FR2210886A3 - Plastics foil coated printed circuit board - with the coating on side to which components are to be attached - Google Patents

Plastics foil coated printed circuit board - with the coating on side to which components are to be attached

Info

Publication number
FR2210886A3
FR2210886A3 FR7344739A FR7344739A FR2210886A3 FR 2210886 A3 FR2210886 A3 FR 2210886A3 FR 7344739 A FR7344739 A FR 7344739A FR 7344739 A FR7344739 A FR 7344739A FR 2210886 A3 FR2210886 A3 FR 2210886A3
Authority
FR
France
Prior art keywords
attached
adhesive
coating
components
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7344739A
Other languages
English (en)
French (fr)
Other versions
FR2210886B3 (de
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Brown Boveri AG Switzerland
Original Assignee
BBC Brown Boveri AG Switzerland
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC Brown Boveri AG Switzerland filed Critical BBC Brown Boveri AG Switzerland
Publication of FR2210886A3 publication Critical patent/FR2210886A3/fr
Application granted granted Critical
Publication of FR2210886B3 publication Critical patent/FR2210886B3/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10575—Insulating foil under component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
FR7344739A 1972-12-18 1973-12-14 Plastics foil coated printed circuit board - with the coating on side to which components are to be attached Granted FR2210886A3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1827072A CH553530A (de) 1972-12-18 1972-12-18 Leiterplatte mit ein- oder doppelseitig aufgedruckten leiterbildern fuer ein- oder beidseitige bestueckung.

Publications (2)

Publication Number Publication Date
FR2210886A3 true FR2210886A3 (en) 1974-07-12
FR2210886B3 FR2210886B3 (de) 1975-03-21

Family

ID=4431749

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7344739A Granted FR2210886A3 (en) 1972-12-18 1973-12-14 Plastics foil coated printed circuit board - with the coating on side to which components are to be attached

Country Status (2)

Country Link
CH (1) CH553530A (de)
FR (1) FR2210886A3 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE441050B (sv) * 1984-02-03 1985-09-02 Ericsson Telefon Ab L M Transientskyddsenhet

Also Published As

Publication number Publication date
FR2210886B3 (de) 1975-03-21
CH553530A (de) 1974-08-30

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