FR2446541B1 - - Google Patents

Info

Publication number
FR2446541B1
FR2446541B1 FR7900748A FR7900748A FR2446541B1 FR 2446541 B1 FR2446541 B1 FR 2446541B1 FR 7900748 A FR7900748 A FR 7900748A FR 7900748 A FR7900748 A FR 7900748A FR 2446541 B1 FR2446541 B1 FR 2446541B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7900748A
Other versions
FR2446541A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SEV ALTERNATEURS
Original Assignee
SEV ALTERNATEURS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SEV ALTERNATEURS filed Critical SEV ALTERNATEURS
Priority to FR7900748A priority Critical patent/FR2446541A1/fr
Priority to FR7910042A priority patent/FR2454699A2/fr
Publication of FR2446541A1 publication Critical patent/FR2446541A1/fr
Application granted granted Critical
Publication of FR2446541B1 publication Critical patent/FR2446541B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01067—Holmium [Ho]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01094—Plutonium [Pu]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Synchronous Machinery (AREA)
FR7900748A 1979-01-12 1979-01-12 Diode de puissance destinee notamment a equiper un pont redresseur d'alternateur Granted FR2446541A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR7900748A FR2446541A1 (fr) 1979-01-12 1979-01-12 Diode de puissance destinee notamment a equiper un pont redresseur d'alternateur
FR7910042A FR2454699A2 (fr) 1979-01-12 1979-04-20 Diode de puissance destinee notamment a equiper un pont redresseur d'alternateur

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7900748A FR2446541A1 (fr) 1979-01-12 1979-01-12 Diode de puissance destinee notamment a equiper un pont redresseur d'alternateur

Publications (2)

Publication Number Publication Date
FR2446541A1 FR2446541A1 (fr) 1980-08-08
FR2446541B1 true FR2446541B1 (fr) 1983-02-11

Family

ID=9220684

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7900748A Granted FR2446541A1 (fr) 1979-01-12 1979-01-12 Diode de puissance destinee notamment a equiper un pont redresseur d'alternateur

Country Status (1)

Country Link
FR (1) FR2446541A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4489374A (en) * 1981-09-21 1984-12-18 Mitsubishi Denki Kabushiki Kaisha Rectifying apparatus for automotive A.C. generator
FR2813441B1 (fr) * 2000-08-31 2005-01-14 Valeo Equip Electr Moteur Diode de puissance destinee a equiper le pont redresseur d'une machine electrique tournante tel qu'un alternateur pour vehicule automobile
FR2813442A1 (fr) * 2000-08-31 2002-03-01 Valeo Equip Electr Moteur Diode de puissance destinee a equiper le pont redresseur d'une machine electrique tournante telle qu'un alternateur pour vehicule automobile

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB975573A (en) * 1961-05-26 1964-11-18 Standard Telephones Cables Ltd Improvements in or relating to semiconductor devices
DE1614478A1 (de) * 1967-04-03 1970-07-16 Siemens Ag Baueinheit mit zwei Sammelschienen,auf den mindestens je ein Halbleiterelement befestigt ist
DE1614479A1 (de) * 1967-04-03 1970-07-16 Siemens Ag Halbleiterbauelement
DE1944515A1 (de) * 1969-09-02 1971-03-04 Siemens Ag Halbleiterbauelement mit Kunststoffuellung
JPS5271176A (en) * 1975-12-11 1977-06-14 Sato Tokuo Method of manufacturing base for pressure contact type semiconductor

Also Published As

Publication number Publication date
FR2446541A1 (fr) 1980-08-08

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Legal Events

Date Code Title Description
ST Notification of lapse