FR2336798B1 - - Google Patents
Info
- Publication number
- FR2336798B1 FR2336798B1 FR7638715A FR7638715A FR2336798B1 FR 2336798 B1 FR2336798 B1 FR 2336798B1 FR 7638715 A FR7638715 A FR 7638715A FR 7638715 A FR7638715 A FR 7638715A FR 2336798 B1 FR2336798 B1 FR 2336798B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/60—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of BJTs
- H10D84/65—Integrated injection logic
- H10D84/658—Integrated injection logic integrated in combination with analog structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/0112—Integrating together multiple components covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating multiple BJTs
- H10D84/0116—Integrating together multiple components covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating multiple BJTs the components including integrated injection logic [I2L]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2557911A DE2557911C2 (de) | 1975-12-22 | 1975-12-22 | Verfahren zum Herstellen einer monolithisch integrierten Schaltung |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2336798A1 FR2336798A1 (fr) | 1977-07-22 |
| FR2336798B1 true FR2336798B1 (enrdf_load_stackoverflow) | 1982-10-22 |
Family
ID=5965236
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7638715A Granted FR2336798A1 (fr) | 1975-12-22 | 1976-12-22 | Methode de fabrication d'un circuit integre monolithique comprenant des elements lineaires et des elements a logique a injection |
Country Status (4)
| Country | Link |
|---|---|
| DE (1) | DE2557911C2 (enrdf_load_stackoverflow) |
| FR (1) | FR2336798A1 (enrdf_load_stackoverflow) |
| GB (1) | GB1523517A (enrdf_load_stackoverflow) |
| IT (1) | IT1065296B (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2835330C3 (de) * | 1978-08-11 | 1982-03-11 | Siemens AG, 1000 Berlin und 8000 München | Integrierter bipolarer Halbleiterschaltkreis sowie Verfahren zu seiner Herstellung |
| DE3020609C2 (de) * | 1979-05-31 | 1985-11-07 | Tokyo Shibaura Denki K.K., Kawasaki, Kanagawa | Verfahren zum Herstellen einer integrierten Schaltung mit wenigstens einem I↑2↑L-Element |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1559608A (enrdf_load_stackoverflow) * | 1967-06-30 | 1969-03-14 | ||
| US3909807A (en) * | 1974-09-03 | 1975-09-30 | Bell Telephone Labor Inc | Integrated circuit memory cell |
-
1975
- 1975-12-22 DE DE2557911A patent/DE2557911C2/de not_active Expired
-
1976
- 1976-12-16 GB GB52532/76A patent/GB1523517A/en not_active Expired
- 1976-12-20 IT IT30603/76A patent/IT1065296B/it active
- 1976-12-22 FR FR7638715A patent/FR2336798A1/fr active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| IT1065296B (it) | 1985-02-25 |
| FR2336798A1 (fr) | 1977-07-22 |
| GB1523517A (en) | 1978-09-06 |
| DE2557911C2 (de) | 1982-11-04 |
| DE2557911A1 (de) | 1977-06-30 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |