FR2456369A1 - PROGRAMMABLE MEMORY AND PROGRAMMING METHOD - Google Patents
PROGRAMMABLE MEMORY AND PROGRAMMING METHODInfo
- Publication number
- FR2456369A1 FR2456369A1 FR8010399A FR8010399A FR2456369A1 FR 2456369 A1 FR2456369 A1 FR 2456369A1 FR 8010399 A FR8010399 A FR 8010399A FR 8010399 A FR8010399 A FR 8010399A FR 2456369 A1 FR2456369 A1 FR 2456369A1
- Authority
- FR
- France
- Prior art keywords
- programmable memory
- programming method
- resistor
- corresponding separate
- diode13
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
- G11C17/14—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
- G11C17/16—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM using electrically-fusible links
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
- H01L23/5256—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0214—Particular design considerations for integrated circuits for internal polarisation, e.g. I2L
- H01L27/0229—Particular design considerations for integrated circuits for internal polarisation, e.g. I2L of bipolar structures
- H01L27/0233—Integrated injection logic structures [I2L]
- H01L27/0244—I2L structures integrated in combination with analog structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Abstract
MEMOIRE AISEMENT PROGRAMMABLE SUR LE LIEU DE L'UTILISATION. ELLE COMPREND PLUSIEURS CIRCUITS DE SORTIE12, 18, 19, 20, 21 REUNIS CHACUN A UNE DIODE SEPAREE CORRESPONDANTE13, 14 PAR L'INTERMEDIAIRE D'UNE RESISTANCE SEPAREE CORRESPONDANTE 17 ET EN CE QU'UNE CONNEXION INDIVIDUELLE DE PROGRAMMATION 48 EST ELECTRIQUEMENT ASSOCIEE RESPECTIVEMENT A CHAQUE JONCTION42 RESISTANCE-DIODE. APPLICATION AUX DISPOSITIFS A LOGIQUE A INJECTION INTEGREE.EASY PROGRAMMABLE MEMORY AT THE LOCATION OF USE. IT INCLUDES SEVERAL OUTPUT CIRCUITS12, 18, 19, 20, 21 EACH ASSOCIATED WITH A CORRESPONDING SEPARATE DIODE13, 14 THROUGH A CORRESPONDING SEPARATE RESISTOR 17 AND AS AN INDIVIDUAL PROGRAMMING CONNECTION 48 IS RESPECTIVELY ASSOCIATED WITH RESPECTING EACH JUNCTION 42 RESISTOR-DIODE. APPLICATION TO INTEGRATED INJECTION LOGIC DEVICES.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US3777079A | 1979-05-10 | 1979-05-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR2456369A1 true FR2456369A1 (en) | 1980-12-05 |
Family
ID=21896235
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8010399A Pending FR2456369A1 (en) | 1979-05-10 | 1980-05-09 | PROGRAMMABLE MEMORY AND PROGRAMMING METHOD |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS5694A (en) |
DE (1) | DE3017636A1 (en) |
FR (1) | FR2456369A1 (en) |
GB (1) | GB2052905B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0245014A2 (en) * | 1986-05-07 | 1987-11-11 | Advanced Micro Devices, Inc. | Seal structure for an integrated circuit |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR0149259B1 (en) * | 1995-06-30 | 1998-10-15 | 김광호 | Fuse signature device for semiconductor memory |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3641516A (en) * | 1969-09-15 | 1972-02-08 | Ibm | Write once read only store semiconductor memory |
US3810127A (en) * | 1970-06-23 | 1974-05-07 | Intel Corp | Programmable circuit {13 {11 the method of programming thereof and the devices so programmed |
US3848238A (en) * | 1970-07-13 | 1974-11-12 | Intersil Inc | Double junction read only memory |
FR2334170A1 (en) * | 1975-12-05 | 1977-07-01 | Honeywell Bull Soc Ind | DEAD MEMORY BUILT-IN |
US4152627A (en) * | 1977-06-10 | 1979-05-01 | Monolithic Memories Inc. | Low power write-once, read-only memory array |
-
1980
- 1980-05-08 DE DE19803017636 patent/DE3017636A1/en not_active Withdrawn
- 1980-05-09 JP JP6079380A patent/JPS5694A/en active Pending
- 1980-05-09 GB GB8015459A patent/GB2052905B/en not_active Expired
- 1980-05-09 FR FR8010399A patent/FR2456369A1/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3641516A (en) * | 1969-09-15 | 1972-02-08 | Ibm | Write once read only store semiconductor memory |
US3810127A (en) * | 1970-06-23 | 1974-05-07 | Intel Corp | Programmable circuit {13 {11 the method of programming thereof and the devices so programmed |
US3848238A (en) * | 1970-07-13 | 1974-11-12 | Intersil Inc | Double junction read only memory |
FR2334170A1 (en) * | 1975-12-05 | 1977-07-01 | Honeywell Bull Soc Ind | DEAD MEMORY BUILT-IN |
US4152627A (en) * | 1977-06-10 | 1979-05-01 | Monolithic Memories Inc. | Low power write-once, read-only memory array |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0245014A2 (en) * | 1986-05-07 | 1987-11-11 | Advanced Micro Devices, Inc. | Seal structure for an integrated circuit |
EP0245014A3 (en) * | 1986-05-07 | 1989-07-12 | Advanced Micro Devices, Inc. | Seal structure for an integrated circuit |
Also Published As
Publication number | Publication date |
---|---|
GB2052905A (en) | 1981-01-28 |
JPS5694A (en) | 1981-01-06 |
DE3017636A1 (en) | 1980-11-20 |
GB2052905B (en) | 1983-11-09 |
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