FR2326040A1 - Semiconductor device with clamped chips - uses prestressed coiled springs on clamping bolts for compression between stack holding pressure elements - Google Patents
Semiconductor device with clamped chips - uses prestressed coiled springs on clamping bolts for compression between stack holding pressure elementsInfo
- Publication number
- FR2326040A1 FR2326040A1 FR7628148A FR7628148A FR2326040A1 FR 2326040 A1 FR2326040 A1 FR 2326040A1 FR 7628148 A FR7628148 A FR 7628148A FR 7628148 A FR7628148 A FR 7628148A FR 2326040 A1 FR2326040 A1 FR 2326040A1
- Authority
- FR
- France
- Prior art keywords
- chips
- clamping bolts
- clamped
- coiled springs
- pressure elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
- Devices For Conveying Motion By Means Of Endless Flexible Members (AREA)
- Jigs For Machine Tools (AREA)
Abstract
Several semiconductor disc-shaped chips ate clamped between pressure elements in such manner that the chips abut the respective pressure elements with opposite lateral surfaces. Clamping bolts extend at right angles to the element plane. Their one end is connected by a yoke, abutting the adjacent pressure element via springs. Coiled springs (15) are provided for this abutment and afford prestressing for this purpose. Preferably stops or spacing pins (12) are provided between the yoke (11) and the adjacent pressure element (5). The coiled springs may be mounted on the clamping bolts (6), or alternately on the spacing pins.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH1232075A CH592961A5 (en) | 1975-09-23 | 1975-09-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2326040A1 true FR2326040A1 (en) | 1977-04-22 |
FR2326040B1 FR2326040B1 (en) | 1982-07-16 |
Family
ID=4381916
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7628148A Granted FR2326040A1 (en) | 1975-09-23 | 1976-09-20 | Semiconductor device with clamped chips - uses prestressed coiled springs on clamping bolts for compression between stack holding pressure elements |
Country Status (4)
Country | Link |
---|---|
CH (1) | CH592961A5 (en) |
DE (2) | DE2546312A1 (en) |
FR (1) | FR2326040A1 (en) |
NO (1) | NO146220C (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2539943A1 (en) * | 1983-01-19 | 1984-07-27 | Westinghouse Electric Corp | SELF-ALIGNMENT AND AUTOCOMPRESSION SUPPORT FOR TIGHTENING A SEMICONDUCTOR DEVICE |
EP0334708A1 (en) * | 1988-03-22 | 1989-09-27 | Bull S.A. | Device for joining two pieces together under pressure and integrated circuit package using said device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB971703A (en) * | 1960-05-18 | 1964-10-07 | Siemens Ag | A semiconductor device |
FR1486215A (en) * | 1965-07-09 | 1967-06-23 | Asea Ab | Semiconductor device |
US3467897A (en) * | 1965-04-23 | 1969-09-16 | Siemens Ag | Housing arrangement for rectifier device |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1001269A (en) * | 1960-09-30 | 1900-01-01 | ||
CH526857A (en) * | 1970-09-29 | 1972-08-15 | Bbc Brown Boveri & Cie | Semiconductor device and method of manufacturing the same |
-
1975
- 1975-09-23 CH CH1232075A patent/CH592961A5/xx not_active IP Right Cessation
- 1975-10-16 DE DE19752546312 patent/DE2546312A1/en not_active Ceased
- 1975-10-16 DE DE19757532876U patent/DE7532876U/en not_active Expired
-
1976
- 1976-09-20 NO NO763210A patent/NO146220C/en unknown
- 1976-09-20 FR FR7628148A patent/FR2326040A1/en active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB971703A (en) * | 1960-05-18 | 1964-10-07 | Siemens Ag | A semiconductor device |
US3467897A (en) * | 1965-04-23 | 1969-09-16 | Siemens Ag | Housing arrangement for rectifier device |
FR1486215A (en) * | 1965-07-09 | 1967-06-23 | Asea Ab | Semiconductor device |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2539943A1 (en) * | 1983-01-19 | 1984-07-27 | Westinghouse Electric Corp | SELF-ALIGNMENT AND AUTOCOMPRESSION SUPPORT FOR TIGHTENING A SEMICONDUCTOR DEVICE |
EP0334708A1 (en) * | 1988-03-22 | 1989-09-27 | Bull S.A. | Device for joining two pieces together under pressure and integrated circuit package using said device |
FR2629153A1 (en) * | 1988-03-22 | 1989-09-29 | Bull Sa | DEVICE FOR PRESSURE FIXING OF TWO PIECES TO ONE ANOTHER |
US5010949A (en) * | 1988-03-22 | 1991-04-30 | Bull, S.A. | Device for fastening together under pressure two pieces, one to the other |
Also Published As
Publication number | Publication date |
---|---|
CH592961A5 (en) | 1977-11-15 |
NO146220C (en) | 1982-08-18 |
FR2326040B1 (en) | 1982-07-16 |
NO146220B (en) | 1982-05-10 |
DE2546312A1 (en) | 1977-03-24 |
NO763210L (en) | 1977-03-24 |
DE7532876U (en) | 1977-06-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |