FR2263266A1 - Semiconductive epoxy resin compsn. - contg. polyethyl hydrogen siloxane to improve heat resistance - Google Patents

Semiconductive epoxy resin compsn. - contg. polyethyl hydrogen siloxane to improve heat resistance

Info

Publication number
FR2263266A1
FR2263266A1 FR7407260A FR7407260A FR2263266A1 FR 2263266 A1 FR2263266 A1 FR 2263266A1 FR 7407260 A FR7407260 A FR 7407260A FR 7407260 A FR7407260 A FR 7407260A FR 2263266 A1 FR2263266 A1 FR 2263266A1
Authority
FR
France
Prior art keywords
pts
heat resistance
polyethyl
contg
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7407260A
Other languages
English (en)
French (fr)
Other versions
FR2263266B1 (ref
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GRUSINSKY INST ENERGETIKI
Original Assignee
GRUSINSKY INST ENERGETIKI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GRUSINSKY INST ENERGETIKI filed Critical GRUSINSKY INST ENERGETIKI
Priority to FR7407260A priority Critical patent/FR2263266A1/fr
Publication of FR2263266A1 publication Critical patent/FR2263266A1/fr
Application granted granted Critical
Publication of FR2263266B1 publication Critical patent/FR2263266B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/002—Inhomogeneous material in general
    • H01B3/004—Inhomogeneous material in general with conductive additives or conductive layers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
FR7407260A 1974-03-04 1974-03-04 Semiconductive epoxy resin compsn. - contg. polyethyl hydrogen siloxane to improve heat resistance Granted FR2263266A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7407260A FR2263266A1 (en) 1974-03-04 1974-03-04 Semiconductive epoxy resin compsn. - contg. polyethyl hydrogen siloxane to improve heat resistance

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7407260A FR2263266A1 (en) 1974-03-04 1974-03-04 Semiconductive epoxy resin compsn. - contg. polyethyl hydrogen siloxane to improve heat resistance

Publications (2)

Publication Number Publication Date
FR2263266A1 true FR2263266A1 (en) 1975-10-03
FR2263266B1 FR2263266B1 (ref) 1977-09-16

Family

ID=9135771

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7407260A Granted FR2263266A1 (en) 1974-03-04 1974-03-04 Semiconductive epoxy resin compsn. - contg. polyethyl hydrogen siloxane to improve heat resistance

Country Status (1)

Country Link
FR (1) FR2263266A1 (ref)

Also Published As

Publication number Publication date
FR2263266B1 (ref) 1977-09-16

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Legal Events

Date Code Title Description
ST Notification of lapse