FR2326040A1 - Groupe a semi-conducteurs et procede de fabrication de celui-ci - Google Patents

Groupe a semi-conducteurs et procede de fabrication de celui-ci

Info

Publication number
FR2326040A1
FR2326040A1 FR7628148A FR7628148A FR2326040A1 FR 2326040 A1 FR2326040 A1 FR 2326040A1 FR 7628148 A FR7628148 A FR 7628148A FR 7628148 A FR7628148 A FR 7628148A FR 2326040 A1 FR2326040 A1 FR 2326040A1
Authority
FR
France
Prior art keywords
yoke
manufacturing
same
clamping bolts
semiconductor group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7628148A
Other languages
English (en)
French (fr)
Other versions
FR2326040B1 (enExample
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Brown Boveri AG Switzerland
Original Assignee
BBC Brown Boveri AG Switzerland
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC Brown Boveri AG Switzerland filed Critical BBC Brown Boveri AG Switzerland
Publication of FR2326040A1 publication Critical patent/FR2326040A1/fr
Application granted granted Critical
Publication of FR2326040B1 publication Critical patent/FR2326040B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
  • Devices For Conveying Motion By Means Of Endless Flexible Members (AREA)
  • Jigs For Machine Tools (AREA)
FR7628148A 1975-09-23 1976-09-20 Groupe a semi-conducteurs et procede de fabrication de celui-ci Granted FR2326040A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1232075A CH592961A5 (enExample) 1975-09-23 1975-09-23

Publications (2)

Publication Number Publication Date
FR2326040A1 true FR2326040A1 (fr) 1977-04-22
FR2326040B1 FR2326040B1 (enExample) 1982-07-16

Family

ID=4381916

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7628148A Granted FR2326040A1 (fr) 1975-09-23 1976-09-20 Groupe a semi-conducteurs et procede de fabrication de celui-ci

Country Status (4)

Country Link
CH (1) CH592961A5 (enExample)
DE (2) DE7532876U (enExample)
FR (1) FR2326040A1 (enExample)
NO (1) NO146220C (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2539943A1 (fr) * 1983-01-19 1984-07-27 Westinghouse Electric Corp Support a auto-alignement et autocompression pour supporter en le serrant un dispositif a semi-conducteurs
EP0334708A1 (fr) * 1988-03-22 1989-09-27 Bull S.A. Dispositif de fixation à pression de deux pièces l'une à l'autre et boîtier de circuit intégré mettant en oevre ce dispositif

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB971703A (en) * 1960-05-18 1964-10-07 Siemens Ag A semiconductor device
FR1486215A (fr) * 1965-07-09 1967-06-23 Asea Ab Dispositif à semi-conducteur
US3467897A (en) * 1965-04-23 1969-09-16 Siemens Ag Housing arrangement for rectifier device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1001269A (enExample) * 1960-09-30 1900-01-01
CH526857A (de) * 1970-09-29 1972-08-15 Bbc Brown Boveri & Cie Halbleitereinheit und Verfahren zur Herstellung derselben

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB971703A (en) * 1960-05-18 1964-10-07 Siemens Ag A semiconductor device
US3467897A (en) * 1965-04-23 1969-09-16 Siemens Ag Housing arrangement for rectifier device
FR1486215A (fr) * 1965-07-09 1967-06-23 Asea Ab Dispositif à semi-conducteur

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2539943A1 (fr) * 1983-01-19 1984-07-27 Westinghouse Electric Corp Support a auto-alignement et autocompression pour supporter en le serrant un dispositif a semi-conducteurs
EP0334708A1 (fr) * 1988-03-22 1989-09-27 Bull S.A. Dispositif de fixation à pression de deux pièces l'une à l'autre et boîtier de circuit intégré mettant en oevre ce dispositif
FR2629153A1 (fr) * 1988-03-22 1989-09-29 Bull Sa Dispositif de fixation a pression de deux pieces l'une a l'autre
US5010949A (en) * 1988-03-22 1991-04-30 Bull, S.A. Device for fastening together under pressure two pieces, one to the other

Also Published As

Publication number Publication date
NO146220C (no) 1982-08-18
NO763210L (no) 1977-03-24
NO146220B (no) 1982-05-10
CH592961A5 (enExample) 1977-11-15
DE2546312A1 (de) 1977-03-24
DE7532876U (de) 1977-06-30
FR2326040B1 (enExample) 1982-07-16

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Legal Events

Date Code Title Description
ST Notification of lapse