FR2266305B1 - - Google Patents
Info
- Publication number
- FR2266305B1 FR2266305B1 FR7508898A FR7508898A FR2266305B1 FR 2266305 B1 FR2266305 B1 FR 2266305B1 FR 7508898 A FR7508898 A FR 7508898A FR 7508898 A FR7508898 A FR 7508898A FR 2266305 B1 FR2266305 B1 FR 2266305B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/65—Shapes or dispositions of interconnections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07231—Techniques
- H10W72/07236—Soldering or alloying
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19742415047 DE2415047B2 (de) | 1974-03-28 | 1974-03-28 | Multichip-verdrahtung mit anschlussflaechenkonfigurationen zur kontaktierung von vier gleichen halbleiterspeicher-chips |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2266305A1 FR2266305A1 (en:Method) | 1975-10-24 |
| FR2266305B1 true FR2266305B1 (en:Method) | 1978-02-24 |
Family
ID=5911463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7508898A Expired FR2266305B1 (en:Method) | 1974-03-28 | 1975-03-21 |
Country Status (8)
| Country | Link |
|---|---|
| JP (1) | JPS5836512B2 (en:Method) |
| BE (1) | BE827367A (en:Method) |
| DE (1) | DE2415047B2 (en:Method) |
| FR (1) | FR2266305B1 (en:Method) |
| GB (1) | GB1464080A (en:Method) |
| IT (1) | IT1034529B (en:Method) |
| NL (1) | NL7502773A (en:Method) |
| SE (1) | SE7503369L (en:Method) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3033900C3 (de) * | 1980-09-09 | 1994-12-15 | Siemens Ag | Gehäuseloses Schaltungsmodul und Verfahren zu seiner Herstellung |
| DE3123620A1 (de) * | 1981-06-13 | 1983-01-05 | Telefonbau Und Normalzeit Gmbh, 6000 Frankfurt | Anordnung zum verbinden eines speichers mit einer steuereinrichtung |
| JPS57207356A (en) * | 1981-06-15 | 1982-12-20 | Fujitsu Ltd | Semiconductor device |
| JPH0279123U (en:Method) * | 1988-12-02 | 1990-06-18 | ||
| JPH02285910A (ja) * | 1989-04-26 | 1990-11-26 | Seijiro Isoi | 鳥休止防止具 |
| JPH052533U (ja) * | 1991-02-25 | 1993-01-14 | マサル工業株式会社 | 電線保護カバー |
| GB2312562B (en) * | 1996-04-26 | 2000-05-17 | Appliance Control Technology E | A method of interconnecting wiring with a pcb |
-
1974
- 1974-03-28 DE DE19742415047 patent/DE2415047B2/de active Granted
-
1975
- 1975-03-07 NL NL7502773A patent/NL7502773A/xx not_active Application Discontinuation
- 1975-03-21 GB GB1180675A patent/GB1464080A/en not_active Expired
- 1975-03-21 FR FR7508898A patent/FR2266305B1/fr not_active Expired
- 1975-03-24 SE SE7503369A patent/SE7503369L/xx unknown
- 1975-03-26 IT IT21645/75A patent/IT1034529B/it active
- 1975-03-26 JP JP50036536A patent/JPS5836512B2/ja not_active Expired
- 1975-03-28 BE BE154933A patent/BE827367A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| DE2415047A1 (de) | 1975-10-16 |
| JPS5836512B2 (ja) | 1983-08-09 |
| FR2266305A1 (en:Method) | 1975-10-24 |
| DE2415047C3 (en:Method) | 1978-09-21 |
| BE827367A (fr) | 1975-07-16 |
| DE2415047B2 (de) | 1978-02-02 |
| GB1464080A (en) | 1977-02-09 |
| NL7502773A (nl) | 1975-09-30 |
| IT1034529B (it) | 1979-10-10 |
| SE7503369L (en:Method) | 1975-09-29 |
| JPS50131493A (en:Method) | 1975-10-17 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |