FR2287714B1 - - Google Patents

Info

Publication number
FR2287714B1
FR2287714B1 FR7530652A FR7530652A FR2287714B1 FR 2287714 B1 FR2287714 B1 FR 2287714B1 FR 7530652 A FR7530652 A FR 7530652A FR 7530652 A FR7530652 A FR 7530652A FR 2287714 B1 FR2287714 B1 FR 2287714B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7530652A
Other languages
French (fr)
Other versions
FR2287714A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of FR2287714A1 publication Critical patent/FR2287714A1/fr
Application granted granted Critical
Publication of FR2287714B1 publication Critical patent/FR2287714B1/fr
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/22Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
    • B32B37/223One or more of the layers being plastic
    • B32B37/226Laminating sheets, panels or inserts between two continuous plastic layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1018Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • G03F7/161Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/281Applying non-metallic protective coatings by means of a preformed insulating foil
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00Other particular articles
    • B29L2031/34Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425Printed circuits
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/08PCBs, i.e. printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06Lamination
    • H05K2203/068Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08Treatments involving gases
    • H05K2203/085Using vacuum or low pressure

Landscapes

  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Laminated Bodies (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
FR7530652A 1974-10-08 1975-10-07 Procede d'application d'une couche de formation de reserve photosensible sur une surface ayant des zones en relief Granted FR2287714A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US51311274A 1974-10-08 1974-10-08
US56890475A 1975-04-17 1975-04-17

Publications (2)

Publication Number Publication Date
FR2287714A1 FR2287714A1 (fr) 1976-05-07
FR2287714B1 true FR2287714B1 (US06653308-20031125-C00199.png) 1982-10-15

Family

ID=27057750

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7530652A Granted FR2287714A1 (fr) 1974-10-08 1975-10-07 Procede d'application d'une couche de formation de reserve photosensible sur une surface ayant des zones en relief

Country Status (5)

Country Link
JP (1) JPS5513341B2 (US06653308-20031125-C00199.png)
DE (1) DE2544553C2 (US06653308-20031125-C00199.png)
FR (1) FR2287714A1 (US06653308-20031125-C00199.png)
GB (1) GB1517302A (US06653308-20031125-C00199.png)
NL (1) NL7511714A (US06653308-20031125-C00199.png)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4069076A (en) * 1976-11-29 1978-01-17 E. I. Du Pont De Nemours And Company Liquid lamination process
JPS5489274A (en) * 1977-12-27 1979-07-16 Fujitsu Ltd Method of making printed board
US4289480A (en) * 1979-11-02 1981-09-15 E. I. Du Pont De Nemours And Company Process for heating thin surface layers
DE3342678C2 (de) * 1983-11-25 1995-08-31 Held Kurt Verfahren und Vorrichtung zur kontinuierlichen Herstellung metallkaschierter Laminate
JPS6252552A (ja) * 1985-08-30 1987-03-07 Hitachi Chem Co Ltd 減圧貼り合わせ方法及び装置
JPS63259559A (ja) * 1987-04-16 1988-10-26 Hitachi Condenser Co Ltd 印刷配線板のパタ−ン形成方法
DE3737945A1 (de) * 1987-11-07 1989-05-24 Anger Wolfgang Vakuum-laminator
DK8689A (da) * 1988-01-11 1989-07-12 Thiokol Morton Inc Fremgangsmaade og apparat til placering af polymere materialer paa trykte kredsloebskort
US4834821A (en) * 1988-01-11 1989-05-30 Morton Thiokol, Inc. Process for preparing polymeric materials for application to printed circuits
US4992354A (en) * 1988-02-26 1991-02-12 Morton International, Inc. Dry film photoresist for forming a conformable mask and method of application to a printed circuit board or the like
US5078820A (en) * 1988-03-25 1992-01-07 Somar Corporation Method and apparatus for pressure sticking a thin film to a base plate
US4927733A (en) * 1988-12-23 1990-05-22 E. I. Du Pont De Nemours And Company Conformation of vacuum - laminated solder mask coated printed circuit boards by fluid pressurizing
DE4018177A1 (de) * 1990-06-07 1991-12-12 Anger Electronic Gmbh Verfahren zum laminieren von platten und vorrichtung zur durchfuerhrung des verfahrens
DE4026802A1 (de) * 1990-08-24 1992-02-27 Anger Electronic Gmbh Vorrichtung zum kaschieren einer leiterplatte
DE4222262A1 (de) * 1991-09-03 1993-03-04 Anger Electronic Gmbh Vorrichtung zum laminieren von kunststoffprodukten, insbesondere leiterplatten, pvc-folien, polycarbonatfolien und dergleichen
DE9111708U1 (de) * 1991-09-19 1992-04-16 Anger Electronic Ges.m.b.H. Emco InnovationsCenter, Hallein Vorrichtung zum Kaschieren (Laminieren) von bedruckten und unbedruckten Folien
IT1274181B (it) * 1994-05-18 1997-07-15 Amedeo Candore Laminazione di pellicole fotosensibili per formare una maschera di saldatura su schede di circuito stampato
DE19609590A1 (de) * 1996-03-12 1997-09-18 Kontron Elektronik Verfahren und Vorrichtung zur Beschichtung von Substraten, vorzugsweise Leiterplatten
MY120763A (en) 1997-09-19 2005-11-30 Hitachi Chemical Co Ltd Photosensitive film, process for laminating photosensitive resin layer, photosensitive resin layer-laminated substrate and process for curing photosensitive resin layer
EP1117006A1 (en) * 2000-01-14 2001-07-18 Shipley Company LLC Photoresist having increased photospeed
US7067226B2 (en) 2001-03-29 2006-06-27 Hitachi Chemical Co., Ltd. Photosensitive film for circuit formation and process for producing printed wiring board
US8801887B2 (en) 2005-12-23 2014-08-12 The Boeing Company Textured structure and method of making the textured structure
ES2503791T3 (es) * 2009-08-13 2014-10-07 Dow Global Technologies Llc Una estructura laminada multicapas y método de fabricación
EP2652799A2 (en) 2010-12-17 2013-10-23 Dow Global Technologies LLC Improved photovoltaic device
CN113473709B (zh) * 2020-03-31 2022-05-31 竞华电子(深圳)有限公司 印制电路板加工方法及印制电路板

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1293655B (US06653308-20031125-C00199.png) * 1969-04-24
US3042574A (en) * 1957-09-25 1962-07-03 Du Pont Method of making laminated structures
NL302012A (US06653308-20031125-C00199.png) * 1963-08-14
CA757597A (en) * 1963-12-30 1967-04-25 L. Mees John Method for making printed circuits
JPS4518324Y1 (US06653308-20031125-C00199.png) * 1966-12-19 1970-07-27
JPS449363Y1 (US06653308-20031125-C00199.png) * 1968-08-05 1969-04-16
US3469982A (en) * 1968-09-11 1969-09-30 Jack Richard Celeste Process for making photoresists
DE1953883A1 (de) * 1969-10-25 1971-05-06 Dornbusch & Co Verfahren zum flaechigen Verschweissen von aufgeheizten Warenbahnen,insbesondere von thermoplastischen Kunststoff-Folien,sowie Vorrichtung zur Durchfuehrung des Verfahrens
FR2123089B1 (US06653308-20031125-C00199.png) * 1970-12-11 1974-08-23 Saint Gobain
JPS48100201A (US06653308-20031125-C00199.png) * 1972-04-04 1973-12-18
JPS5129443B2 (US06653308-20031125-C00199.png) * 1972-07-20 1976-08-25
JPS49103167A (US06653308-20031125-C00199.png) * 1973-02-08 1974-09-30
JPS5434909B2 (US06653308-20031125-C00199.png) * 1973-02-08 1979-10-30

Also Published As

Publication number Publication date
JPS5163702A (US06653308-20031125-C00199.png) 1976-06-02
DE2544553A1 (de) 1976-04-22
JPS5513341B2 (US06653308-20031125-C00199.png) 1980-04-08
DE2544553C2 (de) 1983-08-04
GB1517302A (en) 1978-07-12
NL7511714A (nl) 1976-04-12
FR2287714A1 (fr) 1976-05-07

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