IT1102270B - Perfezionamento nei procedimenti per la fabbricazione di circuiti stampati a due strati - Google Patents

Perfezionamento nei procedimenti per la fabbricazione di circuiti stampati a due strati

Info

Publication number
IT1102270B
IT1102270B IT48041/78A IT4804178A IT1102270B IT 1102270 B IT1102270 B IT 1102270B IT 48041/78 A IT48041/78 A IT 48041/78A IT 4804178 A IT4804178 A IT 4804178A IT 1102270 B IT1102270 B IT 1102270B
Authority
IT
Italy
Prior art keywords
procedures
improvement
manufacture
printed circuits
layer printed
Prior art date
Application number
IT48041/78A
Other languages
English (en)
Italian (it)
Other versions
IT7848041A0 (it
Original Assignee
Lomerson Robert Bogardus
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lomerson Robert Bogardus filed Critical Lomerson Robert Bogardus
Publication of IT7848041A0 publication Critical patent/IT7848041A0/it
Application granted granted Critical
Publication of IT1102270B publication Critical patent/IT1102270B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Combinations Of Printed Boards (AREA)
IT48041/78A 1977-02-15 1978-02-14 Perfezionamento nei procedimenti per la fabbricazione di circuiti stampati a due strati IT1102270B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US76873577A 1977-02-15 1977-02-15

Publications (2)

Publication Number Publication Date
IT7848041A0 IT7848041A0 (it) 1978-02-14
IT1102270B true IT1102270B (it) 1985-10-07

Family

ID=25083343

Family Applications (1)

Application Number Title Priority Date Filing Date
IT48041/78A IT1102270B (it) 1977-02-15 1978-02-14 Perfezionamento nei procedimenti per la fabbricazione di circuiti stampati a due strati

Country Status (7)

Country Link
JP (1) JPS5416670A (enrdf_load_stackoverflow)
DE (1) DE2805535A1 (enrdf_load_stackoverflow)
FR (1) FR2380686A1 (enrdf_load_stackoverflow)
GB (1) GB1584241A (enrdf_load_stackoverflow)
IL (1) IL53957A0 (enrdf_load_stackoverflow)
IT (1) IT1102270B (enrdf_load_stackoverflow)
NL (1) NL7801594A (enrdf_load_stackoverflow)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4250790A (en) * 1979-10-22 1981-02-17 Richard Shubb Capo
FR2517165A1 (fr) * 1981-11-20 1983-05-27 Radiotechnique Compelec Procede pour munir d'un ecran un circuit electronique, et carte de paiement munie d'un ecran
JPS5939093A (ja) * 1982-08-27 1984-03-03 大槻　眞之 スル−ホ−ル配線板の製造方法
FR2562335B1 (fr) * 1984-04-03 1988-11-25 Rogers Corp Circuit multicouche flexible avec connexions entre couches soudees par voie ultrasonique
JPS62237791A (ja) * 1986-04-08 1987-10-17 新藤電子工業株式会社 プリント配線板の製造方法
US5744759A (en) * 1996-05-29 1998-04-28 International Business Machines Corporation Circuit boards that can accept a pluggable tab module that can be attached or removed without solder
DE102009050386B4 (de) * 2009-10-22 2013-10-31 Mühlbauer Ag Verfahren zum Herstellen von Durchkontaktierungen
CN110636716A (zh) * 2019-09-24 2019-12-31 江苏上达电子有限公司 一种非电镀式盲孔的制造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1920061U (de) * 1963-09-27 1965-07-22 Siemens Ag Traegerplatte nach art der gedruckten schaltung mit in mehreren ebenen vorgesehenen metalleiterbahnen, die zum teil miteinander im elektrischer kontakt stehen.
US3346950A (en) * 1965-06-16 1967-10-17 Ibm Method of making through-connections by controlled punctures
DE2113613B2 (de) * 1970-03-27 1972-11-23 Owens-Illinois, Inc., Toledo, Ohio (V.St.A.) Verfahren zum gleichzeitigen Herstellen elektrischer Verbindungen zwischen einer Vielzahl von Leitern auf einem Substrat mit einer Vielzahl von Leitern eines anderen Substrats

Also Published As

Publication number Publication date
IT7848041A0 (it) 1978-02-14
IL53957A0 (en) 1978-04-30
FR2380686A1 (fr) 1978-09-08
JPS5416670A (en) 1979-02-07
DE2805535A1 (de) 1978-08-17
NL7801594A (nl) 1978-08-17
JPS6252479B2 (enrdf_load_stackoverflow) 1987-11-05
GB1584241A (en) 1981-02-11
FR2380686B1 (enrdf_load_stackoverflow) 1984-05-25

Similar Documents

Publication Publication Date Title
DD136631A1 (de) Mehrschichtiges filzband
BR7505127A (pt) Estrutura de marcacao de multicamada
SE405931B (sv) Kantskena
IT1064451B (it) Procedimento per la fabbricazione di pannelli di circuiti stampati
IT7812736A0 (it) Morsetto per circuiti stampati
DK376477A (da) Teleskopskinne
IT7851842A0 (it) Perfezionamento nei respiratori
IT1061638B (it) Perfezionamento nei condensatori elettrolitici
IT1102267B (it) Perfezionamento nei tachimetri
IT1090846B (it) Perfezionamento nei generatori ad effetto hall a circuito integrato
FR2410347B1 (fr) Condensateur electrolytique
FI771252A7 (fi) Polerapparat foer elektrolytisk moderplatta
DK11977A (da) Teleskopskinne
IT1102270B (it) Perfezionamento nei procedimenti per la fabbricazione di circuiti stampati a due strati
DK397878A (da) Digitalt vaelgernet
TR20070A (tr) Demiryolu traversi
IT7848321A0 (it) Procedimento per la produzione di -(dimetilammino) proprometile
IT1066339B (it) Procedimento elettrolitico per la perforazione fine
BR7702197A (pt) Cadinho intermediario
IT1090447B (it) Perfezionamento nei circuiti telefonici
IT1096085B (it) Procedimento per fabbricare emodializzatori multistrato
IT1137014B (it) Procedimento di fabbricazione di circuiti stampati
IT1117934B (it) Perfezionamenti nei condensatori avvolti
SE7700101L (sv) Huvudstod for anbringande pa tandlekarstolar
IT1147561B (it) Perfezionamento nei circuiti oscillatori a circuito integrato