FR2335042B1 - - Google Patents
Info
- Publication number
- FR2335042B1 FR2335042B1 FR7637216A FR7637216A FR2335042B1 FR 2335042 B1 FR2335042 B1 FR 2335042B1 FR 7637216 A FR7637216 A FR 7637216A FR 7637216 A FR7637216 A FR 7637216A FR 2335042 B1 FR2335042 B1 FR 2335042B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US63986875A | 1975-12-11 | 1975-12-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2335042A1 FR2335042A1 (fr) | 1977-07-08 |
FR2335042B1 true FR2335042B1 (fr) | 1982-10-29 |
Family
ID=24565898
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7637216A Granted FR2335042A1 (fr) | 1975-12-11 | 1976-12-10 | Procede de traitement selectif d'une zone superficielle d'un element semi-conducteur |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS597213B2 (fr) |
DE (1) | DE2655803C2 (fr) |
FR (1) | FR2335042A1 (fr) |
GB (1) | GB1571999A (fr) |
SE (1) | SE418432B (fr) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2655725A1 (de) * | 1975-12-11 | 1977-06-16 | Gen Electrit Co | Halbleiterelement mit einem schutzueberzug |
GB1585477A (en) * | 1976-01-26 | 1981-03-04 | Gen Electric | Semiconductors |
CH661932A5 (en) * | 1978-09-18 | 1987-08-31 | Gen Electric | Process for the preparation of a coating composition for semiconductor components, this composition, and the use thereof |
CH661933A5 (en) * | 1978-09-18 | 1987-08-31 | Gen Electric | Process for the preparation of a coating composition for the surface of a semiconductor component, this composition, and the use thereof for preventing surface breakdown |
JPH0395021U (fr) * | 1990-01-16 | 1991-09-27 | ||
DE19500235A1 (de) * | 1995-01-05 | 1996-07-11 | Roth Technik Gmbh | Abdeckschicht für elektrische Leiter oder Halbleiter |
DE112016005077T5 (de) * | 2015-11-05 | 2018-08-30 | Abb Schweiz Ag | Leistungshalbleitervorrichtung und Verfahren zum Herstellen einer Leistungshalbleitervorrichtung |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1464602B2 (de) * | 1962-11-30 | 1970-11-26 | Fuji Denki Seizo K.K., Tokio | Verfahren zur Oberflächenbehandlung ..on Halbleiteranordnungen |
US3615913A (en) * | 1968-11-08 | 1971-10-26 | Westinghouse Electric Corp | Polyimide and polyamide-polyimide as a semiconductor surface passivator and protectant coating |
US3553282A (en) * | 1969-09-08 | 1971-01-05 | Gen Electric | Siloxane containing polyamide acid blends |
US3598784A (en) * | 1970-03-11 | 1971-08-10 | Gen Electric | Polysiloxane amides |
US3740305A (en) * | 1971-10-01 | 1973-06-19 | Gen Electric | Composite materials bonded with siloxane containing polyimides |
JPS5421073B2 (fr) * | 1974-04-15 | 1979-07-27 |
-
1976
- 1976-12-09 SE SE7613875A patent/SE418432B/xx not_active IP Right Cessation
- 1976-12-09 DE DE19762655803 patent/DE2655803C2/de not_active Expired
- 1976-12-10 JP JP14931376A patent/JPS597213B2/ja not_active Expired
- 1976-12-10 GB GB5166876A patent/GB1571999A/en not_active Expired
- 1976-12-10 FR FR7637216A patent/FR2335042A1/fr active Granted
Also Published As
Publication number | Publication date |
---|---|
FR2335042A1 (fr) | 1977-07-08 |
JPS5272578A (en) | 1977-06-17 |
JPS597213B2 (ja) | 1984-02-17 |
SE7613875L (sv) | 1977-06-12 |
DE2655803A1 (de) | 1977-06-16 |
GB1571999A (en) | 1980-07-23 |
SE418432B (sv) | 1981-05-25 |
DE2655803C2 (de) | 1986-04-17 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |