FR2335050A1 - Refroidisseur par liquide pour composant electrique - Google Patents

Refroidisseur par liquide pour composant electrique

Info

Publication number
FR2335050A1
FR2335050A1 FR7637495A FR7637495A FR2335050A1 FR 2335050 A1 FR2335050 A1 FR 2335050A1 FR 7637495 A FR7637495 A FR 7637495A FR 7637495 A FR7637495 A FR 7637495A FR 2335050 A1 FR2335050 A1 FR 2335050A1
Authority
FR
France
Prior art keywords
heat
liq
pref
component
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7637495A
Other languages
English (en)
French (fr)
Other versions
FR2335050B1 (enExample
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Publication of FR2335050A1 publication Critical patent/FR2335050A1/fr
Application granted granted Critical
Publication of FR2335050B1 publication Critical patent/FR2335050B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
    • H01L25/112—Mixed assemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR7637495A 1975-12-13 1976-12-13 Refroidisseur par liquide pour composant electrique Granted FR2335050A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19752556239 DE2556239A1 (de) 1975-12-13 1975-12-13 Kuehleinrichtung zur fluessigkeitskuehlung fuer ein elektrisches bauteil

Publications (2)

Publication Number Publication Date
FR2335050A1 true FR2335050A1 (fr) 1977-07-08
FR2335050B1 FR2335050B1 (enExample) 1982-06-04

Family

ID=5964319

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7637495A Granted FR2335050A1 (fr) 1975-12-13 1976-12-13 Refroidisseur par liquide pour composant electrique

Country Status (2)

Country Link
DE (1) DE2556239A1 (enExample)
FR (1) FR2335050A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0142678A3 (en) * 1983-10-06 1987-03-04 Asea Ab Semiconductor rectifier

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1208008B (de) * 1963-07-27 1965-12-30 Bbc Brown Boveri & Cie Halbleiter-Gleichrichtergeraet
DE1464781A1 (de) * 1964-07-08 1968-12-19 Bbc Brown Boveri & Cie Halbleiter-Stromrichteranlage mit mehreren Halbleiterelementen
DE1800999A1 (de) * 1967-10-06 1969-04-30 Jeumont Schneider Kuehlvorrichtung fuer Halbleiterelemente

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1208008B (de) * 1963-07-27 1965-12-30 Bbc Brown Boveri & Cie Halbleiter-Gleichrichtergeraet
DE1464781A1 (de) * 1964-07-08 1968-12-19 Bbc Brown Boveri & Cie Halbleiter-Stromrichteranlage mit mehreren Halbleiterelementen
DE1800999A1 (de) * 1967-10-06 1969-04-30 Jeumont Schneider Kuehlvorrichtung fuer Halbleiterelemente

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0142678A3 (en) * 1983-10-06 1987-03-04 Asea Ab Semiconductor rectifier

Also Published As

Publication number Publication date
FR2335050B1 (enExample) 1982-06-04
DE2556239A1 (de) 1977-06-23

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Legal Events

Date Code Title Description
ST Notification of lapse