FR2230751B1 - - Google Patents
Info
- Publication number
- FR2230751B1 FR2230751B1 FR7408794A FR7408794A FR2230751B1 FR 2230751 B1 FR2230751 B1 FR 2230751B1 FR 7408794 A FR7408794 A FR 7408794A FR 7408794 A FR7408794 A FR 7408794A FR 2230751 B1 FR2230751 B1 FR 2230751B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US344887A US3864222A (en) | 1973-03-26 | 1973-03-26 | Baths for Electrodeposition of Gold and Gold Alloys and Method Therefore |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2230751A1 FR2230751A1 (fr) | 1974-12-20 |
FR2230751B1 true FR2230751B1 (fr) | 1977-03-04 |
Family
ID=23352496
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7408794A Expired FR2230751B1 (fr) | 1973-03-26 | 1974-03-08 |
Country Status (5)
Country | Link |
---|---|
US (1) | US3864222A (fr) |
CH (1) | CH609732A5 (fr) |
DE (1) | DE2413736C2 (fr) |
FR (1) | FR2230751B1 (fr) |
GB (1) | GB1453212A (fr) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4088549A (en) * | 1976-04-13 | 1978-05-09 | Oxy Metal Industries Corporation | Bright low karat silver gold electroplating |
US4186064A (en) * | 1977-07-20 | 1980-01-29 | Technic, Inc. | Method and electrolyte for electrodeposition of bright gold and gold alloys |
US4121982A (en) * | 1978-02-03 | 1978-10-24 | American Chemical & Refining Company Incorporated | Gold alloy plating bath and method |
CS217006B1 (en) * | 1980-08-01 | 1982-12-31 | Ivan Zehle | Galvanic gilding bath |
US4396471A (en) * | 1981-12-14 | 1983-08-02 | American Chemical & Refining Company, Inc. | Gold plating bath and method using maleic anhydride polymer chelate |
DE3309397A1 (de) * | 1983-03-16 | 1984-09-20 | Degussa Ag, 6000 Frankfurt | Elektrolytisches bad zum abscheiden von niederkaraetigen, glaenzenden gold-silber-legierungsueberzuegen |
US4795534A (en) * | 1986-09-25 | 1989-01-03 | Vanguard Research Associates, Inc. | Electrolyte solution and process for gold electroplating |
US4857159A (en) * | 1987-03-25 | 1989-08-15 | The Standard Oil Company | Electrodeposition recovery method for metals in polymer chelates |
DE4111559C1 (en) * | 1991-04-05 | 1992-04-30 | Schering Ag Berlin Und Bergkamen, 1000 Berlin, De | Currentless bath for chemical deposition of copper@ (alloy) - contains polyethyleneimine deriv. and is formaldehyde-free |
US6682642B2 (en) | 2000-10-13 | 2004-01-27 | Shipley Company, L.L.C. | Seed repair and electroplating bath |
US20040077391A1 (en) * | 2000-12-29 | 2004-04-22 | Frank Nuovo | Casing for a mobile telephone |
US7693557B2 (en) * | 2000-12-29 | 2010-04-06 | Nokia Corporation | Method of producing a telephone device |
US20040109560A1 (en) * | 2000-12-29 | 2004-06-10 | Frank Nuovo | Method of producing a telephone device |
US20060237324A1 (en) * | 2003-05-21 | 2006-10-26 | Fred Hayward | Pulse plating process for deposition of gold-tin alloy |
WO2006078549A1 (fr) * | 2005-01-21 | 2006-07-27 | Technic, Inc. | Procede de placage par impulsions pour depot d'un alliage or/etain |
JP5513784B2 (ja) * | 2008-08-25 | 2014-06-04 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | 硬質金系めっき液 |
CN103741178B (zh) * | 2014-01-20 | 2017-06-16 | 厦门大学 | 一种用于硅表面直接电镀光滑致密银薄膜的溶液及电镀方法 |
CN106757200A (zh) * | 2016-11-15 | 2017-05-31 | 惠州市力道电子材料有限公司 | 一种无氰镀硬金的电镀液及其电镀方法 |
CN106521575A (zh) * | 2016-11-15 | 2017-03-22 | 惠州市力道电子材料有限公司 | 一种无氰镀软金的电镀液及其电镀方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2355070A (en) * | 1937-07-03 | 1944-08-08 | Little Inc A | Electrolytic deposition of metal |
US2660554A (en) * | 1950-11-10 | 1953-11-24 | Barnet D Ostrow | Bright gold and gold alloy plating baths |
US2967135A (en) * | 1960-06-08 | 1961-01-03 | Barnet D Ostrow | Electroplating baths for hard bright gold deposits |
BE754151A (fr) * | 1969-08-08 | 1970-12-31 | Sel Rex Corp | Bain aqueux pour le placage electrolytique d'or ou d'alliage d'or sur un article conducteur, procede de fabrication dudit bain aqueux et utilisation de celui-ci |
US3642589A (en) * | 1969-09-29 | 1972-02-15 | Fred I Nobel | Gold alloy electroplating baths |
US3672969A (en) * | 1970-10-26 | 1972-06-27 | Lea Ronal Inc | Electrodeposition of gold and gold alloys |
-
1973
- 1973-03-26 US US344887A patent/US3864222A/en not_active Expired - Lifetime
-
1974
- 1974-03-08 FR FR7408794A patent/FR2230751B1/fr not_active Expired
- 1974-03-18 CH CH370374A patent/CH609732A5/xx not_active IP Right Cessation
- 1974-03-21 DE DE2413736A patent/DE2413736C2/de not_active Expired
- 1974-03-26 GB GB1346274A patent/GB1453212A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
DE2413736A1 (de) | 1974-10-10 |
US3864222A (en) | 1975-02-04 |
GB1453212A (en) | 1976-10-20 |
CH609732A5 (fr) | 1979-03-15 |
DE2413736C2 (de) | 1983-01-27 |
FR2230751A1 (fr) | 1974-12-20 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |