FR2261351B1 - - Google Patents

Info

Publication number
FR2261351B1
FR2261351B1 FR7501951A FR7501951A FR2261351B1 FR 2261351 B1 FR2261351 B1 FR 2261351B1 FR 7501951 A FR7501951 A FR 7501951A FR 7501951 A FR7501951 A FR 7501951A FR 2261351 B1 FR2261351 B1 FR 2261351B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7501951A
Other languages
French (fr)
Other versions
FR2261351A1 (lt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hull & Co R O
Original Assignee
Hull & Co R O
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hull & Co R O filed Critical Hull & Co R O
Publication of FR2261351A1 publication Critical patent/FR2261351A1/fr
Application granted granted Critical
Publication of FR2261351B1 publication Critical patent/FR2261351B1/fr
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
FR7501951A 1974-02-19 1975-01-22 Expired FR2261351B1 (lt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US443406A US3875029A (en) 1974-02-19 1974-02-19 Plating bath for electrodeposition of bright tin and tin-lead alloy

Publications (2)

Publication Number Publication Date
FR2261351A1 FR2261351A1 (lt) 1975-09-12
FR2261351B1 true FR2261351B1 (lt) 1979-09-28

Family

ID=23760674

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7501951A Expired FR2261351B1 (lt) 1974-02-19 1975-01-22

Country Status (7)

Country Link
US (1) US3875029A (lt)
JP (1) JPS581195B2 (lt)
BR (1) BR7500985A (lt)
CA (1) CA1046976A (lt)
ES (1) ES434856A1 (lt)
FR (1) FR2261351B1 (lt)
SE (1) SE419104B (lt)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3977949A (en) * 1975-07-07 1976-08-31 Columbia Chemical Corporation Acidic plating bath and additives for electrodeposition of bright tin
US4207148A (en) * 1975-11-28 1980-06-10 Minnesota Mining And Manufacturing Company Electroplating bath for the electrodeposition of tin and tin/cadmium deposits
US4135991A (en) * 1977-08-12 1979-01-23 R. O. Hull & Company, Inc. Bath and method for electroplating tin and/or lead
US4376018A (en) * 1979-12-31 1983-03-08 Bell Telephone Laboratories, Incorporated Electrodeposition of nickel
US4377449A (en) * 1979-12-31 1983-03-22 Bell Telephone Laboratories, Incorporated Electrolytic silver plating
US4379738A (en) * 1979-12-31 1983-04-12 Bell Telephone Laboratories, Incorporated Electroplating zinc
US4377448A (en) * 1979-12-31 1983-03-22 Bell Telephone Laboratories, Incorporated Electrolytic gold plating
US4263106A (en) * 1979-12-31 1981-04-21 Bell Telephone Laboratories, Incorporated Solder plating process
SE8204505L (sv) * 1981-09-08 1983-03-09 Occidental Chem Co Elektropletering for avsettning av tenn-blylegeringar pa olika underlag
US4871429A (en) * 1981-09-11 1989-10-03 Learonal, Inc Limiting tin sludge formation in tin or tin/lead electroplating solutions
US5094726B1 (en) * 1981-09-11 1993-12-21 I. Nobel Fred Limiting tin sludge formation in tin or tin/lead electroplating solutions
US5066367B1 (en) * 1981-09-11 1993-12-21 I. Nobel Fred Limiting tin sludge formation in tin or tin/lead electroplating solutions
US4586990A (en) * 1982-03-15 1986-05-06 Gsp Metals & Chemicals Corporation Chelating metals
EP0103638A1 (en) * 1982-03-15 1984-03-28 GSP METALS & CHEMICALS CORPORATION Chelating metals
US4530741A (en) * 1984-07-12 1985-07-23 Columbia Chemical Corporation Aqueous acid plating bath and brightener composition for producing bright electrodeposits of tin
US4582576A (en) * 1985-03-26 1986-04-15 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
US4816070A (en) * 1985-08-29 1989-03-28 Techo Instruments Investments Ltd. Use of immersion tin and alloys as a bonding medium for multilayer circuits
US4715894A (en) * 1985-08-29 1987-12-29 Techno Instruments Investments 1983 Ltd. Use of immersion tin and tin alloys as a bonding medium for multilayer circuits
US5174887A (en) * 1987-12-10 1992-12-29 Learonal, Inc. High speed electroplating of tinplate
EP0652306B1 (en) * 1987-12-10 2000-09-27 LeaRonal, Inc. Tin, lead or tin/lead alloy electrolytes for high-speed electroplating
EP0499638B1 (en) * 1989-04-20 1998-12-02 Tokin Corporation Method for Plating a Permanent Magnet of a R2T14B Intermetallic Compound
US4885064A (en) * 1989-05-22 1989-12-05 Mcgean-Rohco, Inc. Additive composition, plating bath and method for electroplating tin and/or lead
US5698087A (en) * 1992-03-11 1997-12-16 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
US5545440A (en) * 1994-12-05 1996-08-13 At&T Global Information Solutions Company (Aka Ncr Corporation) Method and apparatus for polymer coating of substrates
US5597469A (en) * 1995-02-13 1997-01-28 International Business Machines Corporation Process for selective application of solder to circuit packages
US5814202A (en) * 1997-10-14 1998-09-29 Usx Corporation Electrolytic tin plating process with reduced sludge production

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL134963C (lt) * 1963-08-28
NL128321C (lt) * 1965-02-13
US3785939A (en) * 1970-10-22 1974-01-15 Conversion Chem Corp Tin/lead plating bath and method

Also Published As

Publication number Publication date
BR7500985A (pt) 1976-11-16
US3875029A (en) 1975-04-01
SE419104B (sv) 1981-07-13
DE2506158B2 (de) 1976-12-02
JPS50118934A (lt) 1975-09-18
JPS581195B2 (ja) 1983-01-10
SE7501711L (lt) 1975-08-20
CA1046976A (en) 1979-01-23
DE2506158A1 (de) 1975-08-21
AU7620874A (en) 1976-06-10
ES434856A1 (es) 1976-12-01
FR2261351A1 (lt) 1975-09-12

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Legal Events

Date Code Title Description
TP Transmission of property
ST Notification of lapse