FR2469476A1 - Procede pour appliquer un doublage de cuivre sur des tableaux a circuits imprimes et d'autres supports non metalliques - Google Patents

Procede pour appliquer un doublage de cuivre sur des tableaux a circuits imprimes et d'autres supports non metalliques

Info

Publication number
FR2469476A1
FR2469476A1 FR8023693A FR8023693A FR2469476A1 FR 2469476 A1 FR2469476 A1 FR 2469476A1 FR 8023693 A FR8023693 A FR 8023693A FR 8023693 A FR8023693 A FR 8023693A FR 2469476 A1 FR2469476 A1 FR 2469476A1
Authority
FR
France
Prior art keywords
printed circuit
circuit boards
copper lining
applying copper
metallic media
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8023693A
Other languages
English (en)
French (fr)
Other versions
FR2469476B1 (enExample
Inventor
Thomas P Malak
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harshaw Chemical Co
Original Assignee
Harshaw Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harshaw Chemical Co filed Critical Harshaw Chemical Co
Publication of FR2469476A1 publication Critical patent/FR2469476A1/fr
Application granted granted Critical
Publication of FR2469476B1 publication Critical patent/FR2469476B1/fr
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
FR8023693A 1979-11-09 1980-11-06 Procede pour appliquer un doublage de cuivre sur des tableaux a circuits imprimes et d'autres supports non metalliques Granted FR2469476A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/093,081 US4242181A (en) 1979-11-09 1979-11-09 Copper plating process for printed circuit boards

Publications (2)

Publication Number Publication Date
FR2469476A1 true FR2469476A1 (fr) 1981-05-22
FR2469476B1 FR2469476B1 (enExample) 1984-12-14

Family

ID=22236909

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8023693A Granted FR2469476A1 (fr) 1979-11-09 1980-11-06 Procede pour appliquer un doublage de cuivre sur des tableaux a circuits imprimes et d'autres supports non metalliques

Country Status (7)

Country Link
US (1) US4242181A (enExample)
JP (1) JPS5684494A (enExample)
CA (1) CA1142263A (enExample)
DE (1) DE3041962A1 (enExample)
FR (1) FR2469476A1 (enExample)
GB (1) GB2062681B (enExample)
NL (1) NL8006113A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4695348A (en) * 1986-09-15 1987-09-22 Psi Star Copper etching process and product
US4990224A (en) * 1988-12-21 1991-02-05 International Business Machines Corporation Copper plating bath and process for difficult to plate metals
US4954226A (en) * 1988-12-21 1990-09-04 International Business Machines Corporation Additive plating bath and process
US5100518A (en) * 1990-12-20 1992-03-31 At&T Bell Laboratories Method and apparatus for plating insulating strip
US6024857A (en) * 1997-10-08 2000-02-15 Novellus Systems, Inc. Electroplating additive for filling sub-micron features
CA3119028A1 (en) 2018-11-07 2020-05-14 Coventya, Inc. Satin copper bath and method of depositing a satin copper layer

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2029481A1 (enExample) * 1969-01-27 1970-10-23 Kewanee Oil Co
US3769179A (en) * 1972-01-19 1973-10-30 Kewanee Oil Co Copper plating process for printed circuits

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2029481A1 (enExample) * 1969-01-27 1970-10-23 Kewanee Oil Co
US3769179A (en) * 1972-01-19 1973-10-30 Kewanee Oil Co Copper plating process for printed circuits

Also Published As

Publication number Publication date
JPS5684494A (en) 1981-07-09
US4242181A (en) 1980-12-30
JPS6314069B2 (enExample) 1988-03-29
CA1142263A (en) 1983-03-01
GB2062681A (en) 1981-05-28
NL8006113A (nl) 1981-06-01
GB2062681B (en) 1983-11-02
FR2469476B1 (enExample) 1984-12-14
DE3041962A1 (de) 1981-05-21

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Legal Events

Date Code Title Description
ST Notification of lapse