ES453877A1 - Un metodo mejorado para la aplicacion selectiva del acabado electrolitico. - Google Patents

Un metodo mejorado para la aplicacion selectiva del acabado electrolitico.

Info

Publication number
ES453877A1
ES453877A1 ES453877A ES453877A ES453877A1 ES 453877 A1 ES453877 A1 ES 453877A1 ES 453877 A ES453877 A ES 453877A ES 453877 A ES453877 A ES 453877A ES 453877 A1 ES453877 A1 ES 453877A1
Authority
ES
Spain
Prior art keywords
electro
selective
machining
cathode
plating etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES453877A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia Spain SA
Original Assignee
Alcatel Espana SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel Espana SA filed Critical Alcatel Espana SA
Publication of ES453877A1 publication Critical patent/ES453877A1/es
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/20—Electroplating using ultrasonics, vibrations
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/07—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
ES453877A 1975-12-02 1976-12-02 Un metodo mejorado para la aplicacion selectiva del acabado electrolitico. Expired ES453877A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB49405/75A GB1521130A (en) 1975-12-02 1975-12-02 Selective electro-plating etching or electro-machining

Publications (1)

Publication Number Publication Date
ES453877A1 true ES453877A1 (es) 1977-11-16

Family

ID=10452230

Family Applications (1)

Application Number Title Priority Date Filing Date
ES453877A Expired ES453877A1 (es) 1975-12-02 1976-12-02 Un metodo mejorado para la aplicacion selectiva del acabado electrolitico.

Country Status (4)

Country Link
BE (1) BE848966A (es)
ES (1) ES453877A1 (es)
FR (1) FR2333876A1 (es)
GB (1) GB1521130A (es)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4217183A (en) * 1979-05-08 1980-08-12 International Business Machines Corporation Method for locally enhancing electroplating rates
GB2313605A (en) * 1996-06-01 1997-12-03 Cope Chapman B Application of ultrasonic wave energy to electrolytic cell to reduce fume emission
DE10259361A1 (de) 2002-12-18 2004-07-08 Siemens Ag Verfahren und Vorrichtung zum Auffüllen von Materialtrennungen an einer Oberfläche
FR2932497B1 (fr) * 2008-06-12 2011-03-11 C & K Components Sas Procede de depot selectif d'un metal precieux sur un support par ablation ultrasonore d'un element de masquage et son dispositif

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2744860A (en) * 1951-11-13 1956-05-08 Robert H Rines Electroplating method

Also Published As

Publication number Publication date
FR2333876B1 (es) 1980-09-05
GB1521130A (en) 1978-08-16
FR2333876A1 (fr) 1977-07-01
BE848966A (fr) 1977-06-02

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Legal Events

Date Code Title Description
FD1A Patent lapsed

Effective date: 19970612