NO146220B - PROCEDURE FOR ADJUSTING PREDICTED TENSION POWER IN AT LEAST ONE SCREW PRESSURE SPRING IN A SEMICONDUCTOR UNIT - Google Patents
PROCEDURE FOR ADJUSTING PREDICTED TENSION POWER IN AT LEAST ONE SCREW PRESSURE SPRING IN A SEMICONDUCTOR UNIT Download PDFInfo
- Publication number
- NO146220B NO146220B NO763210A NO763210A NO146220B NO 146220 B NO146220 B NO 146220B NO 763210 A NO763210 A NO 763210A NO 763210 A NO763210 A NO 763210A NO 146220 B NO146220 B NO 146220B
- Authority
- NO
- Norway
- Prior art keywords
- yoke
- pressure
- screw
- semiconductor
- semiconductor unit
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims description 20
- 238000000034 method Methods 0.000 title claims description 5
- 230000006835 compression Effects 0.000 claims description 4
- 238000007906 compression Methods 0.000 claims description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- 230000003993 interaction Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
- Devices For Conveying Motion By Means Of Endless Flexible Members (AREA)
Description
Oppfinnelsen vedrører en fremgangsmåte for justering av en forutbestemt spennkraft i minst en skrueformet trykkfjær i en halvlederenhet med minst et halvleder-skiveelement og med to trykklegemer som er forbundet med minst to spennbolter, idet de skrueformede trykkfjærer hvis spennkraft skal justeres, er anordnet i aksial retning mellom et åk og et trykklegeme, og idet det mellom åket og trykklegemet befinner seg i det minste et anslag (avstandsstift). The invention relates to a method for adjusting a predetermined tension force in at least one helical pressure spring in a semiconductor unit with at least one semiconductor disc element and with two pressure bodies which are connected by at least two tension bolts, the helical compression springs whose tension force is to be adjusted being arranged in the axial direction between a yoke and a pressure body, and since there is at least one stop (distance pin) between the yoke and the pressure body.
Halvlederenheter av denne type er kjent (sveitsisk patent 522 288 og 526 857). Ved disse halvlederenheter er det anordnet tallerkenfjærpakker, som forspennes av en skrue som påvirker åket, inntil åket er i anlegg mot et anslag, slik at en fastlagt fastspenningskraft er innstilt for tallerken-fjærpakken. Spennboltene er skrudd inn i åket og i sine andre ender forsynt med tallerkenfjærer, som avstøtter bolt-hodet mot trykklegemet. Fjærene har den funksjon å begrense den trykkforandring mellom trykklegemene og halvleder-skiveelementet som oppstår ved strekking av spennbolten ved fast-spenning eller ved ekstremt stor varmeekspansjon av halvlederenheten. Semiconductor devices of this type are known (Swiss patent 522 288 and 526 857). At these semiconductor units, plate spring packs are arranged, which are biased by a screw that affects the yoke, until the yoke is in contact with a stop, so that a fixed clamping force is set for the plate spring pack. The tension bolts are screwed into the yoke and at their other ends are provided with plate springs, which push the bolt head against the pressure body. The springs have the function of limiting the pressure change between the pressure bodies and the semiconductor disc element that occurs when the tension bolt is stretched during fixed tension or when there is extremely large thermal expansion of the semiconductor unit.
Tallerkenfjærpakker eller bladfjærer i flere lag har den ulempe at det for hver lagfriksjonsflate oppstår ca. 5% arbeidstap. Dette er et betydelig tap, idet lag opp til 10 fjærelementer er vanlige. Fjærkraft-fjærstreknings-ka-rakteristikken har en hysterese som skyldes arbeidstapet. Dessuten utgjør fjærkraftens toleranser opp til 20% ved tallerkenfjærer. Disse ulemper medfører at det opptrer ve-sentlige spennkraftforandringer ved ringe forandringer, f.eks. som følge av strekking eller oppvarming av spenn-bøyleboltene. Det er ikke mulig å bruke en bladfjær i ett lag, da denne har for lav fjærkraft hhv. for liten f jær-strekning og et for stort bøyemoment ved tilstrekkelig fjærkraft. Disc spring packages or leaf springs in several layers have the disadvantage that for each layer friction surface approx. 5% labor loss. This is a significant loss, as layers of up to 10 spring elements are common. The spring force-spring extension characteristic has a hysteresis due to the work loss. In addition, the tolerances of the spring force amount to up to 20% for disc springs. These disadvantages mean that there are significant changes in the tensile force due to small changes, e.g. as a result of stretching or heating the turnbuckle bolts. It is not possible to use a leaf spring in one layer, as this has too little spring force or too little spring extension and too much bending moment with sufficient spring force.
Halvlederenhetene som er beskrevet i sveitsisk patent The semiconductor devices described in the Swiss patent
522 288 og 526 857 forutsetter adkomst på begge sider ved 522 288 and 526 857 require access on both sides
montering eller utskiftning av halvleder-skiveelementene, skjønt dette på grunn av plassmangel ikke alltid er mulig. assembly or replacement of the semiconductor disc elements, although this is not always possible due to lack of space.
Foreliggende oppfinnelse går ut på å tilveiebringe en fremgangsmåte av innledningsvis nevnte type, som unngår ulempene knyttet til de kjente løsninger og hvor konstant trykk mellom trykklegemene og halvleder-skiveelementet sikres selv ved ringe lengdeforandring av spennboltene. The present invention aims to provide a method of the type mentioned at the outset, which avoids the disadvantages associated with the known solutions and where constant pressure between the pressure bodies and the semiconductor disc element is ensured even with a slight change in length of the clamping bolts.
Denne oppgave løses ifølge fremgangsmåten ved at åket beveges i aksial retning ved tiltrekning av en skrue inntil åket ligger an mot anslaget, hvorved også de skrueformede trykkfjærer spennes til den forutbestemte fjærkraft, at derefter åkets avstand fra trykklegemet fikseres, og at til slutt skruen for aksial bevegelse av åket, løsnes. This task is solved according to the method by moving the yoke in an axial direction by tightening a screw until the yoke rests against the stop, whereby the helical pressure springs are also tensioned to the predetermined spring force, then the distance of the yoke from the pressure body is fixed, and finally the screw for axial movement of the yoke, loosen.
Oppfinnelsen skal nu nærmere beskrives i det efterfølgende under henvisning til tegningen. The invention will now be described in more detail below with reference to the drawing.
■ .j ■ .j
Et halvleder-skiveelement 1, hvis parallelle sideflater er A semiconductor disc element 1, whose parallel side surfaces are
i anlegg mot hver sin strømskinne 2,3, er sammen med strøm-skinnene 2,3 fastspent mellom to aluminium-trykklegemer 4,5. De sistnevnte legemer 4,5 éfc forsynt med hver sine to boringer som forløper' "perpendikulært på halvlederelementets 1 skiveplan. I boringene foreligger spennbolter 6, som med en ende er innstøpt i en basisplate 7. Sammen med basisplaten 7 danner spennboltene 6 en spennbøyle 8, som er festet med en skrue 9 på utsiden av trykklegemet 4. Spennboltenes 6 frie ender er utformet som gjengetapper. Bøylen 8 er bort-sett fra gjengetappene 10 allsidig belagt med et isolerende kunststoff. Et åk 11 er forsynt med tre boringer perpendikulært på plateplanet, hvorved avstanden mellom de to ytre boringer svarer til avstanden mellom boltene 6 og tredje boring befinner seg nøyaktig midt mellom de ytre boringer. På åket 11 er det montert to avstandsstifter 12 mellom boringene. Åket 11 er anordnet slik på boltene 6 at avstandsstiftene står i vekselvirkning med trykklegemet 5. Åket 11 er festet med to muttere 13 som er skrudd fast på gjengetappene 10. En skrue 14 er ført gjennom midtre boring i in contact with each of the current rails 2,3, together with the current rails 2,3 are clamped between two aluminum pressure bodies 4,5. The latter bodies 4,5 éfc are each provided with two bores which run perpendicular to the disc plane of the semiconductor element 1. In the bores there are clamping bolts 6, one end of which is embedded in a base plate 7. Together with the base plate 7, the clamping bolts 6 form a clamping bracket 8 , which is fixed with a screw 9 on the outside of the pressure body 4. The free ends of the tension bolts 6 are designed as threaded studs. The hanger 8 is coated on all sides with an insulating plastic apart from the threaded studs 10. A yoke 11 is provided with three bores perpendicular to the plate plane , whereby the distance between the two outer bores corresponds to the distance between the bolts 6 and the third bore is located exactly in the middle between the outer bores. Two spacer pins 12 are mounted on the yoke 11 between the bores. The yoke 11 is arranged on the bolts 6 so that the spacer pins are in interaction with the pressure body 5. The yoke 11 is fixed with two nuts 13 which are screwed onto the threaded studs 10. A screw 14 is passed through the central bore in
åket 11 og skrudd inn i trykklegemet 5. Mellom trykklegemet 5 og åket 11 foreligger tre skruefjærer 15, en på hver bolt the yoke 11 and screwed into the pressure body 5. Between the pressure body 5 and the yoke 11 there are three coil springs 15, one on each bolt
6 og en på skruen 14. 6 and one on screw 14.
Ved fremstilling av halvlederenheten. går man frem slik at man innfører halvlederelementet 1 mellom trykklegemene 4,5 og de dertil festede strømskinner 2,3, skyver en skruefjær 15 på hver bolt 6, fører skruen 14 gjennom åkets 11 midtre boring og setter en skruefjær 15 på skruen 14. Åket 11 an-bringes slik på boltene 6 at avstandsstiftene 12 vender mot trykklegemet 5. Nu skrues skruen 14 så langt inn i trykklegemene 5 at avstandsstiftene står i vekselvirkning med trykklegemet 5. Dermed er skruefjærene 15 forspent med den nominelle fjærkraft. Mutterne 13 trekkes derefter til for hånd og skruen 14 løsnes så meget igjen at kraftoverføringen skjer over spennboltene 6. When manufacturing the semiconductor device. proceed so that the semiconductor element 1 is inserted between the pressure bodies 4,5 and the current rails 2,3 attached thereto, push a coil spring 15 onto each bolt 6, guide the screw 14 through the central bore of the yoke 11 and place a coil spring 15 on the screw 14. The yoke 11 is placed on the bolts 6 so that the spacer pins 12 face the pressure body 5. Now the screw 14 is screwed into the pressure bodies 5 so far that the spacer pins are in interaction with the pressure body 5. Thus, the coil springs 15 are pre-tensioned with the nominal spring force. The nuts 13 are then tightened by hand and the screw 14 is loosened again so much that the force is transmitted over the tension bolts 6.
Dimensjoneringen av skruefjærene 15 og antallet benyttede skruefjærer 15 avhenger av det nødvendige trykk mellom halvleder-skiveelementet 1 og trykklegemene 4,5. Skruefjærer 15 hvis fjærutslag ved nominell fjærkraft utgjør ca. 40 ganger den forventede, maksimale lengdeforandring har vist seg spesielt velegnet. Fjærkraft-endringen er ubetydelig ved slike små lengdeforandringer. Dermed sikrer halvlederenhetene konstant kontakttrykk mellom halvleder-skiveelementet 1 og trykklegemene 4,5. The dimensioning of the coil springs 15 and the number of coil springs 15 used depends on the required pressure between the semiconductor disk element 1 and the pressure bodies 4,5. Coil springs 15 whose spring deflection at nominal spring force amounts to approx. 40 times the expected maximum change in length has proven particularly suitable. The spring force change is negligible for such small changes in length. Thus, the semiconductor units ensure constant contact pressure between the semiconductor disk element 1 and the pressure bodies 4,5.
Ved halvlederenheter, hvor spennboltene 6 er fast montert i trykklegemet 4, må det anordnes tilstrekkelig isolasjon mellom trykklegemet 5 og de metalliske deler som står i kon-takt med dette. In the case of semiconductor units, where the clamping bolts 6 are firmly mounted in the pressure body 4, sufficient insulation must be provided between the pressure body 5 and the metallic parts that are in contact with it.
Claims (1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH1232075A CH592961A5 (en) | 1975-09-23 | 1975-09-23 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| NO763210L NO763210L (en) | 1977-03-24 |
| NO146220B true NO146220B (en) | 1982-05-10 |
| NO146220C NO146220C (en) | 1982-08-18 |
Family
ID=4381916
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO763210A NO146220C (en) | 1975-09-23 | 1976-09-20 | PROCEDURE FOR ADJUSTING PREDICTED TENSION POWER IN AT LEAST ONE SCREW PRESSURE SPRING IN A SEMICONDUCTOR UNIT |
Country Status (4)
| Country | Link |
|---|---|
| CH (1) | CH592961A5 (en) |
| DE (2) | DE7532876U (en) |
| FR (1) | FR2326040A1 (en) |
| NO (1) | NO146220C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2135119A (en) * | 1983-01-19 | 1984-08-22 | Westinghouse Electric Corp | Self-aligning, self-loading semiconductor clamp |
| FR2629153B1 (en) * | 1988-03-22 | 1990-05-04 | Bull Sa | DEVICE FOR PRESSURE FIXING OF TWO PIECES TO ONE ANOTHER |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1185728B (en) * | 1960-05-18 | 1965-01-21 | Siemens Ag | Semiconductor arrangement, in particular surface rectifier or transistor with a single-crystal semiconductor element |
| GB1001269A (en) * | 1960-09-30 | 1900-01-01 | ||
| CH442502A (en) * | 1965-04-23 | 1967-08-31 | Siemens Ag | Rectifier system |
| SE316534B (en) * | 1965-07-09 | 1969-10-27 | Asea Ab | |
| CH526857A (en) * | 1970-09-29 | 1972-08-15 | Bbc Brown Boveri & Cie | Semiconductor device and method of manufacturing the same |
-
1975
- 1975-09-23 CH CH1232075A patent/CH592961A5/xx not_active IP Right Cessation
- 1975-10-16 DE DE19757532876U patent/DE7532876U/en not_active Expired
- 1975-10-16 DE DE19752546312 patent/DE2546312A1/en not_active Ceased
-
1976
- 1976-09-20 FR FR7628148A patent/FR2326040A1/en active Granted
- 1976-09-20 NO NO763210A patent/NO146220C/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CH592961A5 (en) | 1977-11-15 |
| FR2326040A1 (en) | 1977-04-22 |
| NO146220C (en) | 1982-08-18 |
| DE2546312A1 (en) | 1977-03-24 |
| FR2326040B1 (en) | 1982-07-16 |
| DE7532876U (en) | 1977-06-30 |
| NO763210L (en) | 1977-03-24 |
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