FR2326780B1 - - Google Patents

Info

Publication number
FR2326780B1
FR2326780B1 FR7629645A FR7629645A FR2326780B1 FR 2326780 B1 FR2326780 B1 FR 2326780B1 FR 7629645 A FR7629645 A FR 7629645A FR 7629645 A FR7629645 A FR 7629645A FR 2326780 B1 FR2326780 B1 FR 2326780B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7629645A
Other languages
French (fr)
Other versions
FR2326780A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Publication of FR2326780A1 publication Critical patent/FR2326780A1/fr
Application granted granted Critical
Publication of FR2326780B1 publication Critical patent/FR2326780B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
FR7629645A 1975-10-02 1976-10-01 Circuit integre, amplificateur en particulier, a substrat semi-conducteur enrobe dans un isolant avec des connexions planes ne reposant pas sur lui Granted FR2326780A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19752543968 DE2543968A1 (de) 1975-10-02 1975-10-02 Integrierte schaltungsanordnung

Publications (2)

Publication Number Publication Date
FR2326780A1 FR2326780A1 (fr) 1977-04-29
FR2326780B1 true FR2326780B1 (member.php) 1982-10-22

Family

ID=5958044

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7629645A Granted FR2326780A1 (fr) 1975-10-02 1976-10-01 Circuit integre, amplificateur en particulier, a substrat semi-conducteur enrobe dans un isolant avec des connexions planes ne reposant pas sur lui

Country Status (6)

Country Link
JP (1) JPS5252574A (member.php)
DE (1) DE2543968A1 (member.php)
FR (1) FR2326780A1 (member.php)
GB (1) GB1540598A (member.php)
IT (1) IT1073327B (member.php)
NL (1) NL7610920A (member.php)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55163850A (en) * 1979-06-08 1980-12-20 Fujitsu Ltd Semiconductor device
JPS55166943A (en) * 1979-06-15 1980-12-26 Fujitsu Ltd Semiconductor device
GB2100521B (en) * 1981-05-13 1984-09-12 Plessey Co Plc Electrical device package
FR2524707B1 (fr) * 1982-04-01 1985-05-31 Cit Alcatel Procede d'encapsulation de composants semi-conducteurs, et composants encapsules obtenus
JPS5989542U (ja) * 1982-12-08 1984-06-18 日本電気株式会社 モノリシツク集積回路容器
EP0237725A1 (en) * 1986-03-20 1987-09-23 GTE Products Corporation Plastic integrated circuit package having reduced moisture absorbtion
JP2506233Y2 (ja) * 1990-05-07 1996-08-07 株式会社共立 管構造
JPH086522Y2 (ja) * 1990-05-09 1996-02-28 株式会社共立 噴管支持ハンドル
KR960000706B1 (ko) * 1993-07-12 1996-01-11 한국전기통신공사 전력소자용 플라스틱 패키지 구조 및 그 제조방법

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3489953A (en) * 1964-09-18 1970-01-13 Texas Instruments Inc Stabilized integrated circuit and process for fabricating same
US3518504A (en) * 1966-11-15 1970-06-30 Int Standard Electric Corp Transistor with lead-in electrodes
US3614546A (en) * 1970-01-07 1971-10-19 Rca Corp Shielded semiconductor device

Also Published As

Publication number Publication date
DE2543968A1 (de) 1977-04-07
FR2326780A1 (fr) 1977-04-29
GB1540598A (en) 1979-02-14
IT1073327B (it) 1985-04-17
NL7610920A (nl) 1977-04-05
JPS5252574A (en) 1977-04-27

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Legal Events

Date Code Title Description
ST Notification of lapse