FR2470445B1 - - Google Patents
Info
- Publication number
- FR2470445B1 FR2470445B1 FR7928692A FR7928692A FR2470445B1 FR 2470445 B1 FR2470445 B1 FR 2470445B1 FR 7928692 A FR7928692 A FR 7928692A FR 7928692 A FR7928692 A FR 7928692A FR 2470445 B1 FR2470445 B1 FR 2470445B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
- H01L25/072—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6644—Packaging aspects of high-frequency amplifiers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microwave Amplifiers (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Bipolar Transistors (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7928692A FR2470445A1 (fr) | 1979-11-21 | 1979-11-21 | Dispositif de mise en parallele de transistors bipolaires de puissance en tres haute frequence et amplificateur utilisant ce dispositif |
| EP80401449A EP0030168B1 (fr) | 1979-11-21 | 1980-10-09 | Dispositif de mise en parallèle de transistors de puissance en très haute fréquence |
| DE8080401449T DE3063167D1 (en) | 1979-11-21 | 1980-10-09 | Device for parallel arrangement of very high frequency power transistors |
| US06/208,006 US4408219A (en) | 1979-11-21 | 1980-11-18 | Device for connecting in parallel power transistors in very high frequency |
| JP16400280A JPS5683960A (en) | 1979-11-21 | 1980-11-20 | Device for connecting power transistors in parallel for superhigh frequency |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7928692A FR2470445A1 (fr) | 1979-11-21 | 1979-11-21 | Dispositif de mise en parallele de transistors bipolaires de puissance en tres haute frequence et amplificateur utilisant ce dispositif |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2470445A1 FR2470445A1 (fr) | 1981-05-29 |
| FR2470445B1 true FR2470445B1 (OSRAM) | 1983-04-29 |
Family
ID=9231942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7928692A Granted FR2470445A1 (fr) | 1979-11-21 | 1979-11-21 | Dispositif de mise en parallele de transistors bipolaires de puissance en tres haute frequence et amplificateur utilisant ce dispositif |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US4408219A (OSRAM) |
| EP (1) | EP0030168B1 (OSRAM) |
| JP (1) | JPS5683960A (OSRAM) |
| DE (1) | DE3063167D1 (OSRAM) |
| FR (1) | FR2470445A1 (OSRAM) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL8601743A (nl) * | 1985-07-05 | 1987-02-02 | Acrian Inc | Transistorpakket. |
| US4639760A (en) * | 1986-01-21 | 1987-01-27 | Motorola, Inc. | High power RF transistor assembly |
| JPH088269B2 (ja) * | 1986-10-22 | 1996-01-29 | シーメンス、アクチエンゲゼルシヤフト | 半導体デバイス |
| USRE34395E (en) * | 1989-06-15 | 1993-10-05 | Cray Research, Inc. | Method of making a chip carrier with terminating resistive elements |
| US6297700B1 (en) * | 2000-02-18 | 2001-10-02 | Ultrarf, Inc. | RF power transistor having cascaded cells with phase matching between cells |
| EP1596436A1 (en) * | 2004-05-12 | 2005-11-16 | Seiko Epson Corporation | Electronic circuit and method for manufacturing an electronic circuit |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE760031A (fr) * | 1969-12-11 | 1971-05-17 | Rca Corp | Boitier pour module de puissance hybride a semiconducteurs |
| DE7512573U (de) * | 1975-04-19 | 1975-09-04 | Semikron Gesellschaft Fuer Gleichri | Halbleitergleichrichteranordnung |
| DE2731211A1 (de) * | 1977-07-11 | 1979-01-25 | Semikron Gleichrichterbau | Halbleiterbaueinheit |
| US4296456A (en) * | 1980-06-02 | 1981-10-20 | Burroughs Corporation | Electronic package for high density integrated circuits |
-
1979
- 1979-11-21 FR FR7928692A patent/FR2470445A1/fr active Granted
-
1980
- 1980-10-09 EP EP80401449A patent/EP0030168B1/fr not_active Expired
- 1980-10-09 DE DE8080401449T patent/DE3063167D1/de not_active Expired
- 1980-11-18 US US06/208,006 patent/US4408219A/en not_active Expired - Lifetime
- 1980-11-20 JP JP16400280A patent/JPS5683960A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| FR2470445A1 (fr) | 1981-05-29 |
| JPS5683960A (en) | 1981-07-08 |
| EP0030168A1 (fr) | 1981-06-10 |
| DE3063167D1 (en) | 1983-06-16 |
| US4408219A (en) | 1983-10-04 |
| EP0030168B1 (fr) | 1983-05-11 |