FR2332839A1 - Procede et appareil de polissage electromagnetique - Google Patents
Procede et appareil de polissage electromagnetiqueInfo
- Publication number
- FR2332839A1 FR2332839A1 FR7439456A FR7439456A FR2332839A1 FR 2332839 A1 FR2332839 A1 FR 2332839A1 FR 7439456 A FR7439456 A FR 7439456A FR 7439456 A FR7439456 A FR 7439456A FR 2332839 A1 FR2332839 A1 FR 2332839A1
- Authority
- FR
- France
- Prior art keywords
- electronic circuits
- workpiece
- solid
- laser beam
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/354—Working by laser beam, e.g. welding, cutting or boring for surface treatment by melting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/3568—Modifying rugosity
- B23K26/3576—Diminishing rugosity, e.g. grinding; Polishing; Smoothing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7439456A FR2332839A1 (fr) | 1974-12-03 | 1974-12-03 | Procede et appareil de polissage electromagnetique |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7439456A FR2332839A1 (fr) | 1974-12-03 | 1974-12-03 | Procede et appareil de polissage electromagnetique |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2332839A1 true FR2332839A1 (fr) | 1977-06-24 |
FR2332839B1 FR2332839B1 (US20030220297A1-20031127-C00033.png) | 1980-06-27 |
Family
ID=9145474
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7439456A Granted FR2332839A1 (fr) | 1974-12-03 | 1974-12-03 | Procede et appareil de polissage electromagnetique |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2332839A1 (US20030220297A1-20031127-C00033.png) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55149180A (en) * | 1979-04-24 | 1980-11-20 | Kokusai Electric Co Ltd | Method and device for covering graphite carbon board with minute silicon carbide film |
FR2471958A1 (fr) * | 1979-12-14 | 1981-06-26 | Micropore International Ltd | Procede pour la conformation de materiaux isolants au point de vue thermique |
EP0227371A1 (en) * | 1985-12-11 | 1987-07-01 | Kabushiki Kaisha Toshiba | Ceramic substrates and methods of manufacturing same |
EP0535620A1 (de) * | 1991-10-02 | 1993-04-07 | ANNA HÜTTE GmbH | Verfahren zum Strukturieren oder Polieren von Werkstücken aus Glas, insbesondere Bleikristall |
-
1974
- 1974-12-03 FR FR7439456A patent/FR2332839A1/fr active Granted
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55149180A (en) * | 1979-04-24 | 1980-11-20 | Kokusai Electric Co Ltd | Method and device for covering graphite carbon board with minute silicon carbide film |
JPS6012995B2 (ja) * | 1979-04-24 | 1985-04-04 | 株式会社日立国際電気 | グラフアイトカ−ボン板に緻密化された炭化ケイ素膜を被覆する方法および装置 |
FR2471958A1 (fr) * | 1979-12-14 | 1981-06-26 | Micropore International Ltd | Procede pour la conformation de materiaux isolants au point de vue thermique |
EP0227371A1 (en) * | 1985-12-11 | 1987-07-01 | Kabushiki Kaisha Toshiba | Ceramic substrates and methods of manufacturing same |
US4797530A (en) * | 1985-12-11 | 1989-01-10 | Kabushiki Kaisha Toshiba | Ceramic circuit substrates and methods of manufacturing same |
EP0535620A1 (de) * | 1991-10-02 | 1993-04-07 | ANNA HÜTTE GmbH | Verfahren zum Strukturieren oder Polieren von Werkstücken aus Glas, insbesondere Bleikristall |
Also Published As
Publication number | Publication date |
---|---|
FR2332839B1 (US20030220297A1-20031127-C00033.png) | 1980-06-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4190759A (en) | Processing of photomask | |
EP0761377B1 (en) | Laser scribing on glass using Nd:YAG laser | |
US3610871A (en) | Initiation of a controlled fracture | |
EP0350021B1 (en) | Removal of surface contaminants by irradiation from a high-energy source | |
JPS6286709A (ja) | 半導体装置の製造方法 | |
KR970005523B1 (ko) | 투명판 표면의 결함 수정 방법 | |
FR2332839A1 (fr) | Procede et appareil de polissage electromagnetique | |
ATE126745T1 (de) | Verfahren zum strukturieren oder polieren von werkstücken aus glas, insbesondere bleikristall. | |
JPS61247946A (ja) | X線分析装置用結晶及び該結晶を備えるx線分析装置 | |
WO2003033199A1 (en) | Method for improved wafer alignment | |
WO2000060582A1 (fr) | Procede de correction de la forme superficielle d'un coulisseau de tete magnetique, et coulisseau de tete magnetique | |
JPS6285433A (ja) | 研摩装置 | |
JPS56105479A (en) | Pattern formation method | |
DE59201969D1 (de) | Verfahren zum Aufbringen von strukturierten Metallschichten auf Glassubstraten. | |
JPS6123273B2 (US20030220297A1-20031127-C00033.png) | ||
FR2528585B1 (fr) | Procede de fabrication de miroir cylindrique, miroir cylindrique et appareil d'irradiation par un faisceau laser | |
GB1367767A (en) | Laser machining of oxide materials | |
JPS6482610A (en) | Method of treating chamfered part of wafer | |
JPS62246889A (ja) | 鏡面部品の製造方法 | |
JPS63215394A (ja) | 基板の加工方法 | |
US3837855A (en) | Pattern delineation method and product so produced | |
JPS5752052A (en) | Heat treatment of photosensitive resin | |
JPS63212084A (ja) | レ−ザ加工装置 | |
JPS63100726A (ja) | 重合体物質を基材とする表面被覆のホトエツチング法 | |
JPS59214550A (ja) | 平面研摩方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |