FR2261351A1 - - Google Patents

Info

Publication number
FR2261351A1
FR2261351A1 FR7501951A FR7501951A FR2261351A1 FR 2261351 A1 FR2261351 A1 FR 2261351A1 FR 7501951 A FR7501951 A FR 7501951A FR 7501951 A FR7501951 A FR 7501951A FR 2261351 A1 FR2261351 A1 FR 2261351A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7501951A
Other languages
French (fr)
Other versions
FR2261351B1 (enrdf_load_html_response
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hull & Co R O
Original Assignee
Hull & Co R O
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hull & Co R O filed Critical Hull & Co R O
Publication of FR2261351A1 publication Critical patent/FR2261351A1/fr
Application granted granted Critical
Publication of FR2261351B1 publication Critical patent/FR2261351B1/fr
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
FR7501951A 1974-02-19 1975-01-22 Expired FR2261351B1 (enrdf_load_html_response)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US443406A US3875029A (en) 1974-02-19 1974-02-19 Plating bath for electrodeposition of bright tin and tin-lead alloy

Publications (2)

Publication Number Publication Date
FR2261351A1 true FR2261351A1 (enrdf_load_html_response) 1975-09-12
FR2261351B1 FR2261351B1 (enrdf_load_html_response) 1979-09-28

Family

ID=23760674

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7501951A Expired FR2261351B1 (enrdf_load_html_response) 1974-02-19 1975-01-22

Country Status (7)

Country Link
US (1) US3875029A (enrdf_load_html_response)
JP (1) JPS581195B2 (enrdf_load_html_response)
BR (1) BR7500985A (enrdf_load_html_response)
CA (1) CA1046976A (enrdf_load_html_response)
ES (1) ES434856A1 (enrdf_load_html_response)
FR (1) FR2261351B1 (enrdf_load_html_response)
SE (1) SE419104B (enrdf_load_html_response)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3977949A (en) * 1975-07-07 1976-08-31 Columbia Chemical Corporation Acidic plating bath and additives for electrodeposition of bright tin
US4207148A (en) * 1975-11-28 1980-06-10 Minnesota Mining And Manufacturing Company Electroplating bath for the electrodeposition of tin and tin/cadmium deposits
US4135991A (en) * 1977-08-12 1979-01-23 R. O. Hull & Company, Inc. Bath and method for electroplating tin and/or lead
US4376018A (en) * 1979-12-31 1983-03-08 Bell Telephone Laboratories, Incorporated Electrodeposition of nickel
US4379738A (en) * 1979-12-31 1983-04-12 Bell Telephone Laboratories, Incorporated Electroplating zinc
US4263106A (en) * 1979-12-31 1981-04-21 Bell Telephone Laboratories, Incorporated Solder plating process
US4377448A (en) * 1979-12-31 1983-03-22 Bell Telephone Laboratories, Incorporated Electrolytic gold plating
US4377449A (en) * 1979-12-31 1983-03-22 Bell Telephone Laboratories, Incorporated Electrolytic silver plating
SE8204505L (sv) * 1981-09-08 1983-03-09 Occidental Chem Co Elektropletering for avsettning av tenn-blylegeringar pa olika underlag
US5094726B1 (en) * 1981-09-11 1993-12-21 I. Nobel Fred Limiting tin sludge formation in tin or tin/lead electroplating solutions
US5066367B1 (en) * 1981-09-11 1993-12-21 I. Nobel Fred Limiting tin sludge formation in tin or tin/lead electroplating solutions
US4871429A (en) * 1981-09-11 1989-10-03 Learonal, Inc Limiting tin sludge formation in tin or tin/lead electroplating solutions
US4586990A (en) * 1982-03-15 1986-05-06 Gsp Metals & Chemicals Corporation Chelating metals
EP0103638A1 (en) * 1982-03-15 1984-03-28 GSP METALS & CHEMICALS CORPORATION Chelating metals
US4530741A (en) * 1984-07-12 1985-07-23 Columbia Chemical Corporation Aqueous acid plating bath and brightener composition for producing bright electrodeposits of tin
US4582576A (en) * 1985-03-26 1986-04-15 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
US4816070A (en) * 1985-08-29 1989-03-28 Techo Instruments Investments Ltd. Use of immersion tin and alloys as a bonding medium for multilayer circuits
US4715894A (en) * 1985-08-29 1987-12-29 Techno Instruments Investments 1983 Ltd. Use of immersion tin and tin alloys as a bonding medium for multilayer circuits
US5174887A (en) * 1987-12-10 1992-12-29 Learonal, Inc. High speed electroplating of tinplate
EP0652306B1 (en) * 1987-12-10 2000-09-27 LeaRonal, Inc. Tin, lead or tin/lead alloy electrolytes for high-speed electroplating
WO1992004484A1 (en) * 1989-04-20 1992-03-19 Tokin Corporation Electroplating bath using organic solvent for plating permanent magnet of r2t14b intermetallic compound
US4885064A (en) * 1989-05-22 1989-12-05 Mcgean-Rohco, Inc. Additive composition, plating bath and method for electroplating tin and/or lead
US5698087A (en) * 1992-03-11 1997-12-16 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
US5545440A (en) * 1994-12-05 1996-08-13 At&T Global Information Solutions Company (Aka Ncr Corporation) Method and apparatus for polymer coating of substrates
US5597469A (en) * 1995-02-13 1997-01-28 International Business Machines Corporation Process for selective application of solder to circuit packages
US5814202A (en) * 1997-10-14 1998-09-29 Usx Corporation Electrolytic tin plating process with reduced sludge production

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL134963C (enrdf_load_html_response) * 1963-08-28
NL128321C (enrdf_load_html_response) * 1965-02-13
US3785939A (en) * 1970-10-22 1974-01-15 Conversion Chem Corp Tin/lead plating bath and method

Also Published As

Publication number Publication date
ES434856A1 (es) 1976-12-01
US3875029A (en) 1975-04-01
SE7501711L (enrdf_load_html_response) 1975-08-20
CA1046976A (en) 1979-01-23
JPS581195B2 (ja) 1983-01-10
BR7500985A (pt) 1976-11-16
DE2506158B2 (de) 1976-12-02
SE419104B (sv) 1981-07-13
JPS50118934A (enrdf_load_html_response) 1975-09-18
DE2506158A1 (de) 1975-08-21
AU7620874A (en) 1976-06-10
FR2261351B1 (enrdf_load_html_response) 1979-09-28

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Legal Events

Date Code Title Description
TP Transmission of property
ST Notification of lapse