FR2267000A1 - Substrate mounted microcircuit element - utilises both sides of substrate to form filter or coupler - Google Patents

Substrate mounted microcircuit element - utilises both sides of substrate to form filter or coupler

Info

Publication number
FR2267000A1
FR2267000A1 FR7412135A FR7412135A FR2267000A1 FR 2267000 A1 FR2267000 A1 FR 2267000A1 FR 7412135 A FR7412135 A FR 7412135A FR 7412135 A FR7412135 A FR 7412135A FR 2267000 A1 FR2267000 A1 FR 2267000A1
Authority
FR
France
Prior art keywords
substrate
coupler
capacitors
utilises
sides
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7412135A
Other languages
French (fr)
Other versions
FR2267000B1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR7412135A priority Critical patent/FR2267000A1/en
Publication of FR2267000A1 publication Critical patent/FR2267000A1/en
Application granted granted Critical
Publication of FR2267000B1 publication Critical patent/FR2267000B1/fr
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/01Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

The coupler, filter etc. uses resistors, capacitors and inductors laid on the two opposing faces of an insulating substrate. Capacitors may be formed by etching opposing faces of metallisation and coupling between inductors similarly obtained. A T filter of series capacitors and a series LC circuit earthed form their junction (A) is built up such that the capacitor junction (b3-a4) is a single metal surface, the associated capacitor elements lying on the opposite face of the substrate. A ground or earth zone (2) is left as a strip on one edge of the substrate and also forms the ground side of the Lc capacitor (b6).
FR7412135A 1974-04-05 1974-04-05 Substrate mounted microcircuit element - utilises both sides of substrate to form filter or coupler Granted FR2267000A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7412135A FR2267000A1 (en) 1974-04-05 1974-04-05 Substrate mounted microcircuit element - utilises both sides of substrate to form filter or coupler

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7412135A FR2267000A1 (en) 1974-04-05 1974-04-05 Substrate mounted microcircuit element - utilises both sides of substrate to form filter or coupler

Publications (2)

Publication Number Publication Date
FR2267000A1 true FR2267000A1 (en) 1975-10-31
FR2267000B1 FR2267000B1 (en) 1978-08-04

Family

ID=9137346

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7412135A Granted FR2267000A1 (en) 1974-04-05 1974-04-05 Substrate mounted microcircuit element - utilises both sides of substrate to form filter or coupler

Country Status (1)

Country Link
FR (1) FR2267000A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2472272A1 (en) * 1979-12-21 1981-06-26 Lignes Telegraph Telephon HYBRID PROTECTION COMPONENT AND INCORPORATING CIRCUIT
WO1997012263A2 (en) * 1995-09-29 1997-04-03 Siemens Aktiengesellschaft Transponder and transponder production method
CN110769591A (en) * 2019-11-04 2020-02-07 绵阳市维博电子有限责任公司 Electromagnetic compatibility processing method for replacing high-voltage capacitor and PCB copper coating device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2472272A1 (en) * 1979-12-21 1981-06-26 Lignes Telegraph Telephon HYBRID PROTECTION COMPONENT AND INCORPORATING CIRCUIT
EP0031283A2 (en) * 1979-12-21 1981-07-01 Lignes Telegraphiques Et Telephoniques L.T.T. Protective circuit for a switching circuit
EP0031283A3 (en) * 1979-12-21 1981-10-07 Lignes Telegraphiques Et Telephoniques L.T.T. Protective circuit for a switching circuit
WO1997012263A2 (en) * 1995-09-29 1997-04-03 Siemens Aktiengesellschaft Transponder and transponder production method
WO1997012263A3 (en) * 1995-09-29 1997-06-05 Siemens Ag Transponder and transponder production method
CN110769591A (en) * 2019-11-04 2020-02-07 绵阳市维博电子有限责任公司 Electromagnetic compatibility processing method for replacing high-voltage capacitor and PCB copper coating device

Also Published As

Publication number Publication date
FR2267000B1 (en) 1978-08-04

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Legal Events

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