FR2380686A1 - Procede pour etablir une connexion electrique a travers une plaque de matiere isolante - Google Patents

Procede pour etablir une connexion electrique a travers une plaque de matiere isolante

Info

Publication number
FR2380686A1
FR2380686A1 FR7802931A FR7802931A FR2380686A1 FR 2380686 A1 FR2380686 A1 FR 2380686A1 FR 7802931 A FR7802931 A FR 7802931A FR 7802931 A FR7802931 A FR 7802931A FR 2380686 A1 FR2380686 A1 FR 2380686A1
Authority
FR
France
Prior art keywords
sheets
conductive material
establishing
plate
insulating material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7802931A
Other languages
English (en)
French (fr)
Other versions
FR2380686B1 (enrdf_load_stackoverflow
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LOMERSON ROBERT
Original Assignee
LOMERSON ROBERT
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LOMERSON ROBERT filed Critical LOMERSON ROBERT
Publication of FR2380686A1 publication Critical patent/FR2380686A1/fr
Application granted granted Critical
Publication of FR2380686B1 publication Critical patent/FR2380686B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
FR7802931A 1977-02-15 1978-02-02 Procede pour etablir une connexion electrique a travers une plaque de matiere isolante Granted FR2380686A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US76873577A 1977-02-15 1977-02-15

Publications (2)

Publication Number Publication Date
FR2380686A1 true FR2380686A1 (fr) 1978-09-08
FR2380686B1 FR2380686B1 (enrdf_load_stackoverflow) 1984-05-25

Family

ID=25083343

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7802931A Granted FR2380686A1 (fr) 1977-02-15 1978-02-02 Procede pour etablir une connexion electrique a travers une plaque de matiere isolante

Country Status (7)

Country Link
JP (1) JPS5416670A (enrdf_load_stackoverflow)
DE (1) DE2805535A1 (enrdf_load_stackoverflow)
FR (1) FR2380686A1 (enrdf_load_stackoverflow)
GB (1) GB1584241A (enrdf_load_stackoverflow)
IL (1) IL53957A0 (enrdf_load_stackoverflow)
IT (1) IT1102270B (enrdf_load_stackoverflow)
NL (1) NL7801594A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2517165A1 (fr) * 1981-11-20 1983-05-27 Radiotechnique Compelec Procede pour munir d'un ecran un circuit electronique, et carte de paiement munie d'un ecran

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4250790A (en) * 1979-10-22 1981-02-17 Richard Shubb Capo
JPS5939093A (ja) * 1982-08-27 1984-03-03 大槻　眞之 スル−ホ−ル配線板の製造方法
FR2562335B1 (fr) * 1984-04-03 1988-11-25 Rogers Corp Circuit multicouche flexible avec connexions entre couches soudees par voie ultrasonique
JPS62237791A (ja) * 1986-04-08 1987-10-17 新藤電子工業株式会社 プリント配線板の製造方法
US5744759A (en) * 1996-05-29 1998-04-28 International Business Machines Corporation Circuit boards that can accept a pluggable tab module that can be attached or removed without solder
DE102009050386B4 (de) * 2009-10-22 2013-10-31 Mühlbauer Ag Verfahren zum Herstellen von Durchkontaktierungen
CN110636716A (zh) * 2019-09-24 2019-12-31 江苏上达电子有限公司 一种非电镀式盲孔的制造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1640468A1 (de) * 1965-06-16 1970-08-20 Ibm Elektrische Verbindung an den Kreuzungspunkten von an gegenueberliegenden Seiten von Schaltkarten verlaufenden Leiterstreifen

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1920061U (de) * 1963-09-27 1965-07-22 Siemens Ag Traegerplatte nach art der gedruckten schaltung mit in mehreren ebenen vorgesehenen metalleiterbahnen, die zum teil miteinander im elektrischer kontakt stehen.
DE2113613B2 (de) * 1970-03-27 1972-11-23 Owens-Illinois, Inc., Toledo, Ohio (V.St.A.) Verfahren zum gleichzeitigen Herstellen elektrischer Verbindungen zwischen einer Vielzahl von Leitern auf einem Substrat mit einer Vielzahl von Leitern eines anderen Substrats

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1640468A1 (de) * 1965-06-16 1970-08-20 Ibm Elektrische Verbindung an den Kreuzungspunkten von an gegenueberliegenden Seiten von Schaltkarten verlaufenden Leiterstreifen

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2517165A1 (fr) * 1981-11-20 1983-05-27 Radiotechnique Compelec Procede pour munir d'un ecran un circuit electronique, et carte de paiement munie d'un ecran
EP0080233A1 (fr) * 1981-11-20 1983-06-01 Rtc-Compelec Procédé permettant de réaliser un circuit électronique protégé contre les charges électriques statiques

Also Published As

Publication number Publication date
JPS6252479B2 (enrdf_load_stackoverflow) 1987-11-05
IT7848041A0 (it) 1978-02-14
GB1584241A (en) 1981-02-11
NL7801594A (nl) 1978-08-17
DE2805535A1 (de) 1978-08-17
JPS5416670A (en) 1979-02-07
IT1102270B (it) 1985-10-07
FR2380686B1 (enrdf_load_stackoverflow) 1984-05-25
IL53957A0 (en) 1978-04-30

Similar Documents

Publication Publication Date Title
JPH0595525U (ja) 使用済注射針の処理装置における電極構造
FR2380686A1 (fr) Procede pour etablir une connexion electrique a travers une plaque de matiere isolante
EP0325234A3 (en) Trimming element for microelectronic circuit
JPS55144387A (en) Welding equipment of bar material and plate material
JPS6468728A (en) Thin film transistor
GB1217104A (en) Devices including pieces of aluminium or an alloy of aluminium and layers of electrically conductive material welded to said pieces
KR920021249A (ko) 고체동편의 접합방법 및 이에 의한 접합체
SU1519446A1 (ru) Взрывомагнитный формирователь импульса тока
JPS5661679A (en) Indicating device
SE8400459L (sv) Elektrod for elektrolysorer
JPS6450595A (en) Connection of semiconductor device
JPS5718347A (en) Mounting structure of ic
SU1754371A1 (ru) Способ контактной приварки стержн к пластине
JPS57187183A (en) Series spot welding method
JPS6474817A (en) Ultrasonic delay line
ATE137610T1 (de) Vorrichtung zur aufnahme thermischer bilder
JPS57211244A (en) Formation of bonding electrode
SU1371826A1 (ru) Способ контактной микросварки проводников с плоской деталью
JPS63250192A (ja) 両面プリント配線板における導体導通方法
JP2515322Y2 (ja) 高温用超音波探触子
GB1018622A (en) Improvements in or relating to welding techniques for use in the manufacture of electronic assemblies
JPH0332366U (enrdf_load_stackoverflow)
JPS5968687U (ja) 点溶接用加圧電極
JPS5287687A (en) Method for connecting enameled wire to terminal
JPS53110939A (en) Resistance spot welding electrode

Legal Events

Date Code Title Description
ST Notification of lapse