
| DE3836033A1 (de) * | 1988-10-22 | 1990-04-26 | Hella Kg Hueck & Co | Elektrisches geraet, insbesondere fuer kraftfahrzeuge |
| JPH0727180U (ja) * | 1993-10-07 | 1995-05-19 | 富士通テン株式会社 | 電子回路基板の高密度実装構造 |
| JP5288409B2 (ja) * | 2009-04-08 | 2013-09-11 | シャープ株式会社 | 配線シート付き太陽電池セル、太陽電池モジュール、配線シート付き太陽電池セルの製造方法および太陽電池モジュールの製造方法 |
| JP5456128B2 (ja) * | 2012-09-27 | 2014-03-26 | シャープ株式会社 | 太陽電池モジュール |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1239226A (fr) * | 1958-10-30 | 1960-08-19 | Philips Nv | Châssis d'appareil à câblage formé par des couches métalliques, et son procédé de fabrication |
| FR1481461A (fr) * | 1965-06-01 | 1967-05-19 | Philips Nv | Plaque à câblage imprimé |
| US3780431A (en) * | 1972-09-25 | 1973-12-25 | Bowmar Ali Inc | Process for producing computer circuits utilizing printed circuit boards |
-
1980
- 1980-01-29 FR FR8001891A patent/FR2474806A1/fr active Granted
-
1981
- 1981-01-16 DE DE8181400053T patent/DE3160282D1/de not_active Expired
- 1981-01-16 EP EP19810400053 patent/EP0033677B1/fr not_active Expired
- 1981-01-28 ES ES498893A patent/ES498893A0/es active Granted
- 1981-01-29 PL PL22943981A patent/PL229439A1/xx unknown
- 1981-01-29 JP JP1091381A patent/JPS56120186A/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1239226A (fr) * | 1958-10-30 | 1960-08-19 | Philips Nv | Châssis d'appareil à câblage formé par des couches métalliques, et son procédé de fabrication |
| FR1481461A (fr) * | 1965-06-01 | 1967-05-19 | Philips Nv | Plaque à câblage imprimé |
| US3780431A (en) * | 1972-09-25 | 1973-12-25 | Bowmar Ali Inc | Process for producing computer circuits utilizing printed circuit boards |
Also Published As
| Publication number | Publication date |
|---|---|
| ES8204908A1 (es) | 1982-05-01 |
| JPS56120186A (en) | 1981-09-21 |
| EP0033677A2 (fr) | 1981-08-12 |
| EP0033677B1 (fr) | 1983-05-18 |
| DE3160282D1 (en) | 1983-07-07 |
| FR2474806B1 (enExample) | 1982-08-20 |
| ES498893A0 (es) | 1982-05-01 |
| PL229439A1 (enExample) | 1981-10-02 |
| EP0033677A3 (en) | 1981-08-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |