FR2442509B1 - Procede pour manipuler automatiquement des substrats ceramiques pour circuits integres et substrats pour la mise en oeuvre de ce procede - Google Patents
Procede pour manipuler automatiquement des substrats ceramiques pour circuits integres et substrats pour la mise en oeuvre de ce procedeInfo
- Publication number
- FR2442509B1 FR2442509B1 FR7929062A FR7929062A FR2442509B1 FR 2442509 B1 FR2442509 B1 FR 2442509B1 FR 7929062 A FR7929062 A FR 7929062A FR 7929062 A FR7929062 A FR 7929062A FR 2442509 B1 FR2442509 B1 FR 2442509B1
- Authority
- FR
- France
- Prior art keywords
- substrates
- carrying
- integrated circuits
- automatically handling
- handling ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 title 2
- 239000000919 ceramic Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/16—Two dimensionally sectional layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24777—Edge feature
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structure Of Printed Boards (AREA)
- Compositions Of Oxide Ceramics (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14579478A JPS5572064A (en) | 1978-11-25 | 1978-11-25 | Ceramic substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2442509A1 FR2442509A1 (fr) | 1980-06-20 |
FR2442509B1 true FR2442509B1 (fr) | 1985-06-21 |
Family
ID=15393301
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7929062A Expired FR2442509B1 (fr) | 1978-11-25 | 1979-11-26 | Procede pour manipuler automatiquement des substrats ceramiques pour circuits integres et substrats pour la mise en oeuvre de ce procede |
Country Status (4)
Country | Link |
---|---|
US (1) | US4277528A (fr) |
JP (1) | JPS5572064A (fr) |
DE (1) | DE2947270C3 (fr) |
FR (1) | FR2442509B1 (fr) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5762546A (en) * | 1980-10-01 | 1982-04-15 | Narumi China Corp | Ceramic substrate for semiconductor package |
JPS5849445U (ja) * | 1981-09-29 | 1983-04-04 | 日本特殊陶業株式会社 | セラミツクパツケ−ジ |
JPS58127352A (ja) * | 1982-01-25 | 1983-07-29 | Mitsubishi Electric Corp | 半導体装置パツケ−ジ |
JPS59119748A (ja) * | 1982-12-25 | 1984-07-11 | Kyocera Corp | 半導体パツケ−ジ用セラミツク基板 |
JPS59121842U (ja) * | 1983-02-07 | 1984-08-16 | 鳴海製陶株式会社 | 半導体パツケ−ジ用セラミツク基板 |
US4853271A (en) * | 1987-03-31 | 1989-08-01 | Kyocera Corporation | Ceramic substrate for semiconductor package |
JPH0451485Y2 (fr) * | 1988-05-16 | 1992-12-03 | ||
US5095360A (en) * | 1990-10-10 | 1992-03-10 | Kyocera America, Inc. | Ceramic chip-resistant chamfered integrated circuit package |
US5454193A (en) * | 1993-04-15 | 1995-10-03 | Hrifko; Harold H. | Window glass for automobiles, recreation vehicles or buildings |
US5698287A (en) * | 1995-12-04 | 1997-12-16 | Neiman; Conrad V. | Medallion with decorated substrate carried thereon |
DE19615481C5 (de) * | 1996-04-03 | 2013-03-14 | Curamik Electronics Gmbh | Gewölbtes Metall-Keramik-Substrat |
EP0805492B1 (fr) * | 1996-04-03 | 2004-06-30 | Jürgen Dr.-Ing. Schulz-Harder | Substrat métal céramique cintré en voûte |
JP3445511B2 (ja) * | 1998-12-10 | 2003-09-08 | 株式会社東芝 | 絶縁基板、その製造方法およびそれを用いた半導体装置 |
JP2008217384A (ja) * | 2007-03-05 | 2008-09-18 | Hitachi Ltd | 回路チップ及びその製造方法、並びにこれを搭載したrfid回路装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3374533A (en) * | 1965-05-26 | 1968-03-26 | Sprague Electric Co | Semiconductor mounting and assembly method |
US3668053A (en) * | 1968-09-09 | 1972-06-06 | Fortin Plastics Inc | Article for preventing edge defect in compression stretched acrylic sheet |
DE1815989A1 (de) * | 1968-12-20 | 1970-07-02 | Semikron Gleichrichterbau | Halbleiter-Anordnung |
US4030004A (en) * | 1971-04-16 | 1977-06-14 | Nl Industries, Inc. | Dielectric ceramic matrices with end barriers |
US4024684A (en) * | 1971-06-02 | 1977-05-24 | H. H. Robertson Company | Pre-notched building panel with splice plate and method of preparing the same |
US4164442A (en) * | 1975-11-13 | 1979-08-14 | Heinrich Bartelmuss | Abrasion-resistant plate |
JPS5335163A (en) * | 1976-09-14 | 1978-04-01 | Hitachi Chemical Co Ltd | Method of producing printed circuit board substrate having through hole from metallic material |
-
1978
- 1978-11-25 JP JP14579478A patent/JPS5572064A/ja active Pending
-
1979
- 1979-11-20 US US06/096,237 patent/US4277528A/en not_active Expired - Lifetime
- 1979-11-23 DE DE19792947270 patent/DE2947270C3/de not_active Expired - Fee Related
- 1979-11-26 FR FR7929062A patent/FR2442509B1/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS5572064A (en) | 1980-05-30 |
DE2947270C3 (de) | 1993-02-25 |
FR2442509A1 (fr) | 1980-06-20 |
US4277528A (en) | 1981-07-07 |
DE2947270A1 (de) | 1980-06-12 |
DE2947270C2 (de) | 1986-12-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |