FR2383245A1 - Procede de depot selectif d'un metal a la surface d'un substrat - Google Patents

Procede de depot selectif d'un metal a la surface d'un substrat

Info

Publication number
FR2383245A1
FR2383245A1 FR7806970A FR7806970A FR2383245A1 FR 2383245 A1 FR2383245 A1 FR 2383245A1 FR 7806970 A FR7806970 A FR 7806970A FR 7806970 A FR7806970 A FR 7806970A FR 2383245 A1 FR2383245 A1 FR 2383245A1
Authority
FR
France
Prior art keywords
metal
substrate
deposit process
relates
selective deposit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7806970A
Other languages
English (en)
Other versions
FR2383245B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of FR2383245A1 publication Critical patent/FR2383245A1/fr
Application granted granted Critical
Publication of FR2383245B1 publication Critical patent/FR2383245B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1415—Applying catalyst after applying plating resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

L'invention concerne la formation d'un dessin sélectif d'un métal à la surface d'un substrat Elle se rapporte à un procédé qui comprend le traitement de la surface par revêtement d'une partie choisie par un copolymère d'anhydride maléique et d'un composé vinylique. La surface non revêtue peut retenir une espèce colloïdale d'activation contenue dans un sol. La surface traitée subit ensuite un dépôt chimique d'un métal et ensuite, éventuellement, une électrodéposition. Application à la réalisation de circuits imprimés.
FR7806970A 1977-03-11 1978-03-10 Procede de depot selectif d'un metal a la surface d'un substrat Granted FR2383245A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/776,814 US4073981A (en) 1977-03-11 1977-03-11 Method of selectively depositing metal on a surface

Publications (2)

Publication Number Publication Date
FR2383245A1 true FR2383245A1 (fr) 1978-10-06
FR2383245B1 FR2383245B1 (fr) 1980-09-19

Family

ID=25108448

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7806970A Granted FR2383245A1 (fr) 1977-03-11 1978-03-10 Procede de depot selectif d'un metal a la surface d'un substrat

Country Status (9)

Country Link
US (1) US4073981A (fr)
JP (1) JPS53113228A (fr)
CA (1) CA1091813A (fr)
DE (1) DE2809842A1 (fr)
FR (1) FR2383245A1 (fr)
GB (1) GB1597759A (fr)
IT (1) IT7867535A0 (fr)
NL (1) NL7802618A (fr)
SE (1) SE7802255L (fr)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4188417A (en) * 1977-05-04 1980-02-12 Balzers Patent-und Beteiligungs-Aktiegesellschaft Method of applying a dielectric layer to a substrate and a mask-forming coating for the application of a dielectric layer
US4322457A (en) * 1978-01-25 1982-03-30 Western Electric Co., Inc. Method of selectively depositing a metal on a surface
US4381951A (en) * 1978-01-25 1983-05-03 Western Electric Co. Inc. Method of removing contaminants from a surface
US4254163A (en) * 1979-04-13 1981-03-03 Western Electric Company, Inc. Strippable resists
US4421814A (en) * 1979-04-13 1983-12-20 Western Electric Co., Inc. Strippable resists
JPS59500870A (ja) * 1982-05-26 1984-05-17 マツクダ−ミツド　インコ−ポレ−テツド 非伝導性基板活性化触媒溶液および無電解メツキ方法
US4863758A (en) * 1982-05-26 1989-09-05 Macdermid, Incorporated Catalyst solutions for activating non-conductive substrates and electroless plating process
US4555414A (en) * 1983-04-15 1985-11-26 Polyonics Corporation Process for producing composite product having patterned metal layer
US4666735A (en) * 1983-04-15 1987-05-19 Polyonics Corporation Process for producing product having patterned metal layer
PH23907A (en) * 1983-09-28 1989-12-18 Rohm & Haas Catalytic process and systems
US4761304A (en) * 1984-01-26 1988-08-02 Learonal, Inc. Process for printed circuit board manufacture
US4847114A (en) * 1984-01-26 1989-07-11 Learonal, Inc. Preparation of printed circuit boards by selective metallization
US4759952A (en) * 1984-01-26 1988-07-26 Learonal, Inc. Process for printed circuit board manufacture
US5086966A (en) * 1990-11-05 1992-02-11 Motorola Inc. Palladium-coated solder ball
GB2253415A (en) * 1991-02-08 1992-09-09 Eid Empresa De Investigacao E Selective process for printed circuit board manufacturing employing noble metal oxide catalyst.
US6060121A (en) * 1996-03-15 2000-05-09 President And Fellows Of Harvard College Microcontact printing of catalytic colloids
US5827567A (en) * 1996-11-27 1998-10-27 Molitor; John Peter Game ball mold preparation technique and coating system
US7198747B2 (en) * 2000-09-18 2007-04-03 President And Fellows Of Harvard College Fabrication of ceramic microstructures
US7255782B2 (en) * 2004-04-30 2007-08-14 Kenneth Crouse Selective catalytic activation of non-conductive substrates

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3269861A (en) * 1963-06-21 1966-08-30 Day Company Method for electroless copper plating

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2320724A (en) * 1940-03-14 1943-06-01 Pittsburgh Plate Glass Co Method of treating styrene-unsaturated dicarboxylic acid resins
US2286062A (en) * 1940-06-01 1942-06-09 Du Pont Process for copolymerizing malkic anhydride and polymerizable vinyl compounds
US2543601A (en) * 1949-12-06 1951-02-27 Rohm & Haas Polymeric imido-esters prepared from maleic heteropolymers and azolines
US2703756A (en) * 1951-12-12 1955-03-08 Gen Aniline & Film Corp Vesicular prints and process of making same
US2746837A (en) * 1951-12-28 1956-05-22 Gen Aniline & Film Corp Manufacture of leather using a modified vinyl ether-maleic anhydride copolymer, and resulting product
US2719141A (en) * 1954-07-07 1955-09-27 Eastman Kodak Co Hydantoin esters of maleic anhydride copolymers
US2854338A (en) * 1955-03-18 1958-09-30 Gen Aniline & Film Corp Negative working diazo sulfonate foils
US2816091A (en) * 1955-05-26 1957-12-10 Eastman Kodak Co Polymeric chalcones and their use as light-sensitive polymers
US2971842A (en) * 1956-03-21 1961-02-14 Gen Aniline & Film Corp Light sensitive layers for photomechanical reproduction
US2882257A (en) * 1957-04-19 1959-04-14 Gen Aniline & Film Corp Polyester film of 2-butene-1, 4-diol and methyl vinyl ether-maleic anhydride copolymer crosslinked with n-vinyl-2-pyrrolidone and process for preparing same
US3072482A (en) * 1958-01-10 1963-01-08 Keuffel & Esser Co Subbed photographically sensitive film element
US3011920A (en) * 1959-06-08 1961-12-05 Shipley Co Method of electroless deposition on a substrate and catalyst solution therefor
US3532518A (en) * 1967-06-28 1970-10-06 Macdermid Inc Colloidal metal activating solutions for use in chemically plating nonconductors,and process of preparing such solutions
SE332214B (fr) * 1968-07-12 1971-02-01 Gylling & Co
US3657003A (en) * 1970-02-02 1972-04-18 Western Electric Co Method of rendering a non-wettable surface wettable
US3672925A (en) * 1970-10-02 1972-06-27 Rca Corp Method of preparing a substrate for depositing a metal on selected portions thereof

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3269861A (en) * 1963-06-21 1966-08-30 Day Company Method for electroless copper plating

Also Published As

Publication number Publication date
FR2383245B1 (fr) 1980-09-19
SE7802255L (sv) 1978-09-12
GB1597759A (en) 1981-09-09
US4073981A (en) 1978-02-14
DE2809842A1 (de) 1978-09-14
JPS53113228A (en) 1978-10-03
CA1091813A (fr) 1980-12-16
NL7802618A (nl) 1978-09-13
IT7867535A0 (it) 1978-03-10

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