FR2330247A1 - Collecteur du circuit ferme de refroidissement d'un dispositif electronique - Google Patents

Collecteur du circuit ferme de refroidissement d'un dispositif electronique

Info

Publication number
FR2330247A1
FR2330247A1 FR7533233A FR7533233A FR2330247A1 FR 2330247 A1 FR2330247 A1 FR 2330247A1 FR 7533233 A FR7533233 A FR 7533233A FR 7533233 A FR7533233 A FR 7533233A FR 2330247 A1 FR2330247 A1 FR 2330247A1
Authority
FR
France
Prior art keywords
collector
electronic device
cooling circuit
closed cooling
closed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7533233A
Other languages
English (en)
Other versions
FR2330247B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
AMP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP Inc filed Critical AMP Inc
Publication of FR2330247A1 publication Critical patent/FR2330247A1/fr
Application granted granted Critical
Publication of FR2330247B1 publication Critical patent/FR2330247B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
    • F16L37/00—Couplings of the quick-acting type
    • F16L37/28—Couplings of the quick-acting type with fluid cut-off means
    • F16L37/30—Couplings of the quick-acting type with fluid cut-off means with fluid cut-off means in each of two pipe-end fittings
    • F16L37/32—Couplings of the quick-acting type with fluid cut-off means with fluid cut-off means in each of two pipe-end fittings at least one of two lift valves being opened automatically when the coupling is applied
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FR7533233A 1975-10-18 1975-10-30 Collecteur du circuit ferme de refroidissement d'un dispositif electronique Granted FR2330247A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB4288275A GB1491569A (en) 1975-10-18 1975-10-18 Fluid cooling systems for electrical components

Publications (2)

Publication Number Publication Date
FR2330247A1 true FR2330247A1 (fr) 1977-05-27
FR2330247B1 FR2330247B1 (fr) 1979-06-29

Family

ID=10426376

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7533233A Granted FR2330247A1 (fr) 1975-10-18 1975-10-30 Collecteur du circuit ferme de refroidissement d'un dispositif electronique

Country Status (3)

Country Link
FR (1) FR2330247A1 (fr)
GB (2) GB1491570A (fr)
HK (2) HK16979A (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2436263A1 (fr) * 1978-09-15 1980-04-11 Paris & Du Rhone Ecran pare-chaleur pour contacteur de demarreur de moteur a combustion interne
EP0452670A2 (fr) * 1990-03-16 1991-10-23 Asea Brown Boveri Aktiengesellschaft Raccord rapide

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4339260A (en) * 1981-01-12 1982-07-13 Owens-Illinois, Inc. Environmentally protected electronic control for a glassware forming machine
FR2631165B1 (fr) * 1988-05-05 1992-02-21 Moulene Daniel Support conditionneur de temperature pour petits objets tels que des composants semi-conducteurs et procede de regulation thermique utilisant ce support
DE9003687U1 (de) * 1990-03-29 1990-05-31 Siemens AG, 1000 Berlin und 8000 München Kühleinrichtung für Geräteeinschübe
GB2297651B (en) * 1995-02-03 1999-05-26 Gec Marconi Avionics Holdings Electrical apparatus
US7187549B2 (en) 2004-06-30 2007-03-06 Teradyne, Inc. Heat exchange apparatus with parallel flow

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2436263A1 (fr) * 1978-09-15 1980-04-11 Paris & Du Rhone Ecran pare-chaleur pour contacteur de demarreur de moteur a combustion interne
EP0452670A2 (fr) * 1990-03-16 1991-10-23 Asea Brown Boveri Aktiengesellschaft Raccord rapide
EP0452670A3 (en) * 1990-03-16 1992-02-26 Asea Brown Boveri Aktiengesellschaft Quick acting coupling

Also Published As

Publication number Publication date
HK17079A (en) 1979-04-06
FR2330247B1 (fr) 1979-06-29
HK16979A (en) 1979-04-06
GB1491569A (en) 1977-11-09
GB1491570A (en) 1977-11-09

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Legal Events

Date Code Title Description
ST Notification of lapse