FR2252390A1 - Polishing semi-conductor surfaces - with aq. suspension contg. zirconium silicate, sodium hypochlorite and pref sodium metasilicate - Google Patents
Polishing semi-conductor surfaces - with aq. suspension contg. zirconium silicate, sodium hypochlorite and pref sodium metasilicateInfo
- Publication number
- FR2252390A1 FR2252390A1 FR7438639A FR7438639A FR2252390A1 FR 2252390 A1 FR2252390 A1 FR 2252390A1 FR 7438639 A FR7438639 A FR 7438639A FR 7438639 A FR7438639 A FR 7438639A FR 2252390 A1 FR2252390 A1 FR 2252390A1
- Authority
- FR
- France
- Prior art keywords
- pref
- polishing
- suspension
- esp
- semi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000005498 polishing Methods 0.000 title abstract 5
- 239000000725 suspension Substances 0.000 title abstract 4
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 239000004115 Sodium Silicate Substances 0.000 title 1
- 239000005708 Sodium hypochlorite Substances 0.000 title 1
- SUKJFIGYRHOWBL-UHFFFAOYSA-N sodium hypochlorite Chemical compound [Na+].Cl[O-] SUKJFIGYRHOWBL-UHFFFAOYSA-N 0.000 title 1
- 235000019795 sodium metasilicate Nutrition 0.000 title 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 title 1
- 229910052911 sodium silicate Inorganic materials 0.000 title 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 title 1
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 abstract 1
- 238000005299 abrasion Methods 0.000 abstract 1
- 229910001854 alkali hydroxide Inorganic materials 0.000 abstract 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 239000003381 stabilizer Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US41922073A | 1973-11-26 | 1973-11-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR2252390A1 true FR2252390A1 (en) | 1975-06-20 |
Family
ID=23661310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7438639A Withdrawn FR2252390A1 (en) | 1973-11-26 | 1974-11-25 | Polishing semi-conductor surfaces - with aq. suspension contg. zirconium silicate, sodium hypochlorite and pref sodium metasilicate |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPS5084988A (enrdf_load_stackoverflow) |
| DE (1) | DE2454802A1 (enrdf_load_stackoverflow) |
| FR (1) | FR2252390A1 (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4057939A (en) * | 1975-12-05 | 1977-11-15 | International Business Machines Corporation | Silicon wafer polishing |
| DE3237235C2 (de) * | 1982-10-07 | 1986-07-10 | Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen | Verfahren zum Polieren von III-V-Halbleiteroberflächen |
| JPS61192783A (ja) * | 1985-02-22 | 1986-08-27 | Lion Corp | 清掃研摩基材 |
-
1974
- 1974-10-12 JP JP11685674A patent/JPS5084988A/ja active Pending
- 1974-11-19 DE DE19742454802 patent/DE2454802A1/de active Pending
- 1974-11-25 FR FR7438639A patent/FR2252390A1/fr not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5084988A (enrdf_load_stackoverflow) | 1975-07-09 |
| DE2454802A1 (de) | 1975-05-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RE | Withdrawal of published application |