FR2333876A1 - Methode et dispositif de depot electrolytique selectif, utilisant un rayonnement ultrasonique - Google Patents

Methode et dispositif de depot electrolytique selectif, utilisant un rayonnement ultrasonique

Info

Publication number
FR2333876A1
FR2333876A1 FR7635936A FR7635936A FR2333876A1 FR 2333876 A1 FR2333876 A1 FR 2333876A1 FR 7635936 A FR7635936 A FR 7635936A FR 7635936 A FR7635936 A FR 7635936A FR 2333876 A1 FR2333876 A1 FR 2333876A1
Authority
FR
France
Prior art keywords
ultrasonic radiation
deposit method
electrolytic deposit
selective electrolytic
selective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7635936A
Other languages
English (en)
Other versions
FR2333876B1 (fr
Inventor
Miles Patrick Drake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Standard Electric Corp
Original Assignee
International Standard Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Standard Electric Corp filed Critical International Standard Electric Corp
Publication of FR2333876A1 publication Critical patent/FR2333876A1/fr
Application granted granted Critical
Publication of FR2333876B1 publication Critical patent/FR2333876B1/fr
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/20Electroplating using ultrasonics, vibrations
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02Electroplating of selected surface areas
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/07Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/243Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Electroplating Methods And Accessories (AREA)
FR7635936A 1975-12-02 1976-11-29 Methode et dispositif de depot electrolytique selectif, utilisant un rayonnement ultrasonique Granted FR2333876A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB49405/75A GB1521130A (en) 1975-12-02 1975-12-02 Selective electro-plating etching or electro-machining

Publications (2)

Publication Number Publication Date
FR2333876A1 true FR2333876A1 (fr) 1977-07-01
FR2333876B1 FR2333876B1 (fr) 1980-09-05

Family

ID=10452230

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7635936A Granted FR2333876A1 (fr) 1975-12-02 1976-11-29 Methode et dispositif de depot electrolytique selectif, utilisant un rayonnement ultrasonique

Country Status (4)

Country Link
BE (1) BE848966A (fr)
ES (1) ES453877A1 (fr)
FR (1) FR2333876A1 (fr)
GB (1) GB1521130A (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0018500A1 (fr) * 1979-05-08 1980-11-12 International Business Machines Corporation Procédé de galvanisation avec augmentation sélective de la vitesse de dépôt
WO2009150083A1 (fr) * 2008-06-12 2009-12-17 C&K Components S.A.S. Procédé de dépôt sélectif d'un métal précieux sur un support par ablation ultrasonore d'un élément de masquage et son dispositif

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2313605A (en) * 1996-06-01 1997-12-03 Cope Chapman B Application of ultrasonic wave energy to electrolytic cell to reduce fume emission
DE10259361A1 (de) 2002-12-18 2004-07-08 Siemens Ag Verfahren und Vorrichtung zum Auffüllen von Materialtrennungen an einer Oberfläche

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2744860A (en) * 1951-11-13 1956-05-08 Robert H Rines Electroplating method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2744860A (en) * 1951-11-13 1956-05-08 Robert H Rines Electroplating method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0018500A1 (fr) * 1979-05-08 1980-11-12 International Business Machines Corporation Procédé de galvanisation avec augmentation sélective de la vitesse de dépôt
WO2009150083A1 (fr) * 2008-06-12 2009-12-17 C&K Components S.A.S. Procédé de dépôt sélectif d'un métal précieux sur un support par ablation ultrasonore d'un élément de masquage et son dispositif
FR2932497A1 (fr) * 2008-06-12 2009-12-18 C & K Components Sas Procede de depot selectif d'un metal precieux sur un support par ablation ultrasonore d'un element de masquage et son dispositif

Also Published As

Publication number Publication date
ES453877A1 (es) 1977-11-16
FR2333876B1 (fr) 1980-09-05
GB1521130A (en) 1978-08-16
BE848966A (fr) 1977-06-02

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Legal Events

Date Code Title Description
ST Notification of lapse