FR2373878A1 - Embase support avec connexions isolees par traversee a scellement verre-metal - Google Patents
Embase support avec connexions isolees par traversee a scellement verre-metalInfo
- Publication number
- FR2373878A1 FR2373878A1 FR7636788A FR7636788A FR2373878A1 FR 2373878 A1 FR2373878 A1 FR 2373878A1 FR 7636788 A FR7636788 A FR 7636788A FR 7636788 A FR7636788 A FR 7636788A FR 2373878 A1 FR2373878 A1 FR 2373878A1
- Authority
- FR
- France
- Prior art keywords
- glass
- metal
- semiconductor crystal
- insulated connection
- graphite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011521 glass Substances 0.000 title abstract 7
- 239000011324 bead Substances 0.000 title abstract 5
- 239000013078 crystal Substances 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 title abstract 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title 1
- 229910002804 graphite Inorganic materials 0.000 title 1
- 239000010439 graphite Substances 0.000 title 1
- 239000002184 metal Substances 0.000 abstract 1
- JGFYQVQAXANWJU-UHFFFAOYSA-M sodium fluoroacetate Chemical compound [Na+].[O-]C(=O)CF JGFYQVQAXANWJU-UHFFFAOYSA-M 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Dispositif permettant la réalisation d'embases supports à connexions isolées. Il est réalisé en munissant une embase métallique 1 d'un logement 6 comportant une butée 5 sur laquelle vient en contact une face d'une perle de verre 2 ayant en son centre une connexion électrique isolée 3. Le positionnement des éléments de l'embase est assuré par un gabarit 4 comportant un trou de guidage 7 disposé au centre d'un évidement 8. L'invention est principalement applicable pour le montage de pastilles de semi-conducteurs.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7636788A FR2373878A1 (fr) | 1976-12-07 | 1976-12-07 | Embase support avec connexions isolees par traversee a scellement verre-metal |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7636788A FR2373878A1 (fr) | 1976-12-07 | 1976-12-07 | Embase support avec connexions isolees par traversee a scellement verre-metal |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2373878A1 true FR2373878A1 (fr) | 1978-07-07 |
FR2373878B1 FR2373878B1 (fr) | 1980-02-08 |
Family
ID=9180743
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7636788A Granted FR2373878A1 (fr) | 1976-12-07 | 1976-12-07 | Embase support avec connexions isolees par traversee a scellement verre-metal |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2373878A1 (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2669176A1 (fr) * | 1990-11-13 | 1992-05-15 | Sept Doloy Sa | Boitier ceramique dont les sorties hermetiques sont scellees au moyen d'un verre et destine aux circuits integres. |
EP0544538A2 (fr) * | 1991-11-27 | 1993-06-02 | Shinko Electric Industries Co. Ltd. | Assemblage pour une ligne coaxiale |
-
1976
- 1976-12-07 FR FR7636788A patent/FR2373878A1/fr active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2669176A1 (fr) * | 1990-11-13 | 1992-05-15 | Sept Doloy Sa | Boitier ceramique dont les sorties hermetiques sont scellees au moyen d'un verre et destine aux circuits integres. |
EP0544538A2 (fr) * | 1991-11-27 | 1993-06-02 | Shinko Electric Industries Co. Ltd. | Assemblage pour une ligne coaxiale |
EP0544538A3 (en) * | 1991-11-27 | 1993-08-11 | Shinko Electric Industries Co. Ltd. | Coaxial line assembly |
US5557074A (en) * | 1991-11-27 | 1996-09-17 | Fujitsu Limited | Coaxial line assembly of a package for a high frequency element |
Also Published As
Publication number | Publication date |
---|---|
FR2373878B1 (fr) | 1980-02-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |